Abstract: A system and method for data filtering and transmission management are provided. In particular, disclosed is a method of transmission management for data acquired by a remote monitor having a sensor. The method comprises the steps of: defining an initial trend envelope having a window around a forecast trend gradient, the window defined by an initial upper bound and an initial lower bound; and processing a set of data points acquired by the sensor, to identify any data points outside the initial trend envelope. When a point is identified outside the initial trend envelope, the method: (i) transmits an event data packet to a central server; and (ii) identifies a subsequent trend envelope based on a trend gradient derived from a preceding set of data points, said preceding set of points including an identified point from the event data packet.

Abstract: The present invention relates to a household heat recovery device and more specifically to a wastewater heat recovery unit, which absorbs residual heat from the water flowing onto the floor and down the drain of an ordinary household shower or bathtub unit. In one embodiment, the heat recovery device adapts for ease-of-use and enables quick set-up in most existing and typical showers or bathtubs without any tools and without coupling to the existing plumbing. Internal passages direct the effluent shower water through a serpentine path to a discharge drain. Over time, the heat transferred from the water to the device then radiates into the environment—thus reducing the total energy cost for a household by reducing the thermal load on the main heating unit for the household.

Abstract: Semiconductor device processing and methods for dicing a semiconductor wafer into a plurality of individual dies that can have back surface metallization are described. The methods comprise providing a wafer with pre-diced streets in the wafer's front surface, applying a sidewall masking mechanism to the front surface of the wafer so as to substantially fill the pre-diced streets, thinning the back surface of the wafer so as to dice the wafer (e.g., by grinding, etching, or both) and expose a portion of the sidewall masking mechanism from the back surface of the wafer, and applying a material, such as metal, to the back surface of the diced wafer. These methods can prevent the metal from being deposited on die sidewalls and may allow the separation of individual dies without causing the metal to peel from the back surface of one or more adjacent dies. Other embodiments are also described.

Abstract: Semiconductor device processing and methods for dicing a semiconductor wafer into a plurality of individual dies that can have back surface metallization are described. The methods comprise providing a wafer with pre-diced streets in the wafer's front surface, applying a sidewall masking mechanism to the front surface of the wafer so as to substantially fill the pre-diced streets, thinning the back surface of the wafer so as to dice the wafer (e.g., by grinding, etching, or both) and expose a portion of the sidewall masking mechanism from the back surface of the wafer, and applying a material, such as metal, to the back surface of the diced wafer. These methods can prevent the metal from being deposited on die sidewalls and may allow the separation of individual dies without causing the metal to peel from the back surface of one or more adjacent dies. Other embodiments are also described.

Abstract: The present invention relates to a household heat recovery device and more specifically to a wastewater heat recovery unit, which absorbs residual heat from the water flowing onto the floor and down the drain of an ordinary household shower or bathtub unit. In one embodiment, the heat recovery device adapts for ease-of-use and enables quick set-up in most existing and typical showers or bathtubs without any tools and without coupling to the existing plumbing. Internal passages direct the effluent shower water through a serpentine path to a discharge drain. Over time, the heat transferred from the water to the device then radiates into the environment—thus reducing the total energy cost for a household by reducing the thermal load on the main heating unit for the household.