Abstract: A heat sink assembly for removing heat from an electronic component includes a retention clip having a central body and a securing member extending from the central member. The central member has an opening there through, and the securing member is configured to secure the retention clip relative to the electronic component. A heat sink has a base member received through the opening when the heat sink is mounted to the retention clip, and the base member has an engagement surface configured to engage a heat generating surface of the electronic component. A locking mechanism secures the heat sink to the retention clip. The locking mechanism includes a ramp member and a ramp engaging member, wherein the ramp member has a positive stop provided therein. The positive stop provides a tactual indication when the heat sink is fully secured to the retention clip.

Abstract: A heat sink assembly includes a base having first and second surfaces, and a dimension therebetween extending substantially perpendicular to each of the first and second surfaces. The base includes an opening extending therethrough and an insert received in the opening, wherein the insert has opposite first and second surfaces separated by a distance substantially equal to the dimension. The base is fabricated from a first material and the insert is fabricated from a second material. Optionally, the base may be fabricated from aluminum, and the insert may be fabricated from copper. Additionally, the base may be substantially rectangular, and the insert may be substantially circular, wherein the base surrounds the insert.

Abstract: A heat sink assembly for cooling a heat generating integrated circuit (IC) component is provided. The assembly includes a heat sink base positioned adjacent the IC component and a thermal interface member positioned between the heat sink base and the IC component. The interface member has a first surface in abutting engagement with the heat sink base and an opposite second surface in abutting engagement with an outer surface of a lid on the IC component. The first and second surfaces each include a plurality of protrusions to increase a number of contact points between the interface member and the heat sink base and between the interface member and the outer surface of the lid to facilitate a transfer of heat from the IC component to the heat sink base.

Abstract: A thermal management system for an IC device mounted on a circuit board is provided. The system includes a socket housing and an array of power contacts disposed within the housing. The power contacts deliver power to an underside of the IC device and generate heat at the underside of the IC device. A heat conducting interface conveys heat from the underside of the IC device to a heat sink positioned above the IC device.

Abstract: An apparatus for cooling memory modules installed in adjacent sockets on a circuit board is provided. The apparatus includes a fan for directing cooling air through air gaps between adjacent memory modules. The air gaps extend in a longitudinal direction from a first end of the modules to an opposite second end of the modules. The cooling air in adjacent air gaps moves in opposite directions from the first end of the memory modules to the second end of the memory modules.

Abstract: A heat sink assembly for a circuit board component is provided. that includes a heat sink base, a frame coupled to the base, and a cam positionable relative to the base to lock the heat sink base to the circuit board component. The frame includes an actuator that has a first post and a second post. Each post has an upper end, a lower end, and a shaft portion therebetween. The lower end includes a retention lug. A cross beam interconnects the shaft portions of the posts. The frame further includes a board lock and the cam includes a lever coupled to the cam. The cam engages the actuator to move the actuator relative to the frame from a first position to a second position to lock the heat sink base to the circuit board component. The heat sink remains in the locked position when the lever is rotated from the second position to the first position.