Abstract: Airflow-based heat dissipation is described. A heat sink includes a housing with a first chamber and a second chamber separated by an interface located below the first chamber. The first chamber has sidewalls with first side ports and an access opening. Pins extend from a top surface of the interface into the first chamber. The top surface of the interface has dimples located between the pins and first passageways which extend from the dimples of the top surface to a bottom surface of the interface. The second chamber has a network of tunnels with ends that extend to the sidewalls to provide second side ports. The first passageways extend to the network of tunnels.

Abstract: A heat dissipation device with a fluid cavity that utilizes a hybrid of star pins with concave surfaces and sharp edges, and truncated dimples, which creates turbulence and a vortex phenomenon perpendicular to fluid flow transmission, and increases the heat transfer coefficient without increasing restriction of fluid flow through the device. This process increases the heat transfer along local pins which are located around each truncated dimple. This effect allows the use of taller pins than previous devices thus increasing the surface of heat transfer and thus these pins have a more efficient heat transfer coefficient along the total length of the pin, not possible previously. Star pins with sharp edges prevent the distortion of the highly efficient vortex flow which increases fluid flow and simultaneously intensifies the desired phenomena of extraordinary turbulence.