Patents by Inventor Craig J. Weinman

Craig J. Weinman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Two material high K thermal encapsulant system
    Patent number: 10475715
    Abstract: Some embodiments relate to an electronic package. The electronic package includes a first die and a second die stacked onto the first die. A first encapsulant is positioned between the first die and the second die. The first encapsulant includes a first material that covers a first volume between the first die and the second die. A second encapsulant is positioned between the first die and the second die. The second encapsulant includes a second material that covers a second volume between the first die and the second die. The first material has a higher thermal conductivity than the second material, and the second material more effectively promotes electrical connections between the first die and the second die as compared to the first material.
    Type: Grant
    Filed: June 17, 2015
    Date of Patent: November 12, 2019
    Assignee: Intel Corporation
    Inventors: Venmathy McMahan, Sivakumar Nagarajan, Elah Bozorg-Grayeli, Amrita Mallik, Kuang-Han Chu, Liwei Wang, Nisha Ananthakrishnan, Craig J. Weinman, Amram Eitan
  • TWO MATERIAL HIGH K THERMAL ENCAPSULANT SYSTEM
    Publication number: 20170170088
    Abstract: Some embodiments relate to an electronic package. The electronic package includes a first die and a second die stacked onto the first die. A first encapsulant is positioned between the first die and the second die. The first encapsulant includes a first material that covers a first volume between the first die and the second die. A second encapsulant is positioned between the first die and the second die. The second encapsulant includes a second material that covers a second volume between the first die and the second die. The first material has a higher thermal conductivity than the second material, and the second material more effectively promotes electrical connections between the first die and the second die as compared to the first material.
    Type: Application
    Filed: June 17, 2015
    Publication date: June 15, 2017
    Inventors: Venmathy McMahan, Sivakumar Nagarajan, Elah Bozorg-Grayeli, Amrita Mallik, Kuang-Han Chu, Liwei Wang, Nisha Ananthakrishnan, Craig J. Weinman, Amram Eitan
  • FLUXING-ENCAPSULANT MATERIAL FOR MICROELECTRONIC PACKAGES ASSEMBLED VIA THERMAL COMPRESSION BONDING PROCESS
    Publication number: 20170042043
    Abstract: A fluxing-encapsulant material and method of use thereof in a thermal compression bonding (TCB) process is described. In an embodiment, the TCB process includes ramping the bond head to 250° C.-300° C. at a ramp rate of 50° C./second-100° C./second. In an embodiment, the fluxing-encapsulant material comprising one or more epoxy resins having an epoxy equivalent weight (EEW) of 150-1,000, a curing agent, and a fluxing agent having a mono-carboxylic acid or di-carboxylic acid and a pKa of 4-5.
    Type: Application
    Filed: October 21, 2016
    Publication date: February 9, 2017
    Inventors: SIVAKUMAR NAGARAJAN, SANDEEP RAZDAN, NISHA ANANTHAKRISHNAN, CRAIG J. WEINMAN, KABIRKUMAR J. MIRPURI
  • Fluxing-encapsulant material for microelectronic packages assembled via thermal compression bonding process
    Patent number: 9504168
    Abstract: A fluxing-encapsulant material and method of use thereof in a thermal compression bonding (TCB) process is described. In an embodiment, the TCB process includes ramping the bond head to 250° C.-300° C. at a ramp rate of 50° C./second-100° C./second. In an embodiment, the fluxing-encapsulant material comprising one or more epoxy resins having an epoxy equivalent weight (EEW) of 150-1,000, a curing agent, and a fluxing agent having a mono-carboxylic acid or di-carboxylic acid and a pKa of 4-5.
    Type: Grant
    Filed: September 30, 2011
    Date of Patent: November 22, 2016
    Inventors: Sivakumar Nagarajan, Sandeep Razdan, Nisha Ananthakrishnan, Craig J. Weinman, Kabirkumar J. Mirpuri
  • FLUXING-ENCAPSULANT MATERIAL FOR MICROELECTRONIC PACKAGES ASSEMBLED VIA THERMAL COMPRESSION BONDING PROCESS
    Publication number: 20130263446
    Abstract: A fluxing-encapsulant material and method of use thereof in a thermal compression bonding (TCB) process is described. In an embodiment, the TCB process includes ramping the bond head to 250° C.-300° C. at a ramp rate of 50° C./second-100° C./second. In an embodiment, the fluxing-encapsulant material comprising one or more epoxy resins having an epoxy equivalent weight (EEW) of 150-1,000, a curing agent, and a fluxing agent having a mono-carboxylic acid or di-carboxylic acid and a pKa of 4-5.
    Type: Application
    Filed: September 30, 2011
    Publication date: October 10, 2013
    Applicant: Intel Corporation
    Inventors: Sivakumar Nagarajan, Sandeep Razdan, Nisha Ananthakrishnan, Craig J. Weinman, Kabirkumar J. Mirpuri