Abstract: A method of forming recesses in a glass-based laminate, the method comprising: irradiating a portion of a first clad layer of a glass laminate with a pulsed laser beam, the glass-based laminate comprising the first clad layer, the irradiating producing an irradiated portion of the first clad layer and a non-irradiated portion of the first clad layer; and etching the first clad layer with an etchant that selectively etches the irradiated portion of the first clad layer relative to the non-irradiated portion of the first clad layer and selectively etches the irradiated portion of the first clad layer relative to the core layer, wherein irradiating with a pulsed laser beam is one of (1) irradiating with a focused pulsed laser beam producing damage or other physical or chemical alteration in the first clad layer to a depth not more than the first clad layer thickness and within 0.

Abstract: Disclosed are various embodiments of glass structures and the assembly of the same by way of laser welding. In one embodiment, the glass structures may comprise a lightweight mirror or other structure. In constructing a lightweight mirror, a core is assembled by creating laser welded joints between individual ones of a plurality of glass parts. At least one laser access opening is cut out in one or more of the glass parts or plates. In the assembling, various pairs of glass parts are positioned to create abutments therebetween. Further, a laser is directed through at least one laser access opening toward at least one of the abutments to create one or more of the laser welded joints.

Abstract: A method for processing a transparent workpiece including directing a laser beam in a first orientation along a first beam pathway where a first portion of the laser beam includes a first laser beam focal line and generates an induced absorption to produce a first defect segment within the transparent workpiece. The method further includes adjusting the laser beam to a second orientation along a second beam pathway where a second portion of the laser beam includes a second laser beam focal line and generates the induced absorption to produce a second defect segment within the transparent workpiece. Each of the first and second laser beam focal lines include a circular angular spectrum within the transparent workpiece; and at least one of the laser beam focal lines include an internal focal line angle of greater than 10° relative to a plane orthogonal to the impingement surface at the impingement location.

Abstract: A method for processing a transparent workpiece that includes directing a laser beam output by a beam source onto a phase-adjustment device such that the laser beam downstream the phase-adjustment device is an Airy beam and directing the Airy beam onto a surface of the transparent workpiece. The Airy beam forms an Airy beam focal region in the transparent workpiece, the Airy beam of the Airy beam focal region having a maximum intensity of 100 TW/cm2 or less, the Airy beam of the Airy beam focal region induces absorption in the transparent workpiece, the induced absorption producing a curved defect in the transparent workpiece.

Abstract: A method for processing a transparent workpiece that includes directing a laser beam into the transparent workpiece. A portion of the laser beam directed into the transparent workpiece comprises a laser beam focal line and generates an induced absorption to produce a defect within the transparent workpiece. The laser beam focal line includes a wavelength ?, a spot size wo, a Rayleigh range ZR that is greater than F D ? ? ? w o 2 ? , where FD is a value of 10 or greater, and an internal focal line angle of greater than 10°. The laser beam focal line further comprises a circular angular spectrum within the transparent workpiece and a plurality of rays. Each individual ray of the plurality of rays has a same phase, ?, when converging to form the circular angular spectrum within the transparent workpiece.

Abstract: A method of laser processing a transparent workpiece (160) includes directing a laser beam (112) into the transparent workpiece (160) wherein a portion of the laser beam (112) directed into the transparent workpiece (160) includes a laser beam focal column (113) and generates an induced absorption to produce a defect column (172) within the transparent workpiece (160), the laser beam focal column (113) having a radius of maximum beam intensity that is variable along a length of the laser beam focal column (113) such that the radius of maximum beam intensity has at least two non-zero angles of propagation with respect to a center line of the laser beam focal column (113) along the length of the laser beam focal column (113).

Abstract: The present disclosure relates to a process by which an optical fiber array or a single optical fiber is cleaved with a laser-cleaving apparatus. The coating material is stripped or removed from a section of an optical fiber array or single optical fiber; a coated or ribbonized section of the optical fiber array or the single optical fiber is secured in a holder; the holder is aligned inside the laser-cleaving apparatus; the laser cleaves the stripped ends of the fibers in the optical fiber array or the single optical fiber; the laser-cleaved ends of the optical fiber(s) are then mechanically separated to remove the free ends from the optical fibers in the optical fiber array or the single optical fiber, leaving a cleaved array of optical fibers or a single cleaved optical fiber. The cleaving process enables the optical fiber array or single optical fiber to be cleaved at flexible locations along an optical fiber ribbon, optical fiber, or optical fiber apparatus (e.g.

Abstract: A method for processing a transparent workpiece that includes directing a laser beam the transparent workpiece. The laser beam incident to the impingement surface has an oblong angular spectrum and portion of the laser beam directed into the transparent workpiece is a laser beam focal line and generates an induced absorption to produce a defect within the transparent workpiece. The laser beam focal line includes a wavelength ?, a spot size wo, a Rayleigh range ZR that is greater than F D ? ? ? ? w o 2 ? , where FD is a dimensionless divergence factor comprising a value of 10 or greater, and an internal beam angle of greater than 10° relative to a plane orthogonal to an impingement surface at an impingement location, such that the defect has a defect angle within the transparent workpiece of greater than 10° relative to a plane orthogonal to the impingement surface at the impingement location.

Abstract: The present disclosure relates to a process by which an optical fiber array is cleaved with a laser-cleaving apparatus. The coating material is stripped or removed from a section of an optical fiber array; a coated or ribbonized section of the optical fiber array is secured in a holder; the holder is aligned inside the laser-cleaving apparatus; the laser cleaves the stripped ends of the fibers in the optical fiber array; the laser-cleaved ends of the optical fibers are then mechanically separated to remove the free ends from the optical fibers in the optical fiber array, leaving a cleaved array of optical fibers. The cleaving process enables the optical fiber array to be cleaved at flexible locations along an optical fiber ribbon or optical fiber cable with no swelling, minimal cleave angle variation across the cores of the optical fibers, a controlled surface roughness of the optical fiber end-faces, and high process yield.

Abstract: A method of separating a substrate includes directing a laser beam into the substrate such that a focal line is formed with at least a portion of the laser beam focal line within a bulk of the substrate at an oblique angle with respect to a laser-incident surface of the substrate. The laser beam focal line is formed by a pulsed laser beam that is disposed along a beam propagation direction. The method further includes pulsing the pulsed laser beam from a first edge of the substrate to a second edge of the substrate in a single pass. The laser beam focal line generates an induced multi-photon absorption within the substrate that produces a damage track within the bulk of the substrate along the laser beam focal line, and the damage track is at an oblique angle relative to the laser-incident surface of the substrate.

Abstract: The present invention relates to a method of laser processing a glass substrate, the method comprising: focusing a pulsed laser beam into a laser beam focal line into the glass substrate, the glass substrate having a feature formed on a first surface of the glass substrate, wherein a first portion of the laser beam focal line is focused at the first surface of the glass substrate and a second portion of the laser beam focal line is focused at a second surface of the glass substrate that is opposite the first surface, wherein a first set of rays exiting the optical arrangement at a first radius R1, as measured from a center of the optical arrangement forms the first portion of the laser beam focal line with a deflection angle of ?1, wherein a second set of rays exiting the optical arrangement at a second radius R2, as measured from the center of the optical arrangement forms the second portion of the laser beam focal line with a deflection angle of ?2, wherein R1 is less than R2; and wherein ?1 is greater than

Abstract: The present disclosure relates to a process by which an optical fiber array is cleaved with a laser-cleaving apparatus. The coating material is stripped or removed from a section of an optical fiber array; a coated or ribbonized section of the optical fiber array is secured in a holder; the holder is aligned inside the laser-cleaving apparatus; the laser cleaves the stripped ends of the fibers in the optical fiber array; the laser-cleaved ends of the optical fibers are then mechanically separated to remove the free ends from the optical fibers in the optical fiber array, leaving a cleaved array of optical fibers. The cleaving process enables the optical fiber array to be cleaved at flexible locations along an optical fiber ribbon or optical fiber cable with no swelling, minimal cleave angle variation across the cores of the optical fibers, a controlled surface roughness of the optical fiber end-faces, and high process yield.

Abstract: A method of processing a transparent workpiece that includes directing a laser beam combination comprising a first beam and a second beam into the transparent workpiece simultaneously, the first beam passing through an impingement surface of the transparent workpiece at a first impingement location and the second beam passing through the impingement surface at a second impingement location. The first beam forms a first laser beam focal line in the transparent workpiece and generates a first induced absorption to produce a first defect segment within the transparent workpiece, the first defect segment having a first chamfer angle and the second beam forms a second laser beam focal line in the transparent workpiece and generates a second induced absorption to produce a second defect segment within the transparent workpiece, the second defect segment having a second chamfer angle, the second chamfer angle differing from the first chamfer angle.

Abstract: A method of joining glass substrates is disclosed. The method positions a first glass substrate onto a translational stage and a second glass substrate onto the first glass substrate. In some examples, a gap is defined by contact made between the first and second glass substrates. In such examples, the gap can be up to about 10 ?m. Additionally, in such examples, the method includes focusing a beam of light within the first glass substrate proximate to the gap. Further, in such examples, the method includes joining the first and second glass substrates to one another in a manner that closes the gap as a result of the focusing of the beam of light within the first glass substrate. In various examples, the first and second glass substrates each exhibit a transmittance of at least about 90% at a wavelength of the beam of light.

Abstract: The systems and methods disclosed herein utilize a beam-forming system configured to convert a Gaussian laser beam into an annular vortex laser beam having a relatively large depth of focus, which enables the processing of thick or stacked glass-based objects annular laser beam is defined in part by a topological charge m that defines an amount of rotation of the annular vortex beam around its central axis as it propagates annular vortex beam is used to form micro-holes in a glass-based object using either a one-step or a two-step method micro-holes formed by either process can be in the form of recesses or through-holes, depending on the application size of the micro-holes can be controlled by controlling the size of the annular vortex beam over the depth of focus range.

Abstract: An optical fiber carrying structure that includes a jacket is provided. The jacket includes a primary body portion formed from a first polymer material and one or more marking regions formed from a second polymer material. Indicia are formed in at least one of the marking regions. The indicia are formed from a laser-induced change to the second polymer material exposing the first polymer material.

Abstract: A method includes directing a laser beam onto a phase-adjustment device such that the laser beam downstream the phase-adjustment device is a modified Airy beam having a modified Airy beam focal region having a main lobe and a plurality of side lobes. The main lobe has a lobe aspect ratio of 1.2 or greater.

Abstract: A method for processing a transparent workpiece that includes directing a laser beam output by a beam source onto a phase-adjustment device such that the laser beam downstream the phase-adjustment device is an Airy beam and directing the Airy beam onto a surface of the transparent workpiece. The Airy beam forms an Airy beam focal region in the transparent workpiece, the Airy beam of the Airy beam focal region having a maximum intensity of 100 TW/cm2 or less, the Airy beam of the Airy beam focal region induces absorption in the transparent workpiece, the induced absorption producing a curved defect in the transparent workpiece.

Abstract: Apparatus can comprise a light source and a light guide plate. The light guide plate can comprise a plurality of features within an interior of the light guide plate. A feature of the plurality of features can comprise a first refractive index that is different from a refractive index of the light guide plate. A spacing between a pair of adjacent features of the plurality of features can be from about 20 micrometers to about 200 micrometers. The apparatus can be used to direct light out of the light guide plate with a peak radiance oriented from 0° to 30° from a direction normal to the first major surface of the light guide plate. Methods of making the apparatus can comprise emitting a burst of pulses from a laser. Methods can comprise focusing the burst of pulses into a line focus within the light guide plate.

Abstract: A method for processing a transparent workpiece including directing a laser beam in a first orientation along a first beam pathway where a first portion of the laser beam includes a first laser beam focal line and generates an induced absorption to produce a first defect segment within the transparent workpiece. The method further includes adjusting the laser beam to a second orientation along a second beam pathway where a second portion of the laser beam includes a second laser beam focal line and generates the induced absorption to produce a second defect segment within the transparent workpiece. Each of the first and second laser beam focal lines include a circular angular spectrum within the transparent workpiece; and at least one of the laser beam focal lines include an internal focal line angle of greater than 10° relative to a plane orthogonal to the impingement surface at the impingement location.