Patents by Inventor Craig L. Schultz

Craig L. Schultz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • EMI shield for transceiver
    Patent number: 7215558
    Abstract: An integrated circuit packages comprises a printed circuit board, a non-metal connector, and a metal casing. The printed circuit board includes a ground ring around the non-metal connector. The metal casing substantially encloses the printed circuit board, and has an opening that allows access to the non-metal connector. The metal casing has a metal lip that makes physical and electrical contact with the ground ring of the printed circuit board. The metal casing may be used to help reduce EMI from a transmitter.
    Type: Grant
    Filed: January 5, 2005
    Date of Patent: May 8, 2007
    Assignee: Intel Corporation
    Inventors: Craig L. Schultz, Todd Micheal Petit, Joshua T. Oen
  • EMI shield for transceiver
    Patent number: 6980439
    Abstract: An integrated circuit packages comprises a printed circuit board, a non-metal connector, and a metal casing. The printed circuit board includes a ground ring around the non-metal connector. The metal casing substantially encloses the printed circuit board, and has an opening that allows access to the non-metal connector. The metal casing has a metal lip that makes physical and electrical contact with the ground ring of the printed circuit board. The metal casing may be used to help reduce EMI from a transmitter.
    Type: Grant
    Filed: December 27, 2001
    Date of Patent: December 27, 2005
    Assignee: Intel Corporation
    Inventors: Craig L. Schultz, Todd Micheal Petit, Joshua T. Oen