Patents by Inventor Craig M. Clasper

Craig M. Clasper has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10822682
    Abstract: A method for heat-treating a titanium alloy, such as Ti-6Al-4V. The method may occur after or include a step of forging the titanium alloy such that localized, highly deformed grains are formed in the titanium alloy. Then the method may include steps of recrystallization annealing the titanium alloy by heating the titanium alloy to a temperature in a range between 30° F. to 200° F. below beta transus of the titanium alloy for 1 hour to 6 hours and then furnace cooling of the titanium alloy to 1200° F. to 1500° F. at a rate of 50° F. to 500° F. per hour. Following the recrystallization annealing, the method may include beta annealing the titanium alloy. These steps may be performed in a single heat treating cycle.
    Type: Grant
    Filed: October 4, 2018
    Date of Patent: November 3, 2020
    Assignee: Spirit AeroSystems, Inc.
    Inventors: Rahbar Nasserrafi, Gerald E. Hicks, Michael A. Walker, Craig M. Clasper
  • Publication number: 20190032184
    Abstract: A method for heat-treating a titanium alloy, such as Ti-6Al-4V. The method may occur after or include a step of forging the titanium alloy such that localized, highly deformed grains are formed in the titanium alloy. Then the method may include steps of recrystallization annealing the titanium alloy by heating the titanium alloy to a temperature in a range between 30° F. to 200° F. below beta transus of the titanium alloy for 1 hour to 6 hours and then furnace cooling of the titanium alloy to 1200° F. to 1500° F. at a rate of 50° F. to 500° F. per hour. Following the recrystallization annealing, the method may include beta annealing the titanium alloy. These steps may be performed in a single heat treating cycle.
    Type: Application
    Filed: October 4, 2018
    Publication date: January 31, 2019
    Applicant: Spirit AeroSystems, Inc.
    Inventors: Rahbar Nasserrafi, Gerald E. Hicks, Michael A. Walker, Craig M. Clasper
  • Patent number: 10094013
    Abstract: A method for heat-treating a titanium alloy, such as Ti-6Al-4V. The method may occur after or include a step of forging the titanium alloy such that localized, highly deformed grains are formed in the titanium alloy. Then the method may include steps of recrystallization annealing the titanium alloy by heating the titanium alloy to a temperature in a range between 30° F. to 200° F. below beta transus of the titanium alloy for 1 hour to 6 hours and then furnace cooling of the titanium alloy to 1200° F. to 1500° F. at a rate of 50° F. to 500° F. per hour. Following the recrystallization annealing, the method may include beta annealing the titanium alloy. These steps may be performed in a single heat treating cycle.
    Type: Grant
    Filed: December 17, 2015
    Date of Patent: October 9, 2018
    Assignee: Spirit AeroSystems, Inc.
    Inventors: Rahbar Nasserrafi, Gerald E. Hicks, Michael A. Walker, Craig M. Clasper
  • Publication number: 20170175241
    Abstract: A method for heat-treating a titanium alloy, such as Ti-6Al-4V. The method may occur after or include a step of forging the titanium alloy such that localized, highly deformed grains are formed in the titanium alloy. Then the method may include steps of recrystallization annealing the titanium alloy by heating the titanium alloy to a temperature in a range between 30° F. to 200° F. below beta transus of the titanium alloy for 1 hour to 6 hours and then furnace cooling of the titanium alloy to 1200° F. to 1500° F. at a rate of 50° F. to 500° F. per hour. Following the recrystallization annealing, the method may include beta annealing the titanium alloy. These steps may be performed in a single heat treating cycle.
    Type: Application
    Filed: December 17, 2015
    Publication date: June 22, 2017
    Applicant: Spirit AeroSystems, Inc.
    Inventors: Rahbar Nasserrafi, Gerald E. Hicks, Michael A. Walker, Craig M. Clasper