Abstract: The purification of monoalkyl tin trialkoxides and monoalkyl tin triamides are described using fractional distillation and/or ultrafiltration. The purified compositions are useful as radiation sensitive patterning compositions or precursors thereof. The fractional distillation process has been found to be effective for the removal of metal impurities down to very low levels. The ultrafiltration processes have been found to be effective at removal of fine particulates. Commercially practical processing techniques are described.

Abstract: In the context of forming radiation patternable structures especially for EUV patterning, wafer structures are described comprising a substrate having a smooth top surface and a radiation sensitive organometallic coating having an average thickness of no more than 100 nm and no more than about 1 defect per square centimeter with a defect size of greater than 48 nm, evaluated with a 3 mm edge exclusion. Corresponding methods for forming a low defect coating comprise spin coating a purified radiation sensitive organometallic resist solution onto a wafer using a spin coater system comprising a delivery line and a delivery nozzle connected to the delivery line to form a coated wafer, and drying the coated wafer to form a radiation sensitive organometallic coating having no more than about 1 defect per square centimeter with a defect size of greater than 48 nm, evaluated with a 3 mm edge exclusion.

Abstract: The purification of monoalkyl tin trialkoxides and monoalkyl tin triamides are described using fractional distillation and/or ultrafiltration. The purified compositions are useful as radiation sensitive patterning compositions or precursors thereof. The fractional distillation process has been found to be effective for the removal of metal impurities down to very low levels. The ultrafiltration processes have been found to be effective at removal of fine particulates. Commercially practical processing techniques are described.

Abstract: The purification of monoalkyl tin trialkoxides and monoalkyl tin triamides are described using fractional distillation and/or ultrafiltration. The purified compositions are useful as radiation sensitive patterning compositions or precursors thereof. The fractional distillation process has been found to be effective for the removal of metal impurities down to very low levels. The ultrafiltration processes have been found to be effective at removal of fine particulates. Commercially practical processing techniques are described.

Abstract: The purification of monoalkyl tin trialkoxides and monoalkyl tin triamides are described using fractional distillation and/or ultrafiltration. The purified compositions are useful as radiation sensitive patterning compositions or precursors thereof. The fractional distillation process has been found to be effective for the removal of metal impurities down to very low levels. The ultrafiltration processes have been found to be effective at removal of fine particulates. Commercially practical processing techniques are described.

Abstract: The purification of monoalkyl tin trialkoxides and monoalkyl tin triamides are described using fractional distillation and/or ultrafiltration. The purified compositions are useful as radiation sensitive patterning compositions or precursors thereof. The fractional distillation process has been found to be effective for the removal of metal impurities down to very low levels. The ultrafiltration processes have been found to be effective at removal of fine particulates. Commercially practical processing techniques are described.

Abstract: The purification of monoalkyl tin trialkoxides and monoalkyl tin triamides are described using fractional distillation and/or ultrafiltration. The purified compositions are useful as radiation sensitive patterning compositions or precursors thereof. The fractional distillation process has been found to be effective for the removal of metal impurities down to very low levels. The ultrafiltration processes have been found to be effective at removal of fine particulates. Commercially practical processing techniques are described.

Abstract: In the context of forming radiation patternable structures especially for EUV patterning, wafer structures are described comprising a substrate having a smooth top surface and a radiation sensitive organometallic coating having an average thickness of no more than 100 nm and no more than about 1 defect per square centimeter with a defect size of greater than 48 nm, evaluated with a 3 mm edge exclusion. Corresponding methods for forming a low defect coating comprise spin coating a purified radiation sensitive organometallic resist solution onto a wafer using a spin coater system comprising a delivery line and a delivery nozzle connected to the delivery line to form a coated wafer, and drying the coated wafer to form a radiation sensitive organometallic coating having no more than about 1 defect per square centimeter with a defect size of greater than 48 nm, evaluated with a 3 mm edge exclusion.

Abstract: The purification of monoalkyl tin trialkoxides and monoalkyl tin triamides are described using fractional distillation and/or ultrafiltration. The purified compositions are useful as radiation sensitive patterning compositions or precursors thereof. The fractional distillation process has been found to be effective for the removal of metal impurities down to very low levels. The ultrafiltration processes have been found to be effective at removal of fine particulates. Commercially practical processing techniques are described.

Abstract: The purification of monoalkyl tin trialkoxides and monoalkyl tin triamides are described using fractional distillation and/or ultrafiltration. The purified compositions are useful as radiation sensitive patterning compositions or precursors thereof. The fractional distillation process has been found to be effective for the removal of metal impurities down to very low levels. The ultrafiltration processes have been found to be effective at removal of fine particulates. Commercially practical processing techniques are described.

Abstract: Provided herein are ecologically friendly waterproof fabrics that include a base fabric having a body-facing surface and an outward-facing surface, and a hydrophobic, waterproof barrier disposed on the outward-facing surface of the base fabric. The base fabric may be a wicking fabric or may be treated with a compound that enhances wicking, and the hydrophobic, waterproof barrier may include a plastic polymer, polyurethane, polyethylene, and/or polytetrafluoroethylene. The waterproof fabrics also may include an abrasion-resistant coating and/or a PFC-free durable water repellant (DWR) agent disposed on an outward-facing surface of the hydrophobic, waterproof barrier, and one or both of the abrasion-resistant coating and/or PFC-free DWR agent may be discontinuous. Also provided are methods of making a waterproof fabric.

Abstract: Provided herein are waterproof fabrics that include a base fabric having a body-facing surface and an outward-facing surface, and a hydrophobic, waterproof barrier disposed on the outward-facing surface of the base fabric, a seam through the waterproof fabric, and a waterproof tape disposed on an outward-facing surface of the hydrophobic, waterproof barrier and aligned to seal the seam against water ingress. The base fabric may be a wicking fabric or may be treated with a compound that enhances wicking, and the hydrophobic, waterproof barrier may include a plastic polymer, polyurethane, polyethylene, and/or polytetrafluoroethylene. The waterproof fabrics also may include an abrasion-resistant coating and/or a durable water repellant (DWR) agent disposed on an outward-facing surface of the hydrophobic, waterproof barrier, and one or both of the abrasion-resistant coating and/or DWR agent may be discontinuous. Also provided are methods of making a waterproof fabric.

Abstract: Provided herein are ecologically friendly waterproof fabrics that include a base fabric having a body-facing surface and an outward-facing surface, and a hydrophobic, waterproof barrier disposed on the outward-facing surface of the base fabric. The base fabric may be a wicking fabric or may be treated with a compound that enhances wicking, and the hydrophobic, waterproof barrier may include a plastic polymer, polyurethane, polyethylene, and/or polytetrafluoroethylene. The waterproof fabrics also may include an abrasion-resistant coating and/or a PFC-free durable water repellant (DWR) agent disposed on an outward-facing surface of the hydrophobic, waterproof barrier, and one or both of the abrasion-resistant coating and/or PFC-free DWR agent may be discontinuous. Also provided are methods of making a waterproof fabric.

Abstract: Provided herein are waterproof fabrics that include a base fabric having a body-facing surface and an outward-facing surface, and a hydrophobic, waterproof barrier disposed on the outward-facing surface of the base fabric, a seam through the waterproof fabric, and a waterproof tape disposed on an outward-facing surface of the hydrophobic, waterproof barrier and aligned to seal the seam against water ingress. The base fabric may be a wicking fabric or may be treated with a compound that enhances wicking, and the hydrophobic, waterproof barrier may include a plastic polymer, polyurethane, polyethylene, and/or polytetrafluoroethylene. The waterproof fabrics also may include an abrasion-resistant coating and/or a durable water repellant (DWR) agent disposed on an outward-facing surface of the hydrophobic, waterproof barrier, and one or both of the abrasion-resistant coating and/or DWR agent may be discontinuous. Also provided are methods of making a waterproof fabric.

Abstract: The described embodiments relate to slotted substrates. One exemplary method forms a feature into a substrate, at least in part, by directing a laser beam at the substrate. During at least a portion of said directing, the method supplies a conductive material proximate the substrate.

Abstract: A method of laser machining a substrate is provided. The method comprises directing laser energy at a first surface of the substrate, while providing an assist medium at the first surface of the substrate at least at approximately the area at which the laser energy is being directed. The assist medium is no longer provided prior to completion of formation of a feature in the substrate created utilizing the laser energy.

Abstract: The described embodiments relate to slotted substrates. One exemplary method forms a feature into a substrate, at least in part, by directing a laser beam at the substrate. During at least a portion of said directing, the method supplies a conductive material proximate the substrate.

Abstract: A method for creating a mandrel for electroforming orifice sheets with tapered bores is described. The method uses photo-imagable polymer or photoresist to create the desired profile. This is followed by electroforming a parent mandrel over which a mandrel-quality sheet of glass is melted. An array of pillars with defined location and shape is formed with a desired profile for the mandrel to be used for the electroforming process. The glass is then metalized. A photoresist mask is formed on the metalized glass and a dielectric is deposited onto the pillars.

Abstract: A method for creating a mandrel for electroforming orifice sheets with tapered bores is described. The method uses photo-imagable polymer or photoresist to create the desired profile. This is followed by electroforming a parent mandrel over which a mandrel-quality sheet of glass is melted. An array of pillars with defined location and shape is formed with a desired profile for the mandrel to be used for the electroforming process. The glass is then metalized. A photoresist mask is formed on the metalized glass and a dielectric is deposited onto the pillars.