Patents by Inventor Craig M. Randleman

Craig M. Randleman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • HIGH PERFORMANCE AIR COOLED HEAT SINKS USED IN HIGH DENSITY PACKAGING APPLICATIONS
    Publication number: 20020171139
    Abstract: A heat dissipation system and method for extracting heat from an integrated circuit device includes a thermally conductive post having substantially planar upper and lower surfaces, wherein the upper surface is disposed across from the lower surface, and wherein the lower surface is adapted to contact an integrated circuit device. A conductive heat exchange portion including an array of fins extends upwardly from the upper surface of the post where possible to allow components mounted on a printed circuit board to be positioned around the integrated circuit device. The heat exchange portion including the array has a chamber within to receive and house an air movement device so that the air introduced around the fins by the air movement device enhances the heat dissipation from the heat dissipation device.
    Type: Application
    Filed: May 18, 2001
    Publication date: November 21, 2002
    Applicant: Intel Corporation
    Inventors: Seri Lee, Lloyd L. Pollard, Craig M. Randleman
  • High performance air cooled heat sinks used in high density packaging applications
    Patent number: 6479895
    Abstract: A heat dissipation system and method for extracting heat from an integrated circuit device includes a thermally conductive post having substantially planar upper and lower surfaces, wherein the upper surface is disposed across from the lower surface, and wherein the lower surface is adapted to contact an integrated circuit device. A conductive heat exchange portion including an array of fins extends upwardly from the upper surface of the post where possible to allow components mounted on a printed circuit board to be positioned around the integrated circuit device. The heat exchange portion including the array has a chamber within to receive and house an air movement device so that the air introduced around the fins by the air movement device enhances the heat dissipation from the heat dissipation device.
    Type: Grant
    Filed: May 18, 2001
    Date of Patent: November 12, 2002
    Assignee: Intel Corporation
    Inventors: Seri Lee, Lloyd L. Pollard, II, Craig M. Randleman