Abstract: Top surface imaging by silylation of organic photoresists for use in lithographic techniques for the manufacture of microelectronic devices is improved by the use of certain mixtures of organosilane silylating agents. The mixture includes a monofunctional silane in combination with a di- or polyfunctional silane, selected such that the boiling points are the same or very close to each other to facilitate a vapor-phase reaction. Silylation with this mixture provides effective penetration of the silane into the resist without causing so much lowering of the glass transition temperature of the resist that the resist flows under the processing steps and distorts the pattern.

Abstract: A method for providing an inorganic substrate having improved adherence for polymeric films is disclosed. The method entails reacting at least one organosilane compound having at least one alkylsilyl moiety therein and at least one hydrolyzable group capable of reacting with the substrate to silylate the substrate. Hydrolyzable by-products from the reaction, if any, have a pH less than or equal to about 7.

Abstract: An integrated module with a heated reservoir to vaporize liquid for semiconductor processes with liquid sources is presented. Shut-off valves and a proportioning pressure valve for controlling the flow of the vapor from the reservoir are mounted on the module for simple conduction heating of the valves. A capacitance manometer also mounted to the module also has its own heating elements. Condensation of the vapor is avoided and consistence performance and reliability is obtained.

Abstract: An integrated module with a heated reservoir to vaporize liquid for semiconductor processes with liquid sources is presented. Shut-off valves and a proportioning pressure valve for controlling the flow of the vapor from the reservoir are mounted on the module for simple conduction heating of the valves. A capacitance manometer also mounted to the module also has its own heating elements. Condensation of the vapor is avoided and consistence performance and reliability is obtained.

Abstract: Novel compositions are provided for use in the vapor priming of substrates used in the preparation and production of microelectronic devices comprising a first component comprising an organosilane having a hydrolyzable silicon-nitrogen bond and a second component selected from the group consisting of a second organosilane different from the first component having a hydrolyzable silicon-nitrogen bond, a hydrocarbon, an ether, a disiloxane and an alkoxysilane in which all components have substantially the same boiling points at atmospheric pressure. These compositions which are vaporized and transported to an area of silylation on a substrate by an inert gas, silylate the substrate surface and provide for uniform successful coating with organic films. These organosilane mixtures allow for rapid vapor priming and silylation steps in the manufacture of microelectronic devices with successful subsequent coating of the substrates with uniform organic films.

Abstract: An integrated module with a heated reservoir to vaporize liquid for semiconductor processes with liquid sources is presented. Shut-off valves and a proportioning pressure valve for controlling the flow of the vapor from the reservoir are mounted on the module for simple conduction heating of the valves. A capacitance manometer also mounted to the module also has its own heating elements. Condensation of the vapor is avoided and consistence performance and reliability is obtained.

Abstract: An integrated module with a heated reservoir to vaporize liquid for semiconductor processes with liquid sources is presented. Shut-off valves and a proportioning pressure valve for controlling the flow of the vapor from the reservoir are mounted on the module for simple conduction heating of the valves. A capacitance manometer also mounted to the module also has its own heating elements. Condensation of the vapor is avoided and consistence performance and reliability is obtained.