Abstract: A voltage level converter circuit is presented that is capable of independently adjusting the falling edge and rising edge delays of the output signal. The circuit includes two separate transconductance amplifiers each biased independently. Each one of the transconductance amplifiers separately drives an output transistor. The circuit is particularly suited for converting ECL signals to CMOS logic levels.

Abstract: A circuit technique for improving power supply rejection of current mirror circuits having multiple outputs. An input reference current is preadjusted for error caused by power supply variations and then mirrored through a cascade of current mirror circuits. In one embodiment an opamp loop forces the output of a current mirror circuit to be substantially equal to the reference current. This current is then used in subsequent mirroring stages to obtain various outputs. The circuit eliminates the need for including an error-subtraction transistor at every output.

Abstract: A circuit technique for improving power supply rejection of current mirror circuits. An input reference current is mirrored through a cascade of current mirror circuits whereby an error current is generated that represents the amount of current variation caused by power supply variations. The error current is then replicated into a current summing circuit which cancels out the effect of the error current. The output current is thus substantially independent of power supply variations.

Abstract: A post-assembly trim of a monolithic IC is set forth wherein selected package pins can be employed to address the on-chip trim circuit. Then, after the trim is completed, the circuit is addressed to provide a disconnect of the coupling between the trim pins and the post assembly trim circuit of the IC, while leaving the pins fully usable for other purposes. This means that following the post-assembly trim the trim pins cannot accidentally be employed for further trimming and the packaged IC is user-proof. A circuit that employs zener zapping for both trimming and disconnect is detailed and the invention is clearly usable for plastic encapsulated devices. However, when cavity containing packages are involved it is shown that a combination of zener zapping and fuse blowing can be employed.

Abstract: A trim arrangement for adjusting a differential input stage in a BIFET.RTM. integrated circuit is presented wherein the trimming is done at wafer probing in the manufacturing process. Trim JFETs are invoked by means of reverse biased zener diodes which can be zapped thereby to achieve trimming in the conventional manner. The trim JFETs are ratioed in size so that the trim is V.sub.P compensated over a relatively broad range. An improved trim structure is presented wherein the offset trim is V.sub.P compensated and operated in a manner that renders its effect on the circuit constant and independent of the conventional load trim.