Abstract: Systems and methods for automated laser microdissection are disclosed including automatic slide detection, position detection of cutting and capture lasers, focus optimization for cutting and capture lasers, energy and duration optimization for cutting and capture lasers, inspection and second phase capture and/or ablation in a quality control station and tracking information for linking substrate carrier or output microdissected regions with input sample or slide.

Abstract: Systems and methods for automated laser microdissection are disclosed including automatic slide detection, position detection of cutting and capture lasers, focus optimization for cutting and capture lasers, energy and duration optimization for cutting and capture lasers, inspection and second phase capture and/or ablation in a quality control station and tracking information for linking substrate carrier or output microdissected regions with input sample or slide.

Abstract: Systems and methods for automated laser microdissection are disclosed including automatic slide detection, position detection of cutting and capture lasers, focus optimization for cutting and capture lasers, energy and duration optimization for cutting and capture lasers, inspection and second phase capture and/or ablation in a quality control station and tracking information for linking substrate carrier or output microdissected regions with input sample or slide.

Abstract: Systems and methods for automated laser microdissection are disclosed including automatic slide detection, position detection of cutting and capture lasers, focus optimization for cutting and capture lasers, energy and duration optimization for cutting and capture lasers, inspection and second phase capture and/or ablation in a quality control station and tracking information for linking substrate carrier or output microdissected regions with input sample or slide.

Abstract: Systems and methods for automated laser microdissection are disclosed including automatic slide detection, position detection of cutting and capture lasers, focus optimization for cutting and capture lasers, energy and duration optimization for cutting and capture lasers, inspection and second phase capture and/or ablation in a quality control station and tracking information for linking substrate carrier or output microdissected regions with input sample or slide.

Abstract: Systems and methods for automated laser microdissection are disclosed including automatic slide detection, position detection of cutting and capture lasers, focus optimization for cutting and capture lasers, energy and duration optimization for cutting and capture lasers, inspection and second phase capture and/or ablation in a quality control station and tracking information for linking substrate carrier or output microdissected regions with input sample or slide.

Abstract: Systems and methods for automated laser microdissection are disclosed including automatic slide detection, position detection of cutting and capture lasers, focus optimization for cutting and capture lasers, energy and duration optimization for cutting and capture lasers, inspection and second phase capture and/or ablation in a quality control station and tracking information for linking substrate carrier or output microdissected regions with input sample or slide.

Abstract: Systems and methods for automated laser microdissection are disclosed including automatic slide detection, position detection of cutting and capture lasers, focus optimization for cutting and capture lasers, energy and duration optimization for cutting and capture lasers, inspection and second phase capture and/or ablation in a quality control station and tracking information for linking substrate carrier or output microdissected regions with input sample or slide.

Abstract: Systems and methods for automated laser microdissection are disclosed including automatic slide detection, position detection of cutting and capture lasers, focus optimization for cutting and capture lasers, energy and duration optimization for cutting and capture lasers, inspection and second phase capture and/or ablation in a quality control station and tracking information for linking substrate carrier or output microdissected regions with input sample or slide.

Abstract: Systems and methods for automated laser microdissection are disclosed including automatic slide detection, position detection of cutting and capture lasers, focus optimization for cutting and capture lasers, energy and duration optimization for cutting and capture lasers, inspection and second phase capture and/or ablation in a quality control station and tracking information for linking substrate carrier or output microdissected regions with input sample or slide.

Abstract: A high-throughput light detection instrument and method are described. In some embodiments, switch mechanisms and optical relay structures permit different light sources and/or detectors to be selected for different applications. In other embodiments, switch mechanisms and optical paths permit top/bottom illumination and/or top/bottom detection, or combinations thereof.

Abstract: Parameters for controlling a drug infusion pump (10) are selected by scrolling through sets of predefined values. A value for either a rate and/or a volume of a fluid to be infused (VTBI) is displayed by pressing a quickset key (38) on a control panel (18) of the pump. Each time that the quickset key is depressed, the value appearing on a display (22) changes to the next value in the corresponding predefined set of values. It is also contemplated that holding the quickset key depressed for at least a predetermined time will cause the display to continuously scroll through successive values from the set of predefined values. The predefined values are selected in the set because they represent the most common values for the parameters used by the pump. An operator can "fine tune" the displayed value to a desired value that is not in the set of predefined values by pressing either a down arrow key (50) or an up arrow control key (52).

Abstract: A method and apparatus for determining leakage, particularly of valves, in a pump assembly. A pump assembly (20) includes a primary valve (34) and a secondary valve (36), which may be selectively activated to control the source of fluid input to the pump assembly. The pump assembly also includes an inlet valve (42) and an outlet valve (50) disposed on each side of the pumping chamber (46). Downstream of the outlet valve is disposed a pressure sensor (54), which produces a signal indicative of the pressure of fluid within the pump assembly at that point. Leakage in the inlet or outlet valves is detected in the inlet or outlet valves by filling the pumping chamber with fluid, closing the inlet and outlet valves, and equalizing the pressure in the pump assembly distal to the inlet valve. After the pressure has been equalized, the outlet valve is opened and a reference pulse is determined as a function of the signal produced by the pressure sensor.

Abstract: Risk of hydrodynamic pressure noise interference with a valve leakage test conducted upon a plurality of valves within a pump assembly is minimized. A pressure sensor within the pump assembly produces a signal indicative of hydrodynamic pressure in fluid distal of an outlet valve of the pump. The signal produced by the pressure sensor is input to a microcontroller that controls the pump assembly. Prior to conducting the valve leakage test, the hydrodynamic pressure level of the fluid is sampled at a frequency that is at least twice that of the hydrodynamic noise. The microcontroller determines if a maximum of the samples of the hydrodynamic pressure level taken during a data interval is above a predetermined threshold. If so, the valve leakage test is suppressed until the maximum pressure level is below the predetermined threshold during a successive data interval.

Abstract: A method of making wood shingle sidewall panels by assembling a lay-up having one layer of high-grade tapered wood shingles with a staggered butt edge, an intermediate layer of veneer and an opposite layer of low-grade wood shingles with an even butt edge and tapered opposite to the taper of the high-grade wood shingles; bonding the layers of the veneer; severing the panel blank so formed along a line located generally centrally between its opposite edges, thereby forming two sidewall panel blanks of a width approximately one-half the length of the shingles, one panel blank having staggered shingle butts and the other panel blank having even shingle butts; and thereafter cutting the panel blanks to length.

Abstract: A feed conveyor supplies resawn split shakes of varying thicknesses to an operator at a shake panel assembling machine. The operator arranges shakes in a row with the shake butts generally aligned and the sawn surfaces of the shakes laid on the upper surface of a backing strip to which thermosetting glue has been applied. The assembly of shakes and backing strip is conveyed by a carrier belt to a press station where a solid but readily deformable elastomer pad is pressed against the rough split upper surfaces of the shakes. The pressure of the pad on the shakes causes the pad to be deformed unevenly to conform to the split surfaces of the uneven and varying thickness shakes so that each shake and all portions of each shake are held in engagement with the backing strip under substantially the same pressure while the glue is set by dielectric heating. When the glue has set, the elastomer pad is released from the shakes and the completed assembly is conveyed by the carrier belt to a discharge conveyor.