Patents by Inventor Craig Spohr

Craig Spohr has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6649883
    Abstract: A method for calibrating a semiconductor wafer drying apparatus including a heater and a vessel containing a solvent and capable of receiving semiconductor wafers comprises selecting a test heater temperature and a test processing time. A first set of wafers is placed in the vessel and the heater is operated at the test heater temperature so that a solvent vapor cloud is created in the vessel. The first set of wafers is monitored for substantial envelopment by the vapor cloud during the test processing time. Based on the monitoring step, at least one of the test heater temperature and the test processing time is adjusted to establish at least one operating parameter of an operating heater temperature parameter and an operating processing time parameter for processing successive sets of wafers so as to promote substantial vapor cloud envelopment of each set of wafers dried in the drying apparatus.
    Type: Grant
    Filed: April 12, 2001
    Date of Patent: November 18, 2003
    Assignee: MEMC Electronic Materials, Inc.
    Inventors: Yoshio Iwamoto, James C. Lenk, Philip Schmidt, Craig Spohr, Leslie G. Stanton
  • Publication number: 20020148826
    Abstract: A method for calibrating a semiconductor wafer drying apparatus including a heater and a vessel containing a solvent and capable of receiving semiconductor wafers comprises selecting a test heater temperature and a test processing time. A first set of wafers is placed in the vessel and the heater is operated at the test heater temperature so that a solvent vapor cloud is created in the vessel. The first set of wafers is monitored for substantial envelopment by the vapor cloud during the test processing time. Based on the monitoring step, at least one of the test heater temperature and the test processing time is adjusted to establish at least one operating parameter of an operating heater temperature parameter and an operating processing time parameter for processing successive sets of wafers so as to promote substantial vapor cloud envelopment of each set of wafers dried in the drying apparatus.
    Type: Application
    Filed: April 12, 2001
    Publication date: October 17, 2002
    Inventors: Yoshio Iwamoto, James C. Lenk, Philip Schmidt, Craig Spohr, Leslie G. Stanton
  • Patent number: 6318389
    Abstract: A device for cleaning semiconductor wafers is provided. The device includes a carrier for holding wafers during the cleaning process. The carrier includes a frame with an open top and a plurality of carrier rods extending between opposite ends of the frame. The carrier rods have grooves that receive marginal edge portions of the wafers to retain them against movement in the carrier during cleaning and transportation. The grooves are structured to reduce the amount of contaminants remaining on the wafers after cleaning. The frame may be made substantially entirely of a polymeric material.
    Type: Grant
    Filed: October 29, 1999
    Date of Patent: November 20, 2001
    Assignee: MEMC Electronic Materials, Inc.
    Inventors: Philip R. Schmidt, Jon Seilkop, Craig Spohr