Abstract: Use of adsorption, desorption, particle injection and other means to excite electrons to a region on their band structure diagram near an inflection point were the transient effective mass is elevated proportional to the inverse of curvature. These transient heavy electrons may then cause transmutations similar to transmutations catalyzed by the muons used by Alvarez at UC Berkeley during 1956 in liquid hydrogen. The heavy electrons may also control chemical reactions.

Abstract: A binding reaction creates transient, elevated effective mass electron quasiparticles as surrogates for a heavier muon, to cause muon-catalyzed fusion transmutations with the surrogates and creates a composition of matter that enables neutralizing certain radioactive waste nuclei. Tailoring a junction of a device enhances the control of the surrogate's transient effective mass.

Abstract: An electrodeposited crystalline functional chromium deposit which is nanogranular as deposited, and the deposit may be both TEM and XRD crystalline or may be TEM crystalline and XRD amorphous. In various embodiments, the deposit includes one or any combination of two or more of an alloy of chromium, carbon, nitrogen, oxygen and sulfur; a {111} preferred orientation; an average crystal grain cross-sectional area of less than about 500 nm2; and a lattice parameter of 2.8895+/?0.0025 A. A process and an electrodeposition bath for electrodepositing the nanogranular crystalline functional chromium deposit on a substrate, including providing the electrodeposition bath including trivalent chromium, a source of divalent sulfur, a carboxylic acid, a source of nitrogen and being substantially free of hexavalent chromium; immersing a substrate in the bath; and applying an electrical current to electrodeposit the deposit on the substrate.

Abstract: An electroplating bath and a process for electrodepositing a crystalline chromium deposit on a substrate, in which the electroplating bath comprising trivalent chromium and a source of divalent sulfur, and substantially free of hexavalent chromium; immersing a substrate in the electroplating bath; and applying an electrical current to deposit a crystalline chromium deposit on the substrate, wherein the chromium deposit is crystalline as deposited, and/or has a lattice parameter of 2.8895+/?0.0025 ?, and/or the crystalline chromium deposit has a {111} preferred orientation.

Abstract: A crystalline chromium deposit having a lattice parameter of 2.8895+/?0.0025 ?, and an article including the crystalline chromium deposit. An article including a crystalline chromium deposit, wherein the crystalline chromium deposit has a {111} preferred orientation. A process for electrodepositing a crystalline chromium deposit on a substrate, including providing an electroplating bath comprising trivalent chromium and a source of divalent sulfur, and substantially free of hexavalent chromium; immersing a substrate in the electroplating bath; and applying an electrical current to deposit a crystalline chromium deposit on the substrate, wherein the chromium deposit is crystalline as deposited.

Abstract: A coated substrate and a process for forming the coated substrate, including a first lubricious coating layer overlying the substrate, the first lubricious coating layer including a first lubricant providing to the first lubricious coating layer a first coefficient of friction; and a second lubricious coating layer overlying the first lubricious coating layer, the second lubricious coating layer including a second lubricant providing to the second lubricious coating layer a second coefficient of friction, in which the second coefficient of friction is greater than the first coefficient of friction.

Abstract: An electrodeposited crystalline functional chromium deposit which is nanogranular as deposited, and the deposit may be both TEM and XRD crystalline or may be TEM crystalline and XRD amorphous. In various embodiments, the deposit includes one or any combination of two or more of an alloy of chromium, carbon, nitrogen, oxygen and sulfur; a {111} preferred orientation; an average crystal grain cross-sectional area of less than about 500 nm2; and a lattice parameter of 2.8895+/?0.0025 A. A process and an electrodeposition bath for electrodepositing the nanogranular crystalline functional chromium deposit on a substrate, including providing the electrodeposition bath including trivalent chromium, a source of divalent sulfur, a carboxylic acid, a source of nitrogen and being substantially free of hexavalent chromium; immersing a substrate in the bath; and applying an electrical current to electrodeposit the deposit on the substrate.

Abstract: An electroplating bath, a system, a process for, and the article obtained from, depositing a zinc-nickel ternary or higher alloy, a) zinc ions; b) nickel ions; and c) one or more ionic species selected from ions of Te+4, Bi+3 and Sb+3, and in some embodiments, further including one or more additional ionic species selected from ions of Bi+3, Sb+3, Ag+1, Cd+2, Co+2, Cr+3, Cu+2, Fe+2, In+3, Mn+2, Mo+6, P+3, Sn+2 and W+6. In some embodiments, the system includes a divider forming a cathodic chamber and an anodic chamber, with the electroplating bath in the cathodic chamber only. In various embodiments, the zinc-nickel ternary and higher alloys may provide improved properties to the conductive substrates upon which the alloys are deposited.

Abstract: A printed circuit board including electrical circuitry formed on an outer surface of the printed circuit board, the circuitry comprising copper or a copper alloy; a final finish on the circuitry, the final finish including a coating of tin on the copper or copper alloy circuitry; and an alloy cap layer on the tin coating, the alloy cap layer comprising at least two immersion-platable metals. The immersion platable metals in the alloy cap layer may be at least two metals selected from tin, silver, bismuth, copper, nickel, lead, zinc, indium, palladium, platinum, gold, cadmium, ruthenium and cobalt. The circuitry remains whisker free and solderable.

Abstract: This invention relates to a method of forming a substrate with preparing a surface capable of making a cocontinuous bond comprising the steps of 1) obtaining a copper or copper alloy substrate and 2) applying an etching composition which comprises (a) an acid, (b) an oxidizing agent, (c) a copper complexing agent, and (d) a copper complex, wherein the copper complex is present in an amount which precipitates when applied to the copper or copper alloy substrate. The method also includes the step of 3) treating the substrate with a coating composition and/or 4) applying a stripping composition to the substrate. The invention also relates to copper articles, having surface porosity, including multilayer articles such as printed circuit boards and compositions used in the method. The present invention provides microporous copper or copper alloy substrates which have improved adhesion properties to organic material.

Abstract: This invention relates to a method of forming a substrate with preparing a surface capable of making a cocontinuous bond comprising the steps of 1) obtaining a copper or copper alloy substrate and 2) applying an etching composition which comprises (a) an acid, (b) an oxidizing agent, (c) a copper complexing agent, and (d) a copper complex, wherein the copper complex is present in an amount which precipitates when applied to the copper or copper alloy substrate. The method also includes the step of 3) treating the substrate with a coating composition and/or 4) applying a stripping composition to the substrate. The invention also relates to copper articles, having surface porosity, including multilayer articles such as printed circuit boards and compositions used in the method. The present invention provides microporous copper or copper alloy substrates which have improved adhesion properties to organic material.

Abstract: The present invention relates to a process for treating a metal substrate to improve adhesion of polymeric materials thereto, comprising the steps of intergranular etching a surface of the metal substrate; and applying an immersion plated metal to the intergranular etched surface by immersing the surface in an immersion plating composition comprising one or more plating metals selected from tin, silver, bismuth, copper, nickel, lead, zinc, indium, palladium, platinum, gold, cadmium, ruthenium, cobalt, gallium and germanium. In one embodiment, the immersion plated metal is tin. In one embodiment, the process further comprises a step of adhering the immersion metal plated surface to a surface of a polymeric non-conductive material. In another embodiment, the polymeric nonconductive material is one or more of PTFE, an epoxy resin, a polyimide, a polycyanate ester, a butadiene terephthalate resin, or mixtures thereof.

Abstract: A printed circuit board including electrical circuitry formed on an outer surface of the printed circuit board, the circuitry comprising copper or a copper alloy; a final finish on the circuitry, the final finish including a coating of tin on the copper or copper alloy circuitry; and an alloy cap layer on the tin coating, the alloy cap layer comprising at least two immersion-platable metals. The immersion platable metals in the alloy cap layer may be at least two metals selected from tin, silver, bismuth, copper, nickel, lead, zinc, indium, palladium, platinum, gold, cadmium, ruthenium and cobalt. The circuitry remains whisker free and solderable.

Abstract: This invention relates to a method of forming a substrate with preparing a surface capable of making a cocontinuous bond comprising the steps of 1) obtaining a copper or copper alloy substrate and 2) applying an etching composition which comprises (a) an acid, (b) an oxidizing agent, (c) a copper complexing agent, and (d) a copper complex, wherein the copper complex is present in an amount which precipitates when applied to the copper or copper alloy substrate. The method also includes the step of 3) treating the substrate with a coating composition and/or 4) applying a stripping composition to the substrate. The invention also relates to copper articles, having surface porosity, including multilayer articles such as printed circuit boards and compositions used in the method. The present invention provides microporous copper or copper alloy substrates which have improved adhesion properties to organic material.

Abstract: This invention relates to a method of forming a substrate with preparing a surface capable of making a cocontinuous bond comprising the steps of 1) obtaining a copper or copper alloy substrate and 2) applying an etching composition which comprises (a) an acid, (b) an oxidizing agent, (c) a copper complexing agent, and (d) a copper complex, wherein the copper complex is present in an amount which precipitates when applied to the copper or copper alloy substrate. The method also includes the step of 3) treating the substrate with a coating composition and/or 4) applying a stripping composition to the substrate. The invention also relates to copper articles, having surface porosity, including multilayer articles such as printed circuit boards and compositions used in the method. The present invention provides microporous copper or copper alloy substrates which have improved adhesion properties to organic material.

Abstract: A process of preserving solderability and inhibiting tin whisker growth of exposed copper or copper alloy surfaces on a substrate comprises the steps of preparing an immersion tin plating solution substantially free of other immersion-platable metals; applying the immersion tin plating solution to the substrate to form a tin coating on the surfaces; preparing an immersion alloy plating solution containing at least two immersion-platable metals; applying the immersion alloy plating solution to the substrate by immersing the substrate in the immersion alloy plating solution to form an alloy cap layer on the tin coating. The immersion platable metals in the immersion alloy plating solution may be at least two metals selected from tin, silver, bismuth, copper, nickel, lead, zinc, indium, palladium, platinum, gold, cadmium, ruthenium and cobalt.

Abstract: This invention relates to a method of forming a substrate with preparing a surface capable of making a cocontinuous bond comprising the steps of 1) obtaining a copper or copper alloy substrate and 2) applying an etching composition which comprises (a) an acid, (b) an oxidizing agent, (c) a copper complexing agent, and (d) a copper complex, wherein the copper complex is present in an amount which precipitates when applied to the copper or copper alloy substrate. The method also includes the step of 3) treating the substrate with a coating composition and/or 4) applying a stripping composition to the substrate. The invention also relates to copper articles, having surface porosity, including multilayer articles such as printed circuit boards and compositions used in the method. The present invention provides microporous copper or copper alloy substrates which have improved adhesion properties to organic material.

Abstract: Silane compositions are described which comprise (A) a silane coupling agent; and (B) a tris(silylorgano)amine or alkane characterized by the formulae [(RO)3SiR1]3N  (I) or [(RO)3SiR1]3CR2  (II) wherein each R is independently an alkyl, alkoxyalkyl, aryl, aralkyl or cycloalkyl group of less than 20 carbon atoms; R1 is a divalent hydrocarbon or polyether group of less than 20 carbon atoms; and R2 is a functional group represented by CnH2nX wherein n is from 0 to 20 and X is selected from the group consisting of amino, amido, hydroxy, alkoxy, halo, mercapto, carboxy, acyl, vinyl, allyl, styryl, epoxy, isocyanato, glycidoxy, and acryloxy groups. The silane compositions of the present invention are adhesive compositions providing improved bonding of surfaces such as glass, metal and metal oxides to thermosetting resins. The silane compositions also exhibit improved moisture resistance.

Abstract: This invention relates to an aqueous etching composition for etching metallic copper comprising(a) an acid,(b) a copper complexing agent,(c) a metal capable of having a multiplicity of oxidation states which is present in one of its higher positive oxidation states and which metal forms a composition soluble salt, and(d) oxygen wherein the concentration of the higher positive oxidation state metal in the composition is greater than about 4 grams/liter of composition.The invention also relates to a process for etching metallic copper comprising contacting the surface of a copper substrate with the aqueous etching compositions of the invention. A method of regenerating a spent aqueous etching composition of the invention which has been used for etching metallic copper also is described.

Abstract: Silane compositions are described which comprise (A) a silane coupling agent; and (B) a tris(silylorgano)amine or alkane characterized by the formulae[(RO).sub.3 SiR.sup.1 ].sub.3 N (I)or[(RO).sub.3 SiR.sup.1 ].sub.3 CR.sup.2 (II)wherein each R is independently an alkyl, alkoxyalkyl, aryl, aralkyl or cycloalkyl group of less than 20 carbon atoms; R.sup.1 is a rivalent hydrocarbon or polyether group of less than 20 carbon atoms; and R.sup.2 is a functional group represented byC.sub.n H.sub.2a Xwherein n is from 0 to 20 and X is selected from the group consisting of amino, amido, hydroxy, alkoxy, halo, mercapto, carboxy, acyl, vinyl, allyl, styryl, epoxy, isocyanato, glycidoxy, and acryloxy groups. The silane compositions of the present invention are adhesive compositions providing improved bonding of surfaces such as glass, metal and metal oxides to thermosetting resins. The silane compositions also exhibit improved moisture resistance.