Abstract: A shielded I/O connector that supports high density connections. The shielded connector has a cage with channels. At least a first channel is configured to receive a transceiver such that it may be plugged into a port in a connector housing at an end of the cage. At least a second channel is configured to dissipate heat by enabling air to flow adjacent the transceiver. The rate of air flow in the second channel is increased with a channel in the connector housing that connects with the second channel. Air may exit the housing channel through openings in rear surfaces of the cage or through openings that bound the housing channel.

Abstract: A shielded I/O connector that supports high density connections. The shielded connector has a cage with channels. At least a first channel is configured to receive a transceiver such that it may be plugged into a port in a connector housing at an end of the cage. At least a second channel is configured to dissipate heat by enabling air to flow adjacent the transceiver. The rate of air flow in the second channel is increased with a diverter at the end of the second channel to smooth the flow of air through the second channel and out of one or more orifices. The diverter may be simply formed by shaping the housing of a connector at an end of the cage. The orifices may be formed by channel in the connector housing and openings in surfaces of the cage that bound the second channel or the housing channel.

Abstract: A shielded I/O connector that supports high density connections. The shielded connector has a cage with channels. At least a first channel is configured to receive a transceiver such that it may be plugged into a port in a connector housing at an end of the cage. At least a second channel is configured to dissipate heat by enabling air to flow adjacent the transceiver. The rate of air flow in the second channel is increased with a channel in the connector housing that connects with the second channel. Air may exit the housing channel through openings in rear surfaces of the cage or through openings that bound the housing channel.

Abstract: A shielded I/O connector that supports high density connections. The shielded connector has a cage with channels. At least a first channel is configured to receive a transceiver such that it may be plugged into a port in a connector housing at an end of the cage. At least a second channel is configured to dissipate heat by enabling air to flow adjacent the transceiver. The rate of air flow in the second channel is increased with a diverter at the end of the second channel to smooth the flow of air through the second channel and out of one or more orifices. The diverter may be simply formed by shaping the housing of a connector at an end of the cage. The orifices may be formed by channel in the connector housing and openings in surfaces of the cage that bound the second channel or the housing channel.

Abstract: A modular board to board mezzanine ball grid array BGA connector includes a plug, a receptacle and if needed an adapter. The plug and the receptacle can be made form the same base pieces to accommodate different stack heights. If a greater stack height is needed, spacers can be used in the plug and the receptacle to accommodates a greater selected stack height. The plug and the receptacle both include a base having an interstitial diamond recesses in which the solder balls are disposed and in which one end of a contact is inserted. The plug may further include a plug cover that can be connected to the base, and the receptacle may include a receptacle cover that fits over its base. The plug can have a plug contact assembly, and the receptacle can have a receptacle contact assembly. The plug and the receptacle can be mated by mating the plug cover to the receptacle cover and the receptacle contacts to the plug contacts.

Abstract: A modular board to board mezzanine ball grid array BGA connector includes a plug, a receptacle and if needed an adapter. The plug and the receptacle can be made form the same base pieces to accommodate different stack heights. If a greater stack height is needed, spacers can be used in the plug and the receptacle to accommodates a greater selected stack height. The plug and the receptacle both include a base having an interstitial diamond recesses in which the solder balls are disposed and in which one end of a contact is inserted. The plug may further include a plug cover that can be connected to the base, and the receptacle may include a receptacle cover that fits over its base. The plug can have a plug contact assembly, and the receptacle can have a receptacle contact assembly. The plug and the receptacle can be mated by mating the plug cover to the receptacle cover and the receptacle contacts to the plug contacts.

Abstract: A modular board to board mezzanine ball grid array BGA connector includes a plug, a receptacle and if needed an adapter. The plug and the receptacle can be made form the same base pieces to accommodate different stack heights. If a greater stack height is needed, spacers can be used in the plug and the receptacle to accommodates a greater selected stack height. The plug and the receptacle both include a base having an interstitial diamond recesses in which the solder balls are disposed and in which one end of a contact is inserted. The plug may further include a plug cover that can be connected to the base, and the receptacle may include a receptacle cover that fits over its base. The plug can have a plug contact assembly, and the receptacle can have a receptacle contact assembly. The plug and the receptacle can be mated by mating the plug cover to the receptacle cover and the receptacle contacts to the plug contacts.

Abstract: A modular board to board mezzanine ball grid array BGA connector includes a plug, a receptacle and if needed an adapter. The plug and the receptacle can be made form the same base pieces to accommodate different stack heights. If a greater stack height is needed, spacers can be used in the plug and the receptacle to accommodates a greater selected stack height. The plug and the receptacle both include a base having an interstitial diamond recesses in which the solder balls are disposed and in which one end of a contact is inserted. The plug may further include a plug cover that can be connected to the base, and the receptacle may include a receptacle cover that fits over its base. The plug can have a plug contact assembly, and the receptacle can have a receptacle contact assembly. The plug and the receptacle can be mated by mating the plug cover to the receptacle cover and the receptacle contacts to the plug contacts.

Abstract: A modular board to board mezzanine ball grid array BGA connector includes a plug, a receptacle and if needed an adapter. The plug and the receptacle can be made form the same base pieces to accommodate different stack heights. If a greater stack height is needed, spacers can be used in the plug and the receptacle to accommodates a greater selected stack height. The plug and the receptacle both include a base having an interstitial diamond recesses in which the solder balls are disposed and in which one end of a contact is inserted. The plug may further include a plug cover that can be connected to the base, and the receptacle may include a receptacle cover that fits over its base. The plug can have a plug contact assembly, and the receptacle can have a receptacle contact assembly. The plug and the receptacle can be mated by mating the plug cover to the receptacle cover and the receptacle contacts to the plug contacts.