Abstract: A curable silicone composition comprising: (A-1) a linear polysiloxane having DP from 25 to 10,000 and comprising from 2-25 R? groups; (A-2) a resin type polysiloxane containing units having structures (R3SiO1/2)a, (RSiO3/2)b, and (R?SiO3/2)c where R is alkyl, and R? is alkenyl; where a+b+c is from 0.90 to 1, and 0.2<a<0.5, 0.2<b<0.7, 0.02<c<0.3; (B) a crosslinker; and (C) 0.1-20 ppm of a hydrosilylation catalyst contained in a polysiloxane.

Abstract: This invention pertains to silsesquioxane resins useful in antireflective coatings wherein the silsesquioxane resin comprises the units (Ph(CH2)rSiO(3-x)/2(OR?)x)m (HSiO(3-x)/2(OR?)x)n (MeSiO(3-x)/2(OR?)x)o (RSiO(3-x)/2(OR?)x)p (R1SiO(3-x)/2(OR?)x)q where Ph is a phenyl group, Me is a methyl group; R? is hydrogen atom or a hydrocarbon group having from 1 to 4 carbon atoms; R is selected from a carboxylic acid group, a carboxylic acid forming group, and mixtures thereof; and R1 is selected from substituted phenyl groups, ester groups, polyether groups; mercapto groups, sulfur-containing organic functional groups, hydroxyl producing group, aryl sulphonic ester groups, and reactive or curable organic functional groups; and r has a value of 0, 1, 2, 3, or 4; x has a value of 0, 1 or 2; wherein in the resin m has a value of 0 to 0.90; n has a value of 0.05 to 0.99; o has a value of 0 to 0.95; p has a value of 0.01 to 0.5; q has a value of 0 to 0.5; and m+n+o+p+q?1.

Abstract: This invention pertains to silsesquioxane resins useful in antireflective coatings wherein the silsesquioxane resin comprises the units (Ph(CH2)rSiO(3-x)/2(OR?)x)m(HSiO(3-x)/2(OR?)x)n (MeSiO(3-x)/2(OR?)x)c, (RSiO(3-x)/2(OR?)x)p (R1SiO(3-x)/2(OR?)x)q where Ph is a phenyl group, Me is a methyl group; R? is hydrogen atom or a hydrocarbon group having from 1 to 4 carbon atoms; R is selected from a carboxylic acid group, a carboxylic acid forming group, and mixtures thereof; and R1 is selected from substituted phenyl groups, ester groups, polyether groups; mercapto groups, sulfur-containing organic functional groups, hydroxyl producing group, aryl sulphonic ester groups, and reactive or curable organic functional groups; and r has a value of 0, 1, 2, 3, or 4; x has a value of 0, 1 or 2; wherein in the resin m has a value of 0 to 0.90; n has a value of 0.05 to 0.99; o has a value of 0 to 0.95; p has a value of 0.01 to 0.5; q has a value of 0 to 0.5; and m+n+o+p+q?1.

Abstract: Antireflective coatings produced from silsesquioxane resin comprises the units (Ph(CH2)rSiO(3-x)/2(OR?)x)m (HSiO(3-x)/2(OR?)x)n (MeSiO(3-x)/2(OR?)x)o (RSiO(3-x)/2(OR?)x)p (R1SiO(3-x)/2(OR?)x)q where Ph is a phenyl group, Me is a methyl group; R? is hydrogen atom or a hydrocarbon group having from 1 to 4 carbon atoms; R is selected from a carboxylic acid group or a carboxylic acid forming group with the proviso that there is a sufficient amount of carboxylic acid groups to make the resin wet etchable after cure; and R1 is selected from substituted phenyl groups, ester groups, polyether groups; mercapto groups, sulfur-containing organic functional groups, hydroxyl producing group, aryl sulphonic ester groups, and reactive or curable organic functional groups; and r has a value of 0, 1, 2, 3, or 4; x has a value of 0, 1 or 2; wherein in the resin m has a value of 0 to 0.90; n has a value of 0.05 to 0.99; o has a value of 0 to 0.95; p has a value of 0.01 to 0.5; q has a value of 0 to 0.5; and m+n+o+p+q?1.

Abstract: A method of forming an antireflective coating on an electronic device comprising (A) applying to an electronic device an ARC composition comprising (i) a silsesquioxane resin having the formula (PhSiO(3-x)/2(OH)x)m HSiO(3-x)/2(OH)x)n(MeSiO(3-x)/2(OH)x)p where Ph is a phenyl group, Me is a methyl group, x has a value of 0, 1 or 2; m has a value of 0.05 to 0.95, n has a value of 0.05 to 0.95, p has a value of 0.05 to 0.95, and m+n+p?1; and (ii) a solvent; and (B) removing the solvent and curing the silsesquioxane resin to form an antireflective coating on the electronic device.

Abstract: Silicone resins comprising 5 to 50 mole % of (PhSiO3-x)/2(OH)x) units and 50 to 95 mole % (HSiO(3-x)/2(OH)x), where Ph is a phenyl group, x has a value of 0, 1 or 2 and wherein the cured silicone resin has a critical surface free energy of 30 dynes/cm or higher. These resins are useful as etch stop layers for organic dielectric materials having a critical surface free energy of 40 dynes/cm or higher.

Abstract: Silicone resins comprising 5 to 50 mole % of (PhSiO3−x)/2(OH)x) units and 50 to 95 mole % (HSiO(3−x)/2(OH)x), where Ph is a phenyl group, x has a value of 0, 1 or 2 and wherein the cured silicone resin has a critical surface free energy of 30 dynes/cm or higher. These resins are useful as etch stop layers for organic dielectric materials having a critical surface free energy of 40 dynes/cm or higher.