Patents by Inventor Creed Reilly

Creed Reilly has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated phased array (IPA) thermal subsystem fluid loop simulator
    Patent number: 12253439
    Abstract: The present application relates to systems, methods, and apparatus for facilitating the testing of a payload. An exemplary apparatus may include a fluid inlet port configured to receive fluid from a thermal subsystem of the payload. The apparatus may also include an actuating device configure to supply the fluid to a heat exchanger. A valve may be configured to receive the fluid from the heat exchanger and separate the fluid into a first fluid line and a second fluid line. A first fluid outlet port may be configured to supply the fluid to the thermal subsystem of the payload and a second fluid outlet port may be configured to supply the fluid to the thermal subsystem of payload.
    Type: Grant
    Filed: December 7, 2022
    Date of Patent: March 18, 2025
    Assignee: The Boeing Company
    Inventors: Creed Reilly, Gregory Kim, Jimmy Huynh, Kevin Nemeth
  • INTEGRATED PHASED ARRAY (IPA) THERMAL SUBSYSTEM FLUID LOOP SIMULATOR
    Publication number: 20240192094
    Abstract: The present application relates to systems, methods, and apparatus for facilitating the testing of a payload. An exemplary apparatus may include a fluid inlet port configured to receive fluid from a thermal subsystem of the payload. The apparatus may also include an actuating device configure to supply the fluid to a heat exchanger. A valve may be configured to receive the fluid from the heat exchanger and separate the fluid into a first fluid line and a second fluid line. A first fluid outlet port may be configured to supply the fluid to the thermal subsystem of the payload and a second fluid outlet port may be configured to supply the fluid to the thermal subsystem of payload.
    Type: Application
    Filed: December 7, 2022
    Publication date: June 13, 2024
    Inventors: Creed Reilly, Gregory Kim, Jimmy Huynh, Kevin Nemeth