Patents by Inventor Cristian Tabacutu

Cristian Tabacutu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Connector apparatus, and associated method, formed of material exhibiting physical-memory characteristics
    Patent number: 6617522
    Abstract: A connector, and an associated method, for connecting an electrical circuit component to a substrate, such as a printed circuit board. The connector is formed of one of more pin members formed of an electrically-conductive material which exhibits physical-memory characteristics. The pin member is initially configured into a memory configuration and thereafter reconfigured into an alternate reconfiguration. The alternate configuration is selected to facilitate mounting of the circuit component upon the substrate. Thereafter, the pin member is heated to beyond a deformation threshold temperature. When at such temperature, the pin member becomes reconfigured into the memory configuration. Through appropriate selection of the memory configuration, heating of the pin member causes connection of the circuit component with the substrate.
    Type: Grant
    Filed: May 30, 2001
    Date of Patent: September 9, 2003
    Assignee: Nokia Corporation
    Inventor: Cristian Tabacutu
  • Connector apparatus, and associated method, formed of material exhibiting physical-memory characteristics
    Publication number: 20020179326
    Abstract: A connector, and an associated method, for connecting an electrical circuit component to a substrate, such as a printed circuit board. The connector is formed of one of more pin members formed of an electrically-conductive material which exhibits physical-memory characteristics. The pin member is initially configured into a memory configuration and thereafter reconfigured into an alternate reconfiguration. The alternate configuration is selected to facilitate mounting of the circuit component upon the substrate. Thereafter, the pin member is heated to beyond a deformation threshold temperature. When at such temperature, the pin member becomes reconfigured into the memory configuration. Through appropriate selection of the memory configuration, heating of the pin member causes connection of the circuit component with the substrate.
    Type: Application
    Filed: May 30, 2001
    Publication date: December 5, 2002
    Inventor: Cristian Tabacutu