Patents by Inventor Crystal P. L. LI

Crystal P. L. LI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electroless copper plating compositions
    Patent number: 9869026
    Abstract: Electroless copper plating baths include alternative reducing agents to the conventional reducing agents currently used in the electroless plating industry. The electroless copper baths are stable and deposit a salmon bright copper deposit on substrates. Exclusion of many environmentally unfriendly conventional reducing agents enables environmentally friendly electroless copper plating baths.
    Type: Grant
    Filed: July 15, 2014
    Date of Patent: January 16, 2018
    Assignees: Rohm and Haas Electronic Materials LLC, Dow Global Technologies LLC
    Inventors: David S. Laitar, Crystal P. L. Li, Andy Lok-Fung Chow
  • Formaldehyde free electroless copper plating compositions and methods
    Patent number: 9809883
    Abstract: The copper electroless baths are formaldehyde free and are environmentally friendly. The electroless copper baths include one or more sulfinate compounds as reducing agents to replace formaldehyde. The electroless baths are stable and deposit a bright copper on substrates.
    Type: Grant
    Filed: July 10, 2015
    Date of Patent: November 7, 2017
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Andy Lok-Fung Chow, Dennis Kwok-Wai Yee, Crystal P. L. Li
  • Electroless copper plating compositions
    Patent number: 9702046
    Abstract: Electroless copper plating baths include alternative reducing agents to the conventional reducing agents currently used in the electroless plating industry. The electroless copper baths are stable and deposit a salmon bright copper deposit on substrates. Exclusion of many environmentally unfriendly conventional reducing agents enables environmentally friendly electroless copper plating baths.
    Type: Grant
    Filed: January 12, 2016
    Date of Patent: July 11, 2017
    Assignees: Dow Global Technologies LLC, Rohm and Haas Electronic Materials LLC
    Inventors: David S. Laitar, Crystal P. L. Li, Andy Lok-Fung Chow
  • Formaldehyde free electroless copper plating compositions and methods
    Patent number: 9611550
    Abstract: The copper electroless baths are formaldehyde free and are environmentally friendly. The electroless copper baths include one or more sulfinate compounds as reducing agents to replace formaldehyde. The electroless baths are stable and deposit a bright copper on substrates.
    Type: Grant
    Filed: February 17, 2013
    Date of Patent: April 4, 2017
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Andy Lok-Fung Chow, Dennis Kwok-Wai Yee, Crystal P. L. Li
  • FORMALDEHYDE-FREE ELECTROLESS METAL PLATING COMPOSITIONS AND METHODS
    Publication number: 20160145745
    Abstract: Formaldehyde-free electroless metal plating solutions include glyoxylic acid or salts thereof in combination with tertiary amines which stabilize the glyoxylic acid and salts. The electroless metal plating solutions are environmentally friendly, stable and deposit bright metal deposits on substrates.
    Type: Application
    Filed: November 24, 2014
    Publication date: May 26, 2016
    Inventors: Weigang WU, Crystal P. L. LI, Zhixiong LIANG
  • ELECTROLESS COPPER PLATING COMPOSITIONS
    Publication number: 20160122876
    Abstract: Electroless copper plating baths include alternative reducing agents to the conventional reducing agents currently used in the electroless plating industry. The electroless copper baths are stable and deposit a salmon bright copper deposit on substrates. Exclusion of many environmentally unfriendly conventional reducing agents enables environmentally friendly electroless copper plating baths.
    Type: Application
    Filed: January 12, 2016
    Publication date: May 5, 2016
    Inventors: David S. LAITAR, Crystal P. L. LI, Andy Lok-Fung CHOW
  • ELECTROLESS COPPER PLATING COMPOSITIONS
    Publication number: 20160017498
    Abstract: Electroless copper plating baths include alternative reducing agents to the conventional reducing agents currently used in the electroless plating industry. The electroless copper baths are stable and deposit a salmon bright copper deposit on substrates. Exclusion of many environmentally unfriendly conventional reducing agents enables environmentally friendly electroless copper plating baths.
    Type: Application
    Filed: July 15, 2014
    Publication date: January 21, 2016
    Inventors: David S. LAITAR, Crystal P. L. LI, Andy Lok-Fung CHOW
  • FORMALDEHYDE FREE ELECTROLESS COPPER PLATING COMPOSITIONS AND METHODS
    Publication number: 20150376795
    Abstract: The copper electroless baths are formaldehyde free and are environmentally friendly. The electroless copper baths include one or more sulfinate compounds as reducing agents to replace formaldehyde. The electroless baths are stable and deposit a bright copper on substrates.
    Type: Application
    Filed: July 10, 2015
    Publication date: December 31, 2015
    Inventors: Andy Lok-Fung Chow, Dennis Kwok-Wai Yee, Crystal P. L. Li
  • FORMALDEHYDE FREE ELECTROLESS COPPER PLATING COMPOSITIONS AND METHODS
    Publication number: 20140178572
    Abstract: The copper electroless baths are formaldehyde free and are environmentally friendly. The electroless copper baths include one or more sulfinate compounds as reducing agents to replace formaldehyde. The electroless baths are stable and deposit a bright copper on substrates.
    Type: Application
    Filed: February 17, 2013
    Publication date: June 26, 2014
    Applicant: ROHM AND HAAS ELECTRONIC MATERIALS LLC
    Inventors: Andy Lok-Fung CHOW, Dennis Kwok-Wai YEE, Crystal P. L. LI
  • PREPARING SUBSTRATES CONTAINING POLYMERS FOR METALLIZATION
    Publication number: 20110064870
    Abstract: Methods of swelling and topographically altering polymers of substrates using low foaming compositions are disclosed. Solvent swells which are stable, homogeneous and low foaming are applied to substrates containing polymers to swell and soften the polymers followed by applying an oxidizer to topographically alter and desmear the polymers in preparation for metallization of the substrate.
    Type: Application
    Filed: August 18, 2010
    Publication date: March 17, 2011
    Applicant: Rohm and Haas Electronic Materials LLC
    Inventors: Crystal P. L. LI, Dennis K. W. YEE, Michael CY TANG