Patents by Inventor CUI-CUI ZHANG

CUI-CUI ZHANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD
    Publication number: 20130240254
    Abstract: A printed circuit board includes a substrate, at least one pad on the substrate, and permanent mold coatings capable of coating on the copper foil. Each pad includes a copper foil and a solder resist coating on the substrate and surrounding the copper foil. The copper foil defines an opening. The opening is coated with solder resist, whereby the permanent mold coatings form a recess corresponding to the opening when coated on the copper foil. A method for manufacturing a printed circuit board is also provided.
    Type: Application
    Filed: August 1, 2012
    Publication date: September 19, 2013
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.
    Inventors: XIAO-ZHAN PENG, QIANG NIE, CUI-CUI ZHANG, JUN-CUI ZHANG