Patents by Inventor Cuidi MO

Cuidi MO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High-strength multi-functional coating with multi-level structure, and preparation method thereof
    Patent number: 12467146
    Abstract: A high-strength multi-functional coating with a multi-level structure, and a preparation method thereof are provided. In this application, a high-efficiency cladding method based on infrared laser-plasma synchronous compounding is adopted to prepare a micro-scale columnar crystal structure that is perpendicular to a substrate and serves as a pure thermally and electrically conductive channel, and to prepare submicro- and nano-scale ceramic reinforcement phases between columnar crystals, where the submicro- and nano-scale ceramic reinforcement phases are distributed along grain boundaries. The multi-level organizational structure of this application can simultaneously improve the hardness, wear resistance, and electrical and thermal conductivities of a cladding layer for a copper alloy and can improve the reliability of damage protection for a copper alloy component used in an extreme environment.
    Type: Grant
    Filed: December 5, 2024
    Date of Patent: November 11, 2025
    Assignees: Ocean University of China, Ningbo Branch of China Academy of Ordnance Science
    Inventors: Hongzhi Cui, Wei Huang, Feiya Liu, Guoliang Ma, Boyu Jiang, Cuidi Mo, Liukui Gong
  • HIGH-STRENGTH MULTI-FUNCTIONAL COATING WITH MULTI-LEVEL STRUCTURE, AND PREPARATION METHOD THEREOF
    Publication number: 20250230552
    Abstract: A high-strength multi-functional coating with a multi-level structure, and a preparation method thereof are provided. In this application, a high-efficiency cladding method based on infrared laser-plasma synchronous compounding is adopted to prepare a micro-scale columnar crystal structure that is perpendicular to a substrate and serves as a pure thermally and electrically conductive channel, and to prepare submicro- and nano-scale ceramic reinforcement phases between columnar crystals, where the submicro- and nano-scale ceramic reinforcement phases are distributed along grain boundaries. The multi-level organizational structure of this application can simultaneously improve the hardness, wear resistance, and electrical and thermal conductivities of a cladding layer for a copper alloy and can improve the reliability of damage protection for a copper alloy component used in an extreme environment.
    Type: Application
    Filed: December 5, 2024
    Publication date: July 17, 2025
    Inventors: Hongzhi CUI, Wei HUANG, Feiya LIU, Guoliang MA, Boyu JIANG, Cuidi MO, Liukui GONG