Abstract: A semiconductor package structure including a lead frame, a die, first and second electrical connection components and an encapsulation layer. The lead frame includes a supporting part and a circuit part spaced apart from each other. The die is disposed on the supporting part of the lead frame and electrically connected to the circuit part of the lead frame. The first electrical connection component includes a conductive adhesive disposed on and electrically connected to the circuit part of the lead frame. The second electrical connection component includes a conductive adhesive disposed on and electrically connected to the supporting part of the lead frame. The encapsulation layer surrounds the die. The conductive adhesives are disposed in the encapsulation layer. Opposite two lateral surfaces of the encapsulation layer expose the conductive adhesives, respectively.