Patents by Inventor Cuili Zhang

Cuili Zhang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240056736
    Abstract: The present disclosure provides a reinforcing part for a speaker diaphragm, the reinforcing part being an overlapped multilayer structure, the reinforcing part includes a heat dissipation layer as well as a first support layer and a second support layer that are fixed and bonded on surfaces of two sides of the heat dissipation layer respectively, and the first support layer and the second support layer each includes through holes penetrating the surfaces of two sides thereof, and the reinforcing part further includes fillers located within the through holes and configured for heat conduction, the fillers having thermal conductivity higher than that of the support layers.
    Type: Application
    Filed: December 20, 2018
    Publication date: February 15, 2024
    Applicant: Goertek lnc.
    Inventors: Yong Li, Cuili Zhang
  • Patent number: 11632629
    Abstract: The present disclosure provides a reinforcing part for a speaker diaphragm, a diaphragm and a speaker. The reinforcing part is an overlapped three-layer structure and comprises a support layer as well as a first heat dissipation layer and a second heat dissipation layer that are fixed and bonded on surfaces of two sides of the support layer respectively, the support layer comprises through holes penetrating surfaces of two sides thereof, and the reinforcing part further comprises fillers located within the through holes and configured for heat conduction, the fillers having thermal conductivity higher than that of the support layers.
    Type: Grant
    Filed: December 20, 2018
    Date of Patent: April 18, 2023
    Assignee: Goertek Inc.
    Inventors: Yong Li, Cuili Zhang
  • Patent number: 11575993
    Abstract: An embodiment relates to a speaker and a speaker module. The speaker comprises a vibration system and a magnetic circuit system; the vibration system comprises a diaphragm and a voice coil coupled to the diaphragm; a space between a front side of the diaphragm and a front sound cavity cover forms a front sound cavity, and a space between a back side of the diaphragm and a rear sound cavity cover forms a rear sound cavity; wherein the speaker further comprises a plurality of injection molding inserts disposed along a vibration direction of the diaphragm, and the injection molding insert comprises a first end and a second end; the first end is joined with a surface of the front sound cavity cover close to the diaphragm, and the second end is joined with a surface of the rear sound cavity cover close to the diaphragm.
    Type: Grant
    Filed: December 21, 2018
    Date of Patent: February 7, 2023
    Assignee: Goertek Inc.
    Inventors: Changlong Li, Jianxin Wang, Cuili Zhang, Yong Li, Zhixin Sang
  • Publication number: 20220369009
    Abstract: An acoustic device comprises a shell and a sound producing assembly, the shell being provided with an installation hole and a sound outlet, and the sound producing assembly being fixed inside the shell. The sound producing assembly has a diaphragm separating a cavity of the acoustic device into a front cavity and a back cavity, a first part of the shell corresponding to the front cavity and/or a second part of the shell corresponding to the back cavity is provided with sapphire glass covering the installation hole, and the front cavity is in communication with the outside of the acoustic device through the sound outlet.
    Type: Application
    Filed: December 30, 2019
    Publication date: November 17, 2022
    Applicant: Goertek Inc.
    Inventors: CUILI ZHANG, Feng Zhang, Guoqiang Chen, He Liang, Jianxin Wang
  • Publication number: 20220021981
    Abstract: The present disclosure provides a reinforcing part for a speaker diaphragm, a diaphragm and a speaker. The reinforcing part is an overlapped three-layer structure and comprises a support layer as well as a first heat dissipation layer and a second heat dissipation layer that are fixed and bonded on surfaces of two sides of the support layer respectively, the support layer comprises through holes penetrating surfaces of two sides thereof, and the reinforcing part further comprises fillers located within the through holes and configured for heat conduction, the fillers having thermal conductivity higher than that of the support layers.
    Type: Application
    Filed: December 20, 2018
    Publication date: January 20, 2022
    Applicant: Goertek Inc.
    Inventors: Yong Li, Cuili Zhang
  • Publication number: 20220007113
    Abstract: Disclosed are a reinforcing part for a speaker diaphragm, and the diaphragm. The reinforcing part is an overlapped multilayer structure, and includes a support layer and at least one heat dissipation layer fixed and bonded to a surface of at least one side of the support layer. The support layer includes through holes penetrating surfaces of two sides of the support layer. The reinforcing part further includes fillers located within the through holes and configured for heat conduction, the fillers having thermal conductivity higher than that of the support layer.
    Type: Application
    Filed: December 20, 2018
    Publication date: January 6, 2022
    Applicant: Goertek Inc.
    Inventors: Yong Li, Cuili Zhang
  • Publication number: 20210400390
    Abstract: Disclosed is a reinforcing part for a speaker diaphragm. The reinforcing part includes a body layer, and the body layer includes through-holes penetrating surfaces of two sides of the body layer. The reinforcing part further includes fillers located within the through holes and configured for heat conduction. The fillers have a thermal conductivity higher than that of the body layer. The reinforcing part of the present invention improves the heat conduction capability between two sides of a support layer by providing through holes on the support layer and providing a heat-conducting filler within the through holes.
    Type: Application
    Filed: December 20, 2018
    Publication date: December 23, 2021
    Applicant: Goertek lnc.
    Inventors: Yong Li, Cuili Zhang
  • Publication number: 20210266674
    Abstract: An embodiment relates to a speaker and a speaker module. The speaker comprises a vibration system and a magnetic circuit system; the vibration system comprises a diaphragm and a voice coil coupled to the diaphragm; a space between a front side of the diaphragm and a front sound cavity cover forms a front sound cavity, and a space between a back side of the diaphragm and a rear sound cavity cover forms a rear sound cavity; wherein the speaker further comprises a plurality of injection molding inserts disposed along a vibration direction of the diaphragm, and the injection molding insert comprises a first end and a second end; the first end is joined with a surface of the front sound cavity cover close to the diaphragm, and the second end is joined with a surface of the rear sound cavity cover close to the diaphragm.
    Type: Application
    Filed: December 21, 2018
    Publication date: August 26, 2021
    Applicant: GOERTEK INC.
    Inventors: Changlong Li, Jianxin Wang, Cuili Zhang, Yong Li, Zhixin Sang