Abstract: The present invention provides a thermal- and UV-curable (meth)acrylate composition comprising: (A) an epoxy resin, (B) a (meth)acrylate, (C) a photoinitiator, (D) a thiol curing agent, and (E) a catalyst mixture containing (e-1) an epoxy-adduct polyamine, (e-2) a microcapsule type hardener for an epoxy resin comprising a core and a shell, and (e-3) a urea-modified imidazole, wherein the weight ratio of the component (e-2) to the component (e-3) is not lower than 2.1. The present invention also provides a method for preparing the composition, a method for curing the composition, a cured product obtained from the composition or by the curing method, an article comprising the cured product, and a use of the composition or the cured product in assembling a camera module.

Abstract: The present invention provides an electrically conductive moisture-curable composition, a method of applying the composition, a cured product of the composition, an article comprising the cured product, and a use of the composition or the cured product wherein the composition comprises: (A) a polyfunctional silane compound having at least two alkoxysilane groups, (B) a moisture scavenger, (C) an alkoxysilane isocyanurate compound and optionally an epoxy functional silane coupling agent, (D) a photo-acid generator, which is a sulfonium salt, (E) a moisture-curing catalyst, and (F) an electrically conductive filler.