Patents by Inventor Cullen E. Bash

Cullen E. Bash has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6550263
    Abstract: A semiconductor chip cooling system having a body that forms a cavity configured to create a spray chamber when conformingly adjoined to a chip, or to a substrate or printed circuit board carrying one or more chips. The cooling system uses thermal inkjet sprayers to spray the chip(s) in the spray chamber with cooling fluid. The cooling system includes a combined reservoir and condenser. Liquid and gaseous cooling fluid travel or are pumped from the spray chamber to the reservoir. A controller transmits a control signal to the sprayer to cause the sprayer to spray at a rate leading to the cooling fluid being vaporized by the semiconductor device.
    Type: Grant
    Filed: August 31, 2001
    Date of Patent: April 22, 2003
    Assignee: HP Development Company L.L.P.
    Inventors: Chandrakant D. Patel, Cullen E. Bash
  • Publication number: 20030067745
    Abstract: A cooling system is configured to adjust cooling fluid flow to various racks located throughout a data center based upon the detected or anticipated temperatures at various locations throughout the data center. In one respect, by substantially increasing the cooling fluid flow to those racks dissipating greater amounts of heat and by substantially decreasing the cooling fluid flow to those racks dissipating lesser amounts of heat, the amount of energy required to operate the cooling system may be relatively reduced. Thus, instead of operating the devices, e.g., compressors, fans, etc., of the cooling system at substantially 100 percent of the anticipated heat dissipation from the racks, those devices may be operated according to the actual cooling needs.
    Type: Application
    Filed: October 5, 2001
    Publication date: April 10, 2003
    Inventors: Chandrakant D. Patel, Cullen E. Bash, Abdlmonem H. Beitelmal
  • Patent number: 6490877
    Abstract: System and method for reducing temperature variation among heat dissipating components in a multi-component computer system. In this respect, component temperatures are controlled to remain relatively constant (approximately within 5° C.) with respect to other components, while allowing for multiple fluctuating heat loads between components. A refrigeration system possessing a variable speed compressor or a constant speed compressor is utilized to control the flow of refrigerant through the refrigeration system. The temperature variation among components is reduced by independently metering the mass flow rate of the refrigerant flowing into each component to compensate for the amount of heat load on each component. In this respect, the mass flow rate of the refrigerant entering into each of the evaporators is metered by valves located upstream from each of the evaporators.
    Type: Grant
    Filed: February 13, 2002
    Date of Patent: December 10, 2002
    Assignee: Hewlett-Packard Company
    Inventors: Cullen E. Bash, Abdlmonem H Beitelmal, Ratnesh Sharma
  • Patent number: 6484521
    Abstract: A semiconductor chip cooling system configured with thermal inkjet type sprayers controlled by a control system. The control system can operate groups of the sprayers at different rates to controllably cool separate regions of a chip at different rates. A detection system is configured to separately detect the cooling regime occurring on the different regions of the chip by reflecting an optical beam off the chip in the region that is being sprayed.
    Type: Grant
    Filed: August 31, 2001
    Date of Patent: November 26, 2002
    Assignee: Hewlett-Packard Company
    Inventors: Chandrakant D. Patel, Cullen E. Bash
  • Publication number: 20020157820
    Abstract: System and method for reducing temperature variation among components in a multi-component system. In this respect, component temperatures are controlled to remain relatively constant (approximately within 5° C.) with respect to other components, while allowing for multiple fluctuating heat loads between components. A refrigeration system possessing a variable capacity (speed) compressor and an electronic valve is utilized to control the flow of refrigerant through the refrigeration system. The temperature of the components is reduced by metering the mass flow rate of the refrigerant cooling the components to compensate for the heat load applied to the refrigeration system.
    Type: Application
    Filed: April 30, 2001
    Publication date: October 31, 2002
    Inventors: Abdlmonem H. Beitelmal, Cullen E. Bash, Chandrakant D. Patel
  • Publication number: 20020157821
    Abstract: A system and method for reducing temperature variation among components in a multi-component system. In this respect, component temperatures are controlled to remain relatively constant (approximately within 5° C.) with respect to other components, while allowing for multiple fluctuating heat loads between components. A refrigeration system possessing a variable capacity (speed) compressor and a thermostatic expansion valve is utilized to control the flow of refrigerant through the refrigeration system. The temperatures of the components are reduced by metering the mass flow rate of the refrigerant cooling the components to compensate for the heat load applied to the refrigeration system. The temperature variation among the components is reduced by supplemental heaters independently providing heat to each respective component.
    Type: Application
    Filed: April 30, 2001
    Publication date: October 31, 2002
    Inventors: Abdlmonem H. Beitelmal, Cullen E. Bash, Chandrakant D. Patel
  • Publication number: 20020152761
    Abstract: A semiconductor chip cooling system configured with thermal inkjet type sprayers controlled by a control system. The control system can operate groups of the sprayers at different rates to controllably cool separate regions of a chip at different rates. A detection system is configured to separately detect the cooling regime occurring on the different regions of the chip by reflecting an optical beam off the chip in the region that is being sprayed.
    Type: Application
    Filed: May 31, 2002
    Publication date: October 24, 2002
    Inventors: Chandrakant D. Patel, Cullen E. Bash
  • Publication number: 20020124585
    Abstract: System and method for reducing temperature variation among heat dissipating components in a multi-component computer system. In this respect, component temperatures are controlled to remain relatively constant (approximately within 5° C.) with respect to other components, while allowing for multiple fluctuating heat loads between components. A refrigeration system possessing a variable speed compressor or a constant speed compressor is utilized to control the flow of refrigerant through the refrigeration system. The temperature variation among components is reduced by independently metering the mass flow rate of the refrigerant flowing into each component to compensate for the amount of heat load on each component. In this respect, the mass flow rate of the refrigerant entering into each of the evaporators is metered by valves located upstream from each of the evaporators.
    Type: Application
    Filed: February 13, 2002
    Publication date: September 12, 2002
    Inventors: Cullen E. Bash, Abdlmonem H. Beitelmal, Ratnesh Sharma
  • Publication number: 20020113141
    Abstract: A semiconductor chip cooling system having a body that forms a cavity configured to create a spray chamber when conformingly adjoined to a chip, or to a substrate or printed circuit board carrying one or more chips. Inkjet-type sprayers are configured to spray cooling fluid down on the chip. A controller transmits a control signal to the sprayer to cause the sprayer to spray at a rate leading to the cooling fluid being vaporized by the semiconductor device. The cooling system uses cooling fluid surface tension forces to draw liquid cooling fluid up a porous member from the spray chamber back to the sprayers, to be sprayed again. The cooling system uses gravity and/or pressure within the spray chamber to direct vaporized cooling fluid upward from the spray chamber to a condenser. The condenser is configured to cool and condense the vapor. A reservoir is positioned below the condenser and above the sprayers so as to receive condensed vapor from the condenser and feed it to the sprayers.
    Type: Application
    Filed: August 31, 2001
    Publication date: August 22, 2002
    Inventors: Christopher G. Malone, Cullen E. Bash, Chandrakant D. Patel
  • Publication number: 20020114139
    Abstract: A modular semiconductor chip cooling system having a readily openable enclosure defining a chamber configured to hold a printed circuit board carrying components to be cooled. The enclosure can include a reservoir, a condenser and a pump. Sprayers within the chamber are adjustably mounted on one or more brackets to allow each sprayer to be set for the individual height of its respective component. The enclosure can be readily removed from a computer system through a quick release connection. The computer system can include a condenser and pump to operate all its modular cooling systems, removing the condensing function from the individual modules.
    Type: Application
    Filed: December 14, 2001
    Publication date: August 22, 2002
    Inventors: Cullen E. Bash, Chandrakant D. Patel, Glenn C. Simon
  • Publication number: 20020114140
    Abstract: A modular semiconductor chip cooling system having a readily openable enclosure defining a chamber configured to hold a printed circuit board carrying components to be cooled. The enclosure can include a reservoir, a condenser and a pump. Sprayers within the chamber are adjustably mounted on one or more brackets to allow each sprayer to be set for the individual height of its respective component. The enclosure can be readily removed from a computer system through a quick release connection. The computer system can include a condenser and pump to operate all its modular cooling systems, removing the condensing function from the individual modules.
    Type: Application
    Filed: December 14, 2001
    Publication date: August 22, 2002
    Inventors: Cullen E. Bash, Chandrakant D. Patel, Glenn C. Simon
  • Publication number: 20020112496
    Abstract: A modular semiconductor chip cooling system having a readily openable enclosure defining a chamber configured to hold a printed circuit board carrying components to be cooled. The enclosure can include a reservoir, a condenser and a pump. Sprayers within the chamber are set in an array to spray a target area, and a controller controls which sprayers are activated based on information delineating the locations of the components to be cooled. The enclosure can be readily removed from a computer system through a quick release connection. The computer system can include a condenser and pump to operate all its modular cooling systems, removing the condensing function from the individual modules.
    Type: Application
    Filed: August 31, 2001
    Publication date: August 22, 2002
    Inventors: Cullen E. Bash, Chandrakant D. Patel
  • Publication number: 20020112497
    Abstract: A semiconductor chip cooling system configured with thermal inkjet type sprayers controlled by a control system. The control system can operate groups of the sprayers at different rates to controllably cool separate regions of a chip at different rates. A detection system is configured to separately detect the cooling regime occurring on the different regions of the chip by reflecting an optical beam off the chip in the region that is being sprayed.
    Type: Application
    Filed: August 31, 2001
    Publication date: August 22, 2002
    Inventors: Chandrakant D. Patel, Cullen E. Bash
  • Publication number: 20020112491
    Abstract: A cooling system for cooling one or more components that produce heat. The cooling system includes sprayers configured to spray cooling fluid toward the components. A detection system includes a radiation source and a radiation sensor that pass radiant energy in the vicinity of the component such that the radiant energy is affected by passing through the vaporizing spray coolant. A controller controls the flow rates of the sprayers in response to levels of radiant energy detected by the radiation sensor, allowing the controller to more accurately control the wall temperature and cooling regime achieved by the spray cooling. The source and sensor are aimable or otherwise configured for gathering information for different thermal zones of the component, providing the controller with information that is helpful in separately controlling the wall temperature and/or cooling regime in each zone.
    Type: Application
    Filed: August 31, 2001
    Publication date: August 22, 2002
    Inventors: Christopher G. Malone, Cullen E. Bash, Chandrakant D. Patel
  • Publication number: 20020112498
    Abstract: A modular semiconductor chip cooling system having a readily openable enclosure defining a chamber configured to hold a printed circuit board carrying components to be cooled. The enclosure can include a reservoir, a condenser and a pump. Sprayers within the chamber are adjustably mounted on one or more brackets to allow each sprayer to be set for the individual height of its respective component. The enclosure can be readily removed from a computer system through a quick release connection. The computer system can include a condenser and pump to operate all its modular cooling systems, removing the condensing function from the individual modules.
    Type: Application
    Filed: August 31, 2001
    Publication date: August 22, 2002
    Inventors: Cullen E. Bash, Abdlmonem H. Beitelmal, Chandrakant D. Patel
  • Publication number: 20020113142
    Abstract: A semiconductor chip cooling system having a body that forms a cavity configured to create a spray chamber when conformingly adjoined to a chip, or to a substrate or printed circuit board carrying one or more chips. The cooling system uses thermal inkjet sprayers to spray the chip(s) in the spray chamber with cooling fluid. The cooling system includes a combined reservoir and condenser. Liquid and gaseous cooling fluid travel or are pumped from the spray chamber to the reservoir. A controller transmits a control signal to the sprayer to cause the sprayer to spray at a rate leading to the cooling fluid being vaporized by the semiconductor device.
    Type: Application
    Filed: August 31, 2001
    Publication date: August 22, 2002
    Inventors: Chandrakant D. Patel, Cullen E. Bash
  • Patent number: 6415619
    Abstract: System and method for reducing temperature variation among heat dissipating components in a multi-component computer system. In this respect, component temperatures are controlled to remain relatively constant (approximately within 5° C.) with respect to other components, while allowing for multiple fluctuating heat loads between components. A refrigeration system possessing a variable speed compressor or a constant speed compressor is utilized to control the flow of refrigerant through the refrigeration system. The temperature variation among components is reduced by independently metering the mass flow rate of the refrigerant flowing into each component to compensate for the amount of heat load on each component. In this respect, the mass flow rate of the refrigerant entering into each of the evaporators is metered by valves located upstream from each of the evaporators.
    Type: Grant
    Filed: March 9, 2001
    Date of Patent: July 9, 2002
    Assignee: Hewlett-Packard Company
    Inventors: Cullen E. Bash, Abdlmonem H Beitelmal, Ratnesh Sharma
  • Patent number: 6349554
    Abstract: A spray cooling system for semiconductor devices. An ink-jet type spray device sprays droplets of a cooling fluid onto the semiconductor devices. The devices vaporize the liquid, which gets passed through a roll bond panel, or other heat exchanger, and is pumped into a spring loaded reservoir that feeds the spray device.
    Type: Grant
    Filed: December 11, 2000
    Date of Patent: February 26, 2002
    Assignee: Hewlett-Packard Company
    Inventors: Chandrakant D. Patel, Cullen E. Bash
  • Publication number: 20010002541
    Abstract: A spray cooling system for semiconductor devices. An ink-jet type spray device sprays droplets of a cooling fluid onto the semiconductor devices. The devices vaporize the liquid, which gets passed through a roll bond panel, or other heat exchanger, and is pumped into a spring loaded reservoir that feeds the spray device.
    Type: Application
    Filed: December 11, 2000
    Publication date: June 7, 2001
    Inventors: Chandrakant D. Patel, Cullen E. Bash