Patents by Inventor Cun Bok Jeong

Cun Bok Jeong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for manufacturing light emitting diode package
    Patent number: 10593850
    Abstract: A method for manufacturing a light emitting diode package comprises: arranging a first solder and a second solder between a substrate and a light emitting diode; and subjecting the first solder and the second solder to heat treatment to bond the substrate and the light emitting diode. The heat treatment comprises: increasing the temperature of the first and second solders from room temperature to a temperature Tp; maintaining the temperature Tp; and lowering the temperature Tp. The heating step comprises: a first ramping step of increasing a temperature from room temperature to a temperature TA at a constant speed; a pre-heating step of increasing the temperature from the temperature TA to a temperature TB to impart fluidity to the first and second solders; and a second ramping step of increasing the temperature from the TB to TL at a constant speed.
    Type: Grant
    Filed: January 11, 2018
    Date of Patent: March 17, 2020
    Assignee: SEOUL VIOSYS CO., LTD.
    Inventors: Jong Hyeon Chae, Yeon Cheol Cho, Cun Bok Jeong, Hyoung Jin Lim
  • METHOD FOR MANUFACTURING LIGHT EMITTING DIODE PACKAGE
    Publication number: 20180138382
    Abstract: A method for manufacturing a light emitting diode package comprises: arranging a first solder and a second solder between a substrate and a light emitting diode; and subjecting the first solder and the second solder to heat treatment to bond the substrate and the light emitting diode. The heat treatment comprises: increasing the temperature of the first and second solders from room temperature to a temperature Tp; maintaining the temperature Tp; and lowering the temperature Tp. The heating step comprises: a first ramping step of increasing a temperature from room temperature to a temperature TA at a constant speed; a pre-heating step of increasing the temperature from the temperature TA to a temperature TB to impart fluidity to the first and second solders; and a second ramping step of increasing the temperature from the TB to TL at a constant speed.
    Type: Application
    Filed: January 11, 2018
    Publication date: May 17, 2018
    Inventors: Jong Hyeon Chae, Yeon Cheol Cho, Cun Bok Jeong, Hyoung Jin Lim