Patents by Inventor Cun-Hong DENG

Cun-Hong DENG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • BUFFER MODULE AND ELECTRONIC DEVICE USING THE SAME
    Publication number: 20230240025
    Abstract: A buffer module including a base, a buffer element and an elastic element is provided. The base has a groove. The buffer element includes a spherical body movably disposed in the groove. The elastic element is disposed between a bottom surface of the groove and the spherical body.
    Type: Application
    Filed: December 8, 2022
    Publication date: July 27, 2023
    Inventors: Cun-Hong DENG, Ming-Te LIN, Chi-Ming TSAI