Patents by Inventor Cun Wang

Cun Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240199804
    Abstract: Provided is a method for producing at least one type of thermoplastic resin selected from polycarbonate, polyester and polyester carbonate. The method includes a step of subjecting a dihydroxy compound and diaryl carbonate and/or dicarboxylic acid ester to melt polycondensation in the presence of a transesterification catalyst selected from a compound represented by formula (1) and/or formula (2). In formula (1), R1 to R24 are each a hydrogen atom, an alkyl group having 1-10 carbon atoms or a cycloalkyl group. Some of the carbon atoms may be substituted by heteroatoms. Among R1 to R24, alkyl groups or the like substituted on the same N atom may bond to each other to form a ring. The values of a to d are each 0 or 1. X? is a monovalent anion. In formula (2), Ar1 to Ar12 are each a substituted or unsubstituted aryl group. M? is a monovalent anion.
    Type: Application
    Filed: March 15, 2022
    Publication date: June 20, 2024
    Applicants: Mitsubishi Chemical Corporation, Agency For Science, Technology & Research
    Inventors: Shohei Tomita, Toshiki Monden, Mitsunobu Ito, Cun Wang, Martin Van Meurs, Boon Ying Tay
  • Publication number: 20220320477
    Abstract: A battery cell includes an electrode assembly. A shape of a radial cross section of the electrode assembly is an ellipse. A length of a major axis noted as L1 and a length of a minor axis noted as L2 of the electrode assembly satisfy a relational expression: 0.3 mm?L1?L2?0.5 mm.
    Type: Application
    Filed: March 28, 2022
    Publication date: October 6, 2022
    Applicant: Ningde Amperex Technology Limited
    Inventors: Cun Wang, Jiao Tian, Yujiang Xu
  • Publication number: 20140102687
    Abstract: A thermal interface material includes a low melting point metal matrix and a number of carbon nanotube arrays disposed in the low melting point matrix. The low melting point metal matrix includes a first surface and a second surface opposite to the first surface. Each carbon nanotube array includes a number of carbon nanotubes substantially parallel to each other. A number of first interspaces are defined between adjacent carbon nanotube arrays. The carbon nanotubes of the carbon nanotube arrays extend from the first surface to the second surface.
    Type: Application
    Filed: December 17, 2013
    Publication date: April 17, 2014
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., Tsinghua University
    Inventors: FENG-WEI DAI, YUAN YAO, YOU-SEN WANG, JI-CUN WANG, HUI-LING ZHANG
  • Patent number: 8642121
    Abstract: A method for making a thermal interface material includes following steps. A substrate having a plurality of CNT arrays arranged thereon and a number of first interspaces defined between the CNT arrays is provided. A container is provided and the substrate with the CNT arrays is disposed into the container. A number of low melting point metallic nanoparticles is provided and filled in the first interspaces. The low melting point metallic nanoparticles in the container is heated into a liquid state, and the low melting point metal nanoparticles in liquid state is combined with the CNT arrays to form a composite material on the substrate. The composite material is peeled off from the substrate, and a thermal interface material is obtained.
    Type: Grant
    Filed: October 8, 2009
    Date of Patent: February 4, 2014
    Assignees: Tsinghua University, Hon Hai Precision Industry Co., Ltd.
    Inventors: Feng-Wei Dai, Yuan Yao, You-Sen Wang, Ji-Cun Wang, Hui-Ling Zhang
  • Patent number: 8437136
    Abstract: An electronic assembly includes a heat source having a maximum operating temperature, a heat dissipating device, a thermal interface material sandwiched between the heat source and the heat dissipating device. The thermal interface material includes a base and a plurality of first thermally conductive particles dispersed in the base. The first thermally conductive particles have a size monotonically changing from a first size less than 100 nanometers and a first melting temperature below the maximum operating temperature, to a second size larger than 100 nanometers and a second melting temperature above the maximum operating temperature when the heat source operates at a temperature above the first melting temperature and at or below the maximum operating temperature.
    Type: Grant
    Filed: October 14, 2009
    Date of Patent: May 7, 2013
    Assignees: Tsinghua University, Hon Hai Precision Industry Co., Ltd.
    Inventors: You-Sen Wang, Yuan Yao, Feng-Wei Dai, Ji-Cun Wang, Hui-Ling Zhang
  • Patent number: 8221667
    Abstract: The present disclosure relates to a method for making a thermal interface material. A carbon nanotube array on a substrate is provided. The carbon nanotube array includes a plurality of carbon nanotubes substantially parallel to each other and substantially perpendicular to the substrate. The carbon nanotubes of the carbon nanotube array are slanted toward a central axis of the carbon nanotube array. A liquid matrix material is compounded with the carbon nanotube array. Additionally, the liquid matrix material is solidified.
    Type: Grant
    Filed: October 13, 2009
    Date of Patent: July 17, 2012
    Assignees: Tsinghua University, Hon Hai Precision Industry Co., Ltd.
    Inventors: Yuan Yao, Feng-Wei Dai, Ji-Cun Wang, Hui-Ling Zhang, You-Sen Wang, Chang-Hong Liu
  • Patent number: 8081469
    Abstract: An electronic assembly includes a heat source having a maximum operating temperature, a heat dissipating device, a thermal interface material sandwiched between the heat source and the heat dissipating device. The thermal interface material includes a base and a plurality of first thermally conductive particles dispersed in the base. The first thermally conductive particles have a size monotonically changing from a first size less than 100 nanometers and a first melting temperature below the maximum operating temperature, to a second size larger than 100 nanometers and a second melting temperature above the maximum operating temperature when the heat source operates at a temperature above the first melting temperature and at or below the maximum operating temperature.
    Type: Grant
    Filed: October 14, 2009
    Date of Patent: December 20, 2011
    Assignees: Tsinghua University, Hon Hai Precision Industry Co., Ltd.
    Inventors: You-Sen Wang, Yuan Yao, Feng-Wei Dai, Ji-Cun Wang, Hui-Ling Zhang
  • Publication number: 20110221081
    Abstract: A manufacturing method of a high-reliability optical fiber coupler includes (1) manufacturing the optical fiber coupler by a fused biconical tapering process employing a parallel sintering process, and detecting via a tension test the strength of the optical fiber resulting from the sintering process, securing the strength thereof being greater than or equal to 1N; (2) fixing both ends of the sintered optical fiber coupler in a U-shaped quartz groove via hardening adhesive, and filling inside of the U-shaped quartz groove around the coupling arm at both ends thereof with adhesive to shorten the suspending length of the optical fiber; (3) inserting the U-shaped groove containing the optical fiber coupler into a circular quartz tube, and fixing both ends of the circular quartz tube via hardening adhesive; and (4) sleeving a stainless steel tube around the circular quartz tube, and sealing both ends of the stainless steel tube.
    Type: Application
    Filed: December 31, 2008
    Publication date: September 15, 2011
    Applicant: BEIJING AEROSPACE TIMES OPTICAL-ELECTRIC TECHNOLOGY CO., LTD.
    Inventors: Wei Wang, Dongfa Ding, Jing Li, Cun Wang, Lianjie Shan
  • Publication number: 20100302739
    Abstract: An electronic assembly includes a heat source having a maximum operating temperature, a heat dissipating device, a thermal interface material sandwiched between the heat source and the heat dissipating device. The thermal interface material includes a base and a plurality of first thermally conductive particles dispersed in the base. The first thermally conductive particles have a size monotonically changing from a first size less than 100 nanometers and a first melting temperature below the maximum operating temperature, to a second size larger than 100 nanometers and a second melting temperature above the maximum operating temperature when the heat source operates at a temperature above the first melting temperature and at or below the maximum operating temperature.
    Type: Application
    Filed: October 14, 2009
    Publication date: December 2, 2010
    Applicants: TSINGHUA UNIVERSITY, HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: You-Sen Wang, Yuan Yao, Feng-Wei Dai, Ji-Cun Wang, Hui-Ling Zhang
  • Publication number: 20100301260
    Abstract: A method for making a thermal interface material includes following steps. A substrate having a plurality of CNT arrays arranged thereon and a number of first interspaces defined between the CNT arrays is provided. A container is provided and the substrate with the CNT arrays is disposed into the container. A number of low melting point metallic nanoparticles is provided and filled in the first interspaces. The low melting point metallic nanoparticles in the container is heated into a liquid state, and the low melting point metal nanoparticles in liquid state is combined with the CNT arrays to form a composite material on the substrate. The composite material is peeled off from the substrate, and a thermal interface material is obtained.
    Type: Application
    Filed: October 8, 2009
    Publication date: December 2, 2010
    Applicants: Tsinghua University, HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Feng-Wei Dai, Yuan Yao, You-Sen Wang, Ji-Cun Wang, Hui-Ling Zhang
  • Publication number: 20100273946
    Abstract: A carbon nanotube microcapsule includes at least one carbon nanotube and a shell encapsulating the at least one carbon nanotube. The shell includes a plurality of first functional groups. A composite using the carbon nanotube microcapsule, and a method for making the carbon nanotube microcapsule is also disclosed.
    Type: Application
    Filed: September 22, 2009
    Publication date: October 28, 2010
    Applicants: TSINGHUA UNIVERSITY, HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: HUI-LING ZHANG, YUAN YAO, JI-CUN WANG, YOU-SEN WANG, FENG-WEI DAI
  • Publication number: 20100219550
    Abstract: The present disclosure relates to a method for making a thermal interface material. A carbon nanotube array on a substrate is provided. The carbon nanotube array includes a plurality of carbon nanotubes substantially parallel to each other and substantially perpendicular to the substrate. The carbon nanotubes of the carbon nanotube array are slanted toward a central axis of the carbon nanotube array. A liquid matrix material is compounded with the carbon nanotube array. Additionally, the liquid matrix material is solidified.
    Type: Application
    Filed: October 13, 2009
    Publication date: September 2, 2010
    Applicants: TSINGHUA UNIVERSITY, HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: YUAN YAO, FENG-WEI DAI, JI-CUN WANG, HUI-LING ZHANG, YOU-SEN WANG, CHANG-HONG LIU
  • Publication number: 20100157538
    Abstract: An electronic assembly includes a heat source having a maximum operating temperature, a heat dissipating device, a thermal interface material sandwiched between the heat source and the heat dissipating device. The thermal interface material includes a base and a plurality of first thermally conductive particles dispersed in the base. The first thermally conductive particles have a size monotonically changing from a first size less than 100 nanometers and a first melting temperature below the maximum operating temperature, to a second size larger than 100 nanometers and a second melting temperature above the maximum operating temperature when the heat source operates at a temperature above the first melting temperature and at or below the maximum operating temperature.
    Type: Application
    Filed: October 14, 2009
    Publication date: June 24, 2010
    Applicants: TSINGHUA UNIVERSITY, HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: YOU-SEN WANG, YUAN YAO, FENG-WEI DAI, JI-CUN WANG, HUI-LING ZHANG
  • Publication number: 20070203888
    Abstract: This specification discloses a unique Web search engine to help people find information on the Web more easily and efficiently, and a page-sized query algorithm which is applicable to Web search engines and other systems using large-scale databases. The Web search engine utilizes a simple hierarchical structure under the category Web, multiple ranks of records, diversified views of search results, display of unlimited records that are matched with keywords in the database, and opening any page of search results randomly. The page-sized query is different from the conventional queries in which the records are displayed on pages by skipping from the beginning of the record set (except page 1). In the page-sized queries, the records are directly displayed from the beginning of the record set on all pages, and the query size is restricted to a proper number that is equal to or a little larger than the record number for one page.
    Type: Application
    Filed: February 24, 2006
    Publication date: August 30, 2007
    Inventors: Cun Wang, Yaliang Wang
  • Publication number: 20040098249
    Abstract: This specification discloses a method and system to utilize Web resources for learning language words and phrases that are found in either general language study or specific language tests, such as SAT, GRE, TOEFL and GMAT, etc. The vocabulary and Web resource information are indexed and stored into a vocabulary database. From a user interface, learners view the vocabulary and open a Web page on which the current word or phrase is used. The vocabulary is automatically found and highlighted in the text of Web pages to attract learners' attention. The data in the database are routinely audited to check whether or not the index of vocabulary and Web resource information is valid. The major advantage of the present invention is to fully utilize a large number of free and easily accessible stories, fictions, essays and notes on the Web for language vocabulary learning.
    Type: Application
    Filed: November 18, 2002
    Publication date: May 20, 2004
    Inventors: Yaliang Wang, Cun Wang, Xiaoling Guo