Abstract: A controller for classifying devices of a building management system (BMS). The controller may be configured to obtain an entity name for a device, extract a core name from the entity name, compare the core name to candidate core names, determine scores for each comparison, identify a highest score, identify a class of a candidate core name, and classify the device in the class.

Abstract: A method of forming a wire loop in connection with a semiconductor package is provided. The method includes the steps of: (1) providing package data related to the semiconductor package to a wire bonding machine; (2) providing at least one looping control value related to a desired wire loop to the wire bonding machine, the at least one looping control value including at least a loop height value related to the desired wire loop; (3) deriving looping parameters, using an algorithm, for forming the desired wire loop; (4) forming a first wire loop on the wire bonding machine using the looping parameters derived in step (3); (5) measuring actual looping control values of the first wire loop formed in step (4) corresponding to the at least one looping control value; and (6) comparing the actual looping control values measured in step (5) to the at least one looping control value provided in step (2).

Abstract: Workpiece holder (3) for coupling a workpiece (2) provided with reference surfaces (30) to a machining device (200) for manufacturing a rotational-symmetrical tool (1) with at least one geometrically defined cutting edge (10), the workpiece holder (3) comprises a machine part (31) configured to be connectable to the machining device (200) in a releasable rotationally fixed manner, a clamping part (32) configured to receive and clamp the workpiece (2) in a releasable manner. The clamping part (32) of the workpiece holder (3) comprises at least one slot (40) provided at a circumference thereof and configured to provide access to the reference surfaces (30) of the clamped workpiece (2) therethrough.

Abstract: A method of forming a wire loop in connection with a semiconductor package is provided. The method includes the steps of: (1) providing package data related to the semiconductor package to a wire bonding machine; (2) providing at least one looping control value related to a desired wire loop to the wire bonding machine, the at least one looping control value including at least a loop height value related to the desired wire loop; (3) deriving looping parameters, using an algorithm, for forming the desired wire loop; (4) forming a first wire loop on the wire bonding machine using the looping parameters derived in step (3); (5) measuring actual looping control values of the first wire loop formed in step (4) corresponding to the at least one looping control value; and (6) comparing the actual looping control values measured in step (5) to the at least one looping control value provided in step (2).

Abstract: A method of forming a wire loop in connection with a semiconductor package is provided. The method includes the steps of: (1) providing package data related to the semiconductor package to a wire bonding machine; (2) providing at least one looping control value related to a desired wire loop to the wire bonding machine, the at least one looping control value including at least a loop height value related to the desired wire loop; (3) deriving looping parameters, using an algorithm, for forming the desired wire loop; (4) forming a first wire loop on the wire bonding machine using the looping parameters derived in step (3); (5) measuring actual looping control values of the first wire loop formed in step (4) corresponding to the at least one looping control value; and (6) comparing the actual looping control values measured in step (5) to the at least one looping control value provided in step (2).

Abstract: A controller for classifying devices of a building management system (BMS). The controller may be configured to obtain an entity name for a device, extract a core name from the entity name, compare the core name to candidate core names, determine scores for each comparison, identify a highest score, identify a class of a candidate core name, and classify the device in the class.

Abstract: A controller for classifying devices of a building management system (BMS). The controller may be configured to obtain an entity name for a device, extract a core name from the entity name, compare the core name to candidate core names, determine scores for each comparison, identify a highest score, identify a class of a candidate core name, and classify the device in the class.

Abstract: A controller for classifying devices of a building management system (BMS). The controller may be configured to obtain an entity name for a device, extract a core name from the entity name, compare the core name to candidate core names, determine scores for each comparison, identify a highest score, identify a class of a candidate core name, and classify the device in the class.

Abstract: A system having a building control device with on-demand outside server functionality. It may have a building control device connected to a thin user interface client and/or a rich client user interface. The building control device may be connected to an external server from a computing cloud environment to extend the functionality, storage and processing, among other things, of the building control device.

Abstract: A method of forming a wire loop in connection with a semiconductor package is provided. The method includes the steps of: (1) providing package data related to the semiconductor package to a wire bonding machine; (2) providing at least one looping control value related to a desired wire loop to the wire bonding machine, the at least one looping control value including at least a loop height value related to the desired wire loop; (3) deriving looping parameters, using an algorithm, for forming the desired wire loop; (4) forming a first wire loop on the wire bonding machine using the looping parameters derived in step (3); (5) measuring actual looping control values of the first wire loop formed in step (4) corresponding to the at least one looping control value; and (6) comparing the actual looping control values measured in step (5) to the at least one looping control value provided in step (2).

Abstract: A method of forming a wire loop in connection with a semiconductor package is provided. The method includes the steps of: (1) providing package data related to the semiconductor package to a wire bonding machine; (2) providing at least one looping control value related to a desired wire loop to the wire bonding machine, the at least one looping control value including at least a loop height value related to the desired wire loop; (3) deriving looping parameters, using an algorithm, for forming the desired wire loop; (4) forming a first wire loop on the wire bonding machine using the looping parameters derived in step (3); (5) measuring actual looping control values of the first wire loop formed in step (4) corresponding to the at least one looping control value; and (6) comparing the actual looping control values measured in step (5) to the at least one looping control value provided in step (2).

Abstract: A system or mechanism for monitoring a building automation system through configurable conditions that indicate non-optimal performance or failure of building equipment. The mechanism may deliver notifications when the conditions are triggered. The mechanism may enable complex conditions and arbitrary user defined contents providing a context of the system to be delivered as notifications of data to configured recipients. The mechanism may enable a configuring event including not only user defined system context data as part of the event notification but also complex user defined conditions as needed.

Abstract: A system and approach for managing configuration versions for controllers. The system and approach may incorporate a building controller, a version control system, and a computer connected to the controller and version control system. The version control system may have the controller configured to a latest version of changes as incorporated by a current configuration without losing one or more previous configurations. The one or more previous configurations may be recoverable by the version control system. The one or more previous configurations and the current configuration may be held by one or more repositories. The one or more repositories may be hosted in the computer, a remote computer, or a server.

Abstract: A system and approach for managing configuration versions for controllers. The system and approach may incorporate a building controller, a version control system, and a computer connected to the controller and version control system. The version control system may have the controller configured to a latest version of changes as incorporated by a current configuration without losing one or more previous configurations. The one or more previous configurations may be recoverable by the version control system. The one or more previous configurations and the current configuration may be held by one or more repositories. The one or more repositories may be hosted in the computer, a remote computer, or a server.

Abstract: A method of forming a wire loop in connection with a semiconductor package is provided. The method includes the steps of: (1) providing package data related to the semiconductor package to a wire bonding machine; (2) providing at least one looping control value related to a desired wire loop to the wire bonding machine, the at least one looping control value including at least a loop height value related to the desired wire loop; (3) deriving looping parameters, using an algorithm, for forming the desired wire loop; (4) forming a first wire loop on the wire bonding machine using the looping parameters derived in step (3); (5) measuring actual looping control values of the first wire loop formed in step (4) corresponding to the at least one looping control value; and (6) comparing the actual looping control values measured in step (5) to the at least one looping control value provided in step (2).

Abstract: A method of forming a wire loop in connection with a semiconductor package is provided. The method includes the steps of: (1) providing package data related to the semiconductor package to a wire bonding machine; (2) providing at least one looping control value related to a desired wire loop to the wire bonding machine, the at least one looping control value including at least a loop height value related to the desired wire loop; (3) deriving looping parameters, using an algorithm, for forming the desired wire loop; (4) forming a first wire loop on the wire bonding machine using the looping parameters derived in step (3); (5) measuring actual looping control values of the first wire loop formed in step (4) corresponding to the at least one looping control value; and (6) comparing the actual looping control values measured in step (5) to the at least one looping control value provided in step (2).

Abstract: A system having a building control device with on-demand outside server functionality. It may have a building control device connected to a thin user interface client and/or a rich client user interface. The building control device may be connected to an external server from a computing cloud environment to extend the functionality, storage and processing, among other things, of the building control device.

Abstract: A system having a building control device with on-demand outside server functionality. It may have a building control device connected to a thin user interface client and/or a rich client user interface. The building control device may be connected to an external server from a computing cloud environment to extend the functionality, storage and processing, among other things, of the building control device.

Abstract: A system and approach for managing configuration versions for controllers. The system and approach may incorporate a building controller, a version control system, and a computer connected to the controller and version control system. The version control system may have the controller configured to a latest version of changes as incorporated by a current configuration without losing one or more previous configurations. The one or more previous configurations may be recoverable by the version control system. The one or more previous configurations and the current configuration may be held by one or more repositories. The one or more repositories may be hosted in the computer, a remote computer, or a server.

Abstract: A system or mechanism for monitoring a building automation system through configurable conditions that indicate non-optimal performance or failure of building equipment. The mechanism may deliver notifications when the conditions are triggered. The mechanism may enable complex conditions and arbitrary user defined contents providing a context of the system to be delivered as notifications of data to configured recipients. The mechanism may enable a configuring event including not only user defined system context data as part of the event notification but also complex user defined conditions as needed.