Abstract: A utility wafer is used to mechanically condition and chemically stabilize a polishing pad and ready the pad for chemical-mechanical polishing of semiconductor production wafers. The utility wafer is fabricated from a high-purity ceramic material, such as quartz (SiO.sub.2), or a high-purity metal, such as tungsten. Because there are no dielectric coatings to be maintained on the utility wafer, the utility wafer can be used much longer and at greatly reduced cost than other types of utility wafers. In one embodiment, a light reflective coating may be applied to one side of a ceramic utility wafer to ensure process machinery will detect the presence of the wafer. In another embodiment, a silicon wafer is bonded to the utility wafer to provide structural support to the utility wafer as the utility wafer is thinned by the abrasive action of the polishing pad.