Patents by Inventor Curt L. Progl

Curt L. Progl has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heat dissipation structure for electronic apparatus component
    Patent number: 6570761
    Abstract: A computer microprocessor has a housing portion with a recess formed in a top side wall thereof, and a die portion inset within the recess. Operating heat from the die is removed by heat dissipation apparatus which automatically adapts to variations in the microprocessor bond line thickness and includes a sheet metal EMI shield wall overlying the microprocessor and having a condensing end portion of a thermosyphoning heat pipe secured to its bottom side, with an evaporating end portion of the heat pipe overlying the die recess and being resiliently deflectable toward a phase change thermal pad mounted on the top side of the die and inset into the housing die recess. A metal heat sink member is rotatably mounted on the heat pipe evaporating end portion and has a flat bottom side and an arcuate top side.
    Type: Grant
    Filed: March 28, 2002
    Date of Patent: May 27, 2003
    Assignee: Hewlett Packard Development Company, L.P.
    Inventors: Lawrence A. Stone, Jeffrey A. Lev, Curt L. Progl
  • Heat dissipation structure for electronic apparatus component
    Publication number: 20020097558
    Abstract: A computer microprocessor has a housing portion with a recess formed in a top side wall thereof, and a die portion inset within the recess. Operating heat from the die is removed by heat dissipation apparatus which automatically adapts to variations in the microprocessor bond line thickness and includes a sheet metal EMI shield wall overlying the microprocessor and having a condensing end portion of a thermosyphoning heat pipe secured to its bottom side, with an evaporating end portion of the heat pipe overlying the die recess and being resiliently deflectable toward a phase change thermal pad mounted on the top side of the die and inset into the housing die recess. A metal heat sink member is rotatably mounted on the heat pipe evaporating end portion and has a flat bottom side and an arcuate top side.
    Type: Application
    Filed: March 28, 2002
    Publication date: July 25, 2002
    Inventors: Lawrence A. Stone, Jeffrey A. Lev, Curt L. Progl
  • Heat dissipation structure for electronic apparatus component
    Patent number: 6366460
    Abstract: A computer microprocessor has a housing portion with a recess formed in a top side wall thereof, and a die portion inset within the recess. Operating heat from the die is removed by heat dissipation apparatus which automatically adapts to variations in the microprocessor bond line thickness and includes a sheet metal EMI shield wall overlying the microprocessor and having a condensing end portion of a thermosyphoning heat pipe secured to its bottom side, with an evaporating end portion of the heat pipe overlying the die recess and being resiliently deflectable toward a phase change thermal pad mounted on the top side of the die and inset into the housing die recess. A metal heat sink member is rotatably mounted on the heat pipe evaporating end portion and has a flat bottom side and an arcuate top side.
    Type: Grant
    Filed: July 27, 1998
    Date of Patent: April 2, 2002
    Assignee: Compaq Computer Corporation
    Inventors: Lawrence A. Stone, Jeffrey A. Lev, Curt L. Progl