Patents by Inventor Curt Lee Nelson

Curt Lee Nelson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7923837
    Abstract: A microelectronic device includes a non-polymeric substrate, an organic interlayer, and a indium tin oxide layer formed on the organic interlayer; the indium tin oxide layer including an ablated feature within said indium tin oxide layer, wherein said indium tin oxide layer is formed by an indium tin oxide solution that is laser ablated prior to sintering. Applicant respectfully submits that the above amendments bring the Abstract into compliance with MPEP ยง608.01 (b). Accordingly, Applicant respectfully requests reconsideration and withdrawal of the objection to the abstract.
    Type: Grant
    Filed: October 31, 2007
    Date of Patent: April 12, 2011
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Chinmay Betrabet, Curt Lee Nelson
  • Publication number: 20090108449
    Abstract: A microelectronic device includes a non-polymeric substrate, an organic interlayer, and a indium tin oxide layer formed on the organic interlayer.
    Type: Application
    Filed: October 31, 2007
    Publication date: April 30, 2009
    Inventors: Chinmay Betrabet, Curt Lee Nelson
  • Patent number: 7381633
    Abstract: A method of making a patterned metal oxide film includes jetting a sol-gel solution on a substrate. The sol-gel solution is dried to form a gel layer on the substrate. Portions of the gel layer are irradiated to pattern the gel layer and to form exposed portions. Irradiation causes the exposed portions of the gel layer to become at least one of substantially condensed to an oxide, substantially densified, substantially cured, and combinations thereof. The unexposed portions of the gel layer are removed, thereby forming the patterned metal oxide film.
    Type: Grant
    Filed: January 27, 2005
    Date of Patent: June 3, 2008
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: John O. Thompson, Curt Lee Nelson, David Punsalan
  • Patent number: 7291380
    Abstract: A method of plating a substrate including coating a substrate surface, laser-treating a region of the coated surface, and plating the region.
    Type: Grant
    Filed: July 9, 2004
    Date of Patent: November 6, 2007
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Peter S. Nyholm, Curt Lee Nelson, Niranjan Thirukkovalur, Paul McClelland