Patents by Inventor Curtis A. Harper

Curtis A. Harper has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11972979
    Abstract: Embodiments disclosed herein include semiconductor devices and methods of forming such devices. In an embodiment a semiconductor device comprises a first interlayer dielectric (ILD), a plurality of source/drain (S/D) contacts in the first ILD, a plurality of gate contacts in the first ILD, wherein the gate contacts and the S/D contacts are arranged in an alternating pattern, and wherein top surfaces of the gate contacts are below top surfaces of the S/D contacts so that a channel defined by sidewall surfaces of the first ILD is positioned over each of the gate contacts, mask layer partially filling a first channel over a first gate contact, and a fill metal filling a second channel over a second gate contact that is adjacent to the first gate contact.
    Type: Grant
    Filed: June 7, 2023
    Date of Patent: April 30, 2024
    Assignee: Intel Corporation
    Inventors: Leonard P. Guler, Michael Harper, Suzanne S. Rich, Charles H. Wallace, Curtis Ward, Richard E. Schenker, Paul Nyhus, Mohit K. Haran, Reken Patel, Swaminathan Sivakumar
  • Publication number: 20210376883
    Abstract: A device that adds wireless Bluetooth capability for audio to an existing in-flight entertainment system is disclosed. Audio and power are sent from the existing system to provide power and audio input to the Bluetooth transmitter. The audio and power are split so that they are also sent to female audio and power ports for passengers to use in the same way in-flight entertainment systems are currently designed.
    Type: Application
    Filed: June 1, 2020
    Publication date: December 2, 2021
    Inventors: Logan Gregory Harper, Colby Curtis Harper
  • Patent number: 10910011
    Abstract: A data storage device is disclosed comprising a head actuated over a disk. The disk is spun at a first speed while writing first data to the disk based on a first disk format defining a first capacity for the disk. When a command is received from a host to spin the disk at a second speed different from the first speed, the disk is spun at the second speed while writing second data to the disk based on a second disk format defining a second capacity for the disk different from the first capacity.
    Type: Grant
    Filed: January 30, 2020
    Date of Patent: February 2, 2021
    Assignee: Western Digital Technologies, Inc.
    Inventors: Curtis A. Harper, Paul E. Movall, Scott E. Burton, David R. Hall
  • Patent number: 10520251
    Abstract: A UV light curing system is provided. The UV light curing system includes: a UV light source; a primary reflector for reflecting light emitted by the UV light source in a direction of an enclosure, the enclosure at least partially surrounding an object of interest; and a secondary reflector on an opposite side of the enclosure with respect to the primary reflector, the secondary reflector being positioned along a portion of a length of the enclosure, the secondary reflector surrounding at least 40% of the enclosure at the portion of the length of the enclosure.
    Type: Grant
    Filed: January 13, 2016
    Date of Patent: December 31, 2019
    Assignee: Heraeus Noblelight America LLC
    Inventors: Darrin Leonhardt, William Curtis Harper
  • Patent number: 9644831
    Abstract: A manifold assembly for distribution of a cooling fluid configured for use with a light source is provided. The manifold assembly includes a fluid manifold for providing a cooling fluid to a lamp head assembly of the light source, at least one sensor for sensing at least one characteristic of the cooling fluid in the fluid manifold, and a microprocessor for receiving information related to the at least one characteristic from the at least one sensor.
    Type: Grant
    Filed: January 13, 2016
    Date of Patent: May 9, 2017
    Assignee: Heraeus Noblelight America LLC
    Inventors: William E. Johnson, III, Darrin Leonhardt, William Curtis Harper, Mahmood Gharagozloo, Arunachalam Jawahar
  • Publication number: 20160209113
    Abstract: A UV light curing system is provided. The UV light curing system includes: a UV light source; a primary reflector for reflecting light emitted by the UV light source in a direction of an enclosure, the enclosure at least partially surrounding an object of interest; and a secondary reflector on an opposite side of the enclosure with respect to the primary reflector, the secondary reflector being positioned along a portion of a length of the enclosure, the secondary reflector surrounding at least 40% of the enclosure at the portion of the length of the enclosure.
    Type: Application
    Filed: January 13, 2016
    Publication date: July 21, 2016
    Inventors: Darrin Leonhardt, William Curtis Harper
  • Publication number: 20160209019
    Abstract: A manifold assembly for distribution of a cooling fluid configured for use with a light source is provided. The manifold assembly includes a fluid manifold for providing a cooling fluid to a lamp head assembly of the light source, at least one sensor for sensing at least one characteristic of the cooling fluid in the fluid manifold, and a microprocessor for receiving information related to the at least one characteristic from the at least one sensor.
    Type: Application
    Filed: January 13, 2016
    Publication date: July 21, 2016
    Inventors: William E. Johnson, III, Darrin Leonhardt, William Curtis Harper, Mahmood Gharagozloo, Arunachalam Jawahar
  • Publication number: 20040124186
    Abstract: A method of analyzing a MEMS device having micromirrors. A laser is targeted on one or more mirror elements and used to remove only the mirror. Once the mirror is removed, the underlying structure can be observed in operation, measured, elementally analyzed, or undergo other types of analysis.
    Type: Application
    Filed: December 30, 2002
    Publication date: July 1, 2004
    Applicant: Texas Instruments Incorporated
    Inventor: Curtis Harper