Patents by Inventor Curtis A. Ray

Curtis A. Ray has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9760172
    Abstract: One variation of a dynamic tactile interface includes: a dynamic tactile layer including a deformable region and a first region, the deformable region operable between a retracted setting and an expanded setting, the first region adjacent the deformable region, the deformable region tactilely distinguishable from the first region in the expanded setting; a displacement device including a fluid vessel and an actuator, the actuator displacing fluid from the fluid vessel into the dynamic tactile layer to transition the deformable region from the retracted setting into the expanded setting and displacing fluid from the dynamic tactile layer into the fluid vessel, transitioning the deformable region from the expanded setting into the retracted setting; and a fluid compensation device coupled to the displacement device and adjusting a configuration of the displacement device in response to a change in a volume of fluid contained within the fluid vessel.
    Type: Grant
    Filed: July 23, 2015
    Date of Patent: September 12, 2017
    Assignee: Tactus Technology, Inc.
    Inventors: Curtis A. Ray, Mario Sotelo Garcia, Roman Rak, Forrest Russell Grinstead, Maxwell Harshorn Shimshak
  • Publication number: 20170199572
    Abstract: One variation of a dynamic tactile interface includes: a substrate including a first transparent material and defining an attachment surface, an open channel opposite the attachment surface, and a fluid conduit intersecting the open channel and passing through the attachment surface; a tactile layer including a second transparent material and defining a tactile surface, a peripheral region bonded to the attachment surface opposite the tactile surface, and a deformable region adjacent the fluid conduit and disconnected from the attachment surface; a closing panel bonded to the substrate opposite the attachment surface and enclosing the open channel to define a fluid channel; a working fluid; and a displacement device configured to displace the working fluid into the fluid channel and through the fluid conduit to transition the deformable region from a retracted setting to an expanded setting.
    Type: Application
    Filed: July 19, 2016
    Publication date: July 13, 2017
    Applicant: Tactus Technology, Inc.
    Inventors: Micah Yairi, Craig M. Ciesla, Nathaniel Saal, Curtis A. Ray, Michael Hammersley, Brandon Miller, Ben Calub, Carl Del Rosario, Mario S. Garcia, Ron Menigoz, David Henry Krevor, Jonathon Jenkins
  • Publication number: 20170199573
    Abstract: One variation of a dynamic tactile interface includes a tactile layer defining a peripheral region and a deformable region adjacent the peripheral region; a substrate coupled to the peripheral region, a fluid conduit adjacent the deformable region, a fluid channel fluidly coupled to the fluid conduit, and a via fluidly coupled to the fluid channel and passing through the back surface; a bladder fluidly coupled to the via and the substrate; a structure adjacent a first side of the bladder; and a platen adjacent a second side of the bladder opposite the first side and compressing the bladder against the structure substantially perpendicular the longitudinal axis of the bladder and substantially parallel the substrate to displace fluid from the bladder and into the fluid channel to transition the deformable region from a retracted setting into an expanded setting.
    Type: Application
    Filed: July 20, 2016
    Publication date: July 13, 2017
    Applicant: Tactus Technology, Inc.
    Inventors: Ben Calub, Carl Del Rosario, Mario Garcia, Michael Hammersley, Roman Rak, Curtis A. Ray, Micah Yairi, Nathan Knapp, Robert Adrian Ray, Brandon Miller, Kyle K. Gregory, Maxwell Harshorn Shimshak, Craig M. Ciesla
  • Publication number: 20170185188
    Abstract: A dynamic tactile interface includes a tactile layer including a peripheral region and a deformable region adjacent the peripheral region, the deformable region operable between an expanded setting and a retracted setting; a substrate coupled to the peripheral region and defining a fluid conduit and a fluid channel fluidly coupled to the fluid conduit, the fluid conduit adjacent the deformable region; and a spring element coupled to the substrate between the tactile layer and the substrate, arranged substantially over the fluid conduit, and operable in a first distended position and a second distended position, the spring element at a local minimum of potential energy in the expanded setting and in the first distended position and at a second potential energy greater than the local minimum of potential energy between the first distended position and the second distended position, the spring element defining a nonlinear displacement response to an input displacing the deformable region in the expanded setting
    Type: Application
    Filed: March 15, 2017
    Publication date: June 29, 2017
    Inventors: Micah Yairi, Curtis A. Ray, Nate Saal
  • Publication number: 20160187980
    Abstract: One variation of a dynamic tactile interface includes: a dynamic tactile layer including a deformable region and a first region, the deformable region operable between a retracted setting and an expanded setting, the first region adjacent the deformable region, the deformable region tactilely distinguishable from the first region in the expanded setting; a displacement device including a fluid vessel and an actuator, the actuator displacing fluid from the fluid vessel into the dynamic tactile layer to transition the deformable region from the retracted setting into the expanded setting and displacing fluid from the dynamic tactile layer into the fluid vessel, transitioning the deformable region from the expanded setting into the retracted setting; and a fluid compensation device coupled to the displacement device and adjusting a configuration of the displacement device in response to a change in a volume of fluid contained within the fluid vessel.
    Type: Application
    Filed: July 23, 2015
    Publication date: June 30, 2016
    Inventors: Curtis A. Ray, Mario Sotelo Garcia, JR., Roman Rak, Forrest Russell Grinstead, Maxwell Harshorn Shimshak
  • Publication number: 20160187981
    Abstract: A dynamic tactile interface includes a dynamic tactile layer and a manual fluid actuator. The manual fluid actuator includes a displacement device including a bladder, a platen adjacent the bladder, an elongated member coupled to the platen, and a rotary actuator, the elongated member and the rotary actuator translating rotation of the rotary actuator into translation of the platen, the platen compressing the bladder in response to rotation of the rotary actuator in a first direction and expanding the bladder in response to rotation of the rotary actuator in a second direction opposite the first direction.
    Type: Application
    Filed: July 23, 2015
    Publication date: June 30, 2016
    Inventors: Curtis A. Ray, Mario Sotelo Garcia, JR., Roman Rak, Forrest Russell Grinstead, Robert Adrian Ray, Micah Yairi
  • Patent number: 7669466
    Abstract: Tire sensor packaging capable of being installed on a standard snap-in tire valve stem is provided. The sensor package includes an attachment member capable of being disposed in the flexible bore of a snap-in tire valve stem, and of securely engaging with the inner wall of the flexible bore. The attachment member can be an integral part of the sensor package, or it can be a separate part that acts as an expansion device (e.g., an expansion nut) when engaged with the sensor package. Preferably, the attachment member includes features, such as barbs, to provide more secure engagement with the tire valve stem. Packages according to embodiments of the invention include a package passage (e.g., a channel or a bore) to permit the flow of air past the sensor, so that the tire can be inflated or deflated. Sensors can be attached to the tire valve stem before or after the tire valve stem is installed in the wheel.
    Type: Grant
    Filed: December 18, 2007
    Date of Patent: March 2, 2010
    Assignee: LV Sensors, Inc.
    Inventors: Curtis A. Ray, Michael Malaga
  • Patent number: 7539003
    Abstract: The devices presented herein are capacitive sensors with single crystal silicon on all key stress points. Isolating trenches are formed by trench and refill forming dielectrically isolated conductive silicon electrodes for drive, sense and guards. For pressure sensing devices according to the invention, the pressure port is opposed to the electrical wire bond pads for ease of packaging. Dual-axis accelerometers measuring in plane acceleration and out of plane acceleration are also described. A third axis in plane is easy to achieve by duplicating and rotating the accelerometer 90 degrees about its out of plane axis Creating resonant structures, angular rate sensors, bolometers, and many other structures are possible with this process technology. Key advantages are hermeticity, vertical vias, vertical and horizontal gap capability, single crystal materials, wafer level packaging, small size, high performance and low cost.
    Type: Grant
    Filed: February 16, 2007
    Date of Patent: May 26, 2009
    Assignee: LV Sensors, Inc.
    Inventors: Curtis A. Ray, Janusz Bryzek
  • Patent number: 7468556
    Abstract: Improved sensor packaging is provided with a hybrid integration approach. In one example, an application specific integrated circuit (ASIC) for sensor signal conditioning is packaged. The ASIC package has an aperture in it that exposes a chip to chip bonding interface of the ASIC chip. The rest of the ASIC chip is surrounded by the package, including the connections between the external package leads and the ASIC chip. A sensor chip, also having a chip to chip bonding interface, is disposed in the package aperture and bonded to the ASIC chip such that the two chip to chip bonding interfaces are connected. Flip chip bonding of the sensor chip to the ASIC chip is a preferred approach for chip to chip bonding. The vertical gap between the two chips can be filled in by an underfill process. The lateral gap between the sensor chip and the package can also be filled.
    Type: Grant
    Filed: June 18, 2007
    Date of Patent: December 23, 2008
    Assignee: LV Sensors, Inc.
    Inventors: Elizabeth A. Logan, Curtis A. Ray
  • Publication number: 20080276995
    Abstract: Tire sensor packaging capable of being installed on a standard snap-in tire valve stem is provided. The sensor package includes an attachment member capable of being disposed in the flexible bore of a snap-in tire valve stem, and of securely engaging with the inner wall of the flexible bore. The attachment member can be an integral part of the sensor package, or it can be a separate part that acts as an expansion device (e.g., an expansion nut) when engaged with the sensor package. Preferably, the attachment member includes features, such as barbs, to provide more secure engagement with the tire valve stem. Packages according to embodiments of the invention include a package passage (e.g., a channel or a bore) to permit the flow of air past the sensor, so that the tire can be inflated or deflated. Sensors can be attached to the tire valve stem before or after the tire valve stem is installed in the wheel.
    Type: Application
    Filed: December 18, 2007
    Publication date: November 13, 2008
    Inventors: Curtis A. Ray, Michael Malaga
  • Patent number: 7272323
    Abstract: A bi-directional (BiDi) electrical to optical converter (transceiver) module is described that contains means for communicating in a full duplex fashion over one fiber. Furthermore, an automatic fail-over capability is included which allows redundancy to be build in to the transceiver. In one configuration, a BiDi transceiver module contains two lasers at different wavelengths and a means for establishing which wavelength to communicate with. An example of an application for the described invention is a storage area network application which requires redundant links and are currently bound by the number of fibers connecting to the front panels of switches.
    Type: Grant
    Filed: December 3, 2003
    Date of Patent: September 18, 2007
    Assignee: Omron Network Products, LLC
    Inventors: Eric B. Grann, Curtis A. Ray, Todd Whitaker, Michael J. Laha, Brian Peters
  • Patent number: 7198416
    Abstract: An optical device for combining optical signals of different wavelengths is described wherein an array of laser output beams are collimated, directed to propagate along a similar path, and coupled into an optical fiber through a single molded part. The single-part optical coupling module can be constructed in various ways to achieve the desired configuration. One example is a single plastic-injection molded part, containing mechanical alignment features, an array of collimating lenses, and a focusing lens housed within a fiber optic connector ferrule. The laser output beams are separately passed through separate radial sectors of the focusing lens.
    Type: Grant
    Filed: January 27, 2005
    Date of Patent: April 3, 2007
    Assignee: Omron Network Products, LLC
    Inventors: Curtis A. Ray, Eric B. Grann, Brian C. Peters
  • Publication number: 20040175181
    Abstract: A bi-directional (BiDi) electrical to optical converter (transceiver) module is described that contains means for communicating in a full duplex fashion over one fiber. Furthermore, an automatic fail-over capability is included which allows redundancy to be build in to the transceiver. In one configuration, a BiDi transceiver module contains two lasers at different wavelengths and a means for establishing which wavelength to communicate with. An example of an application for the described invention is a storage area network application which requires redundant links and are currently bound by the number of fibers connecting to the front panels of switches.
    Type: Application
    Filed: December 3, 2003
    Publication date: September 9, 2004
    Inventors: Eric B. Grann, Curtis A. Ray, Todd Whitaker, Michael J. Laha, Brian Peters
  • Publication number: 20030215240
    Abstract: A low profile, optical WDM is provided having a single mode tolerance. To accomplish the low profile aspect, laser-to-fiber connections are utilized, eliminating most of the fiber-to-fiber connections required by the prior art. Reduction of fiber-to-fiber connections facilitates the downsizing of the device without the risk of breaking fibers. The single mode tolerance is achieved by the use of canned lasers together with a precision optical block. A 4 channel embodiment can be packaged in a module less than 5 mm thick, less than 20 mm wide and less than 25 mm in length.
    Type: Application
    Filed: March 21, 2003
    Publication date: November 20, 2003
    Inventors: Eric B. Grann, Curtis A. Ray, Scott Fluegal
  • Patent number: 6558046
    Abstract: An optical wavelength multiplexer and/or demultiplexer is provided having mechanical strain relief. The mechanical strain relief is provided by mounting ears carried by a molded coupling module supporting the fiber optic cable receptacle. The mounting ears are engaged by a pair of mounting plates carried by a housing for the device. Loads applied to the fiber optic cable receptacle are transferred to the housing frame and do not adversely affect the optical pathway of the assembled device.
    Type: Grant
    Filed: March 12, 2001
    Date of Patent: May 6, 2003
    Assignee: Blaze Network Products, Inc.
    Inventors: Jeffrey A. Griffis, Roderick P. McAfee, Curtis A. Ray, Hong Li
  • Publication number: 20010043778
    Abstract: An optical wavelength multiplexer and/or demultiplexer is provided having mechanical strain relief. The mechanical strain relief is provided by mounting ears carried by a molded coupling module supporting the fiber optic cable receptacle. The mounting ears are engaged by a pair of mounting plates carried by a housing for the device. Loads applied to the fiber optic cable receptacle are transferred to the housing frame and do not adversely affect the optical pathway of the assembled device.
    Type: Application
    Filed: March 12, 2001
    Publication date: November 22, 2001
    Inventors: Jeffrey A. Griffis, Roderick P. McAfee, Curtis A. Ray, Hong Li
  • Patent number: 5325880
    Abstract: A sub-miniature valve which provides an actuator of shape memory alloy film coupled so as to move a poppet adjacent to a valve port. The shape memory alloy film actuator is thermally cycled through its phase change transition temperature, resulting in either a contraction or elongation of the actuator. This causes the poppet to move relative to the port and either increase or decrease fluid flow. The shape memory alloy film is biased toward its deformed position when cooled below its transition temperature. The valve can be electrically operated with commonly available voltages, including those used for micro-electronics. The relatively large forces and displacements achieved using the shape memory alloy film provide less restriction and greater flow than in other similarly sized valves.
    Type: Grant
    Filed: April 19, 1993
    Date of Patent: July 5, 1994
    Assignee: TiNi Alloy Company
    Inventors: A. David Johnson, Curtis A. Ray