Patents by Inventor Curtis B. Carlsten

Curtis B. Carlsten has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11880006
    Abstract: A packed sensor line array system includes sensors mounted outboard of cable packs wrapped around a central mandrel. The system may have multiple rows (layers) of the sensors and cable packs, surrounded by a cannister. Cable retainers may be used to retain cable ends near sensors, to keep the cable ends out of the way of subsequent winding operations. The winding may be done in situ, with the mandrel mounted to a rotatable chuck that is rotated to wind the individual cable packs sequentially around the mandrel, with positioning of the sensors outboard of the windings occurring between the winding operations. A positionable indexing tool may be coupled to and moved along the mandrel, to define a space along the mandrel for each cable pack winding.
    Type: Grant
    Filed: November 29, 2022
    Date of Patent: January 23, 2024
    Assignee: Raytheon Company
    Inventors: Joseph Misulia, Curtis B. Carlsten
  • Patent number: 11858220
    Abstract: A method of coupling polymeric components utilizing electromagnetic energy is disclosed. The method can include obtaining a first component having a first coupling portion, a second component having a second coupling portion, and a susceptor. The method can also include mating the first and second components such that the susceptor is proximate the first and second coupling portions. In addition, the method can include applying electromagnetic energy to the susceptor. The susceptor can convert the electromagnetic energy to heat, which can melt portions of the first and second coupling portions about the susceptor to couple the first and second components to one another upon solidification.
    Type: Grant
    Filed: May 24, 2021
    Date of Patent: January 2, 2024
    Assignee: Raytheon Company
    Inventors: Curtis B. Carlsten, Peter Willey, Stephanie Gratiano, John Carcone
  • Patent number: 11694668
    Abstract: A deployment module according to the present application enables both compact stowage of a sensor array and expansion of the sensor array into a three-dimensional volumetric array shape that enables improved directionality of the sensors during operation. The deployment module includes a support shell that is configured to retain a cable of the sensor array separately from sensors of the sensor array and an expandable deployment body formed of a superelastic shape memory alloy that uses superelasticity and stored energy for deployment of the sensor array. During deployment, the deployment body is removed from the support shell and the sensors are subsequently pulled out of the support shell. The deployment body then expands and holds the cable to retain the three-dimensional volumetric shape of the deployed array.
    Type: Grant
    Filed: May 27, 2020
    Date of Patent: July 4, 2023
    Assignee: Raytheon Company
    Inventors: Curtis B. Carlsten, Frederick B. Koehler, Jason E. Gaudette, Peter M. Willey
  • Patent number: 11682373
    Abstract: A packing module includes a volumetrically efficient structure for separately retaining sensors and a cable of a sensor array. The packing module includes a tray that supports the sensors and a retaining leaf arrangement that extends outwardly from the tray to retain the cable on the tray. The retaining leaf arrangement includes a plurality of nested leaves that are spaced relative to each other. Packing the module includes placing the sensors separately and in succession on the tray and inserting a portion of the cable in the retaining leaf arrangement in between each placing of a sensor. The placement of a sensor and insertion of a portion of the cable occurs alternately until the entire sensor array is accommodated. Deployment of the sensor array may occur by alternately removing a sensor and a portion of the cable until the sensor array is displaced from the module.
    Type: Grant
    Filed: March 25, 2020
    Date of Patent: June 20, 2023
    Assignee: Raytheon Company
    Inventors: Joseph M. Misulia, Curtis B. Carlsten, Peter M. Willey
  • Publication number: 20230168402
    Abstract: A packed sensor line array system includes sensors mounted outboard of cable packs wrapped around a central mandrel. The system may have multiple rows (layers) of the sensors and cable packs, surrounded by a cannister. Cable retainers may be used to retain cable ends near sensors, to keep the cable ends out of the way of subsequent winding operations. The winding may be done in situ, with the mandrel mounted to a rotatable chuck that is rotated to wind the individual cable packs sequentially around the mandrel, with positioning of the sensors outboard of the windings occurring between the winding operations. A positionable indexing tool may be coupled to and moved along the mandrel, to define a space along the mandrel for each cable pack winding.
    Type: Application
    Filed: November 29, 2022
    Publication date: June 1, 2023
    Inventors: Joseph Misulia, Curtis B. Carlsten
  • Patent number: 11600972
    Abstract: An embedded wire removal tool is disclosed. The embedded wire removal tool can include a feed mechanism operable to cause movement of a cable. The cable can have a jacket about a core. The cable can also include a wire disposed about the core and at least partially embedded in the jacket. The embedded wire removal tool can also include a jacket cutter operable to receive the cable from the feed mechanism and remove at least a portion of the jacket. In addition, the embedded wire removal tool can include a wire excavator operable to separate the wire from the core.
    Type: Grant
    Filed: January 15, 2021
    Date of Patent: March 7, 2023
    Assignee: Raytheon Company
    Inventors: Jason Rosa, Peter Willey, Curtis B. Carlsten
  • Patent number: 11575228
    Abstract: An apparatus includes a strain relief formed in helical shape and formed with a U-shaped channel. The strain relief can be used around a cable of a component or a spool extension of a fiber tray.
    Type: Grant
    Filed: July 27, 2020
    Date of Patent: February 7, 2023
    Assignee: Raytheon Company
    Inventors: Peter M. Willey, Curtis B. Carlsten, John C. Cochran
  • Publication number: 20220347928
    Abstract: A method of additive manufacturing including generating a stress model driven slice file for a structure and additively manufacturing a variable density foam core with respect to the stress model driven slice file such that a density of the variable density foam core is varied relative to a modeled stress in the structure manufactured with the variable density foam core. An additively manufactured structure includes a composite skin bonded to the variable density foam core.
    Type: Application
    Filed: April 29, 2021
    Publication date: November 3, 2022
    Applicant: Raytheon Company
    Inventors: Andrew Truxel, Curtis B. Carlsten, Florian P. Lukowski, JR.
  • Patent number: 11457546
    Abstract: A system includes a first slice and a second slice coupled to each other. Each slice includes a housing formed of an electrically-insulative material, a ceramic plate disposed at each end of the housing, and an end plate disposed over each of the ceramic plates. Each end plate is formed of a thermally-conductive material. The system also includes a backplane assembly coupled to the first slice and the second slice.
    Type: Grant
    Filed: October 8, 2020
    Date of Patent: September 27, 2022
    Assignee: Raytheon Company
    Inventors: Richard P. Dube, Mark S. Langelier, Paul A. Sefcsik, Jr., Jason P. Rosa, Curtis B. Carlsten, Michael F. Janik, Mark R. Franklin, Jr.
  • Publication number: 20220231490
    Abstract: An embedded wire removal tool is disclosed. The embedded wire removal tool can include a feed mechanism operable to cause movement of a cable. The cable can have a jacket about a core. The cable can also include a wire disposed about the core and at least partially embedded in the jacket. The embedded wire removal tool can also include a jacket cutter operable to receive the cable from the feed mechanism and remove at least a portion of the jacket. In addition, the embedded wire removal tool can include a wire excavator operable to separate the wire from the core.
    Type: Application
    Filed: January 15, 2021
    Publication date: July 21, 2022
    Inventors: Jason Rosa, Peter Willey, Curtis B. Carlsten
  • Publication number: 20220117110
    Abstract: A system includes a first slice and a second slice coupled to each other. Each slice includes a housing formed of an electrically-insulative material, a ceramic plate disposed at each end of the housing, and an end plate disposed over each of the ceramic plates. Each end plate is formed of a thermally-conductive material. The system also includes a backplane assembly coupled to the first slice and the second slice.
    Type: Application
    Filed: October 8, 2020
    Publication date: April 14, 2022
    Inventors: Richard P. Dube, Mark S. Langelier, Paul A. Sefcsik, JR., Jason P. Rosa, Curtis B. Carlsten, Michael F. Janik, Mark R. Franklin, JR.
  • Publication number: 20220024146
    Abstract: A method of coupling polymeric components utilizing electromagnetic energy is disclosed. The method can include obtaining a first component having a first coupling portion, a second component having a second coupling portion, and a susceptor. The method can also include mating the first and second components such that the susceptor is proximate the first and second coupling portions. In addition, the method can include applying electromagnetic energy to the susceptor. The susceptor can convert the electromagnetic energy to heat, which can melt portions of the first and second coupling portions about the susceptor to couple the first and second components to one another upon solidification.
    Type: Application
    Filed: May 24, 2021
    Publication date: January 27, 2022
    Inventors: Curtis B. Carlsten, Peter Willey, Stephanie Gratiano, John Carcone
  • Publication number: 20220029350
    Abstract: An apparatus includes a strain relief formed in helical shape and formed with a U-shaped channel. The strain relief can be used around a cable of a component or a spool extension of a fiber tray.
    Type: Application
    Filed: July 27, 2020
    Publication date: January 27, 2022
    Inventors: Peter M. Willey, Curtis B. Carlsten, John C. Cochran
  • Publication number: 20210375250
    Abstract: A deployment module according to the present application enables both compact stowage of a sensor array and expansion of the sensor array into a three-dimensional volumetric array shape that enables improved directionality of the sensors during operation. The deployment module includes a support shell that is configured to retain a cable of the sensor array separately from sensors of the sensor array and an expandable deployment body formed of a superelastic shape memory alloy that uses superelasticity and stored energy for deployment of the sensor array. During deployment, the deployment body is removed from the support shell and the sensors are subsequently pulled out of the support shell. The deployment body then expands and holds the cable to retain the three-dimensional volumetric shape of the deployed array.
    Type: Application
    Filed: May 27, 2020
    Publication date: December 2, 2021
    Inventors: Curtis B. Carlsten, Frederick B. Koehler, Jason E. Gaudette, Peter M. Willey
  • Patent number: 11168399
    Abstract: A composite structural component is disclosed. The composite structural component can include a lattice structure, a casing disposed about at least a portion of the lattice structure, and a skin adhered to a surface of the casing. The lattice structure and the casing can be formed of a polymeric material and the skin can be formed of a metallic material. A method of manufacturing a composite structural component is disclosed. The method can include creating a casing of a polymeric material and creating a lattice structure of a polymeric material disposed about at least a portion of the casing. The method can include sealing the porosity of the casing and lattice structure. The method can include adhering a skin of a metallic material to at least a portion of the casing. At least one of creating a lattice structure and creating a casing comprises utilizing an additive manufacturing process.
    Type: Grant
    Filed: March 13, 2018
    Date of Patent: November 9, 2021
    Assignee: Raytheon Company
    Inventors: Curtis B. Carlsten, Jonathan Murrow, Erik F. Item
  • Patent number: 11141809
    Abstract: A method and apparatus particularly for additively manufacturing materials that are susceptible to hot cracking. The additive manufacturing process may include a leading energy beam (16) for liquefying a raw material to form a melt pool (20), and a trailing energy beam (17) directed toward a trailing region of the melt pool. The trailing energy beam may be configured to enhance agitation and/or redistribution of liquid in the melt pool to prevent hot cracking, reduce porosity, or improve other characteristics of the solidified part. The method and apparatus also may improve processing parameters, such as adjusting vacuum level to prevent volatilization of alloying agents, or providing a chill plate to control interpass temperature. The process may be used to form new articles, and also may be used to enhance tailorability and flexibility in design or repair of pre-existing articles, among other considerations.
    Type: Grant
    Filed: December 1, 2016
    Date of Patent: October 12, 2021
    Assignee: Raytheon Company
    Inventors: Norman Dana Nelson, Curtis B. Carlsten, Mark J. Pistorino
  • Publication number: 20210302605
    Abstract: A packing module includes a volumetrically efficient structure for separately retaining sensors and a cable of a sensor array. The packing module includes a tray that supports the sensors and a retaining leaf arrangement that extends outwardly from the tray to retain the cable on the tray. The retaining leaf arrangement includes a plurality of nested leaves that are spaced relative to each other. Packing the module includes placing the sensors separately and in succession on the tray and inserting a portion of the cable in the retaining leaf arrangement in between each placing of a sensor. The placement of a sensor and insertion of a portion of the cable occurs alternately until the entire sensor array is accommodated. Deployment of the sensor array may occur by alternately removing a sensor and a portion of the cable until the sensor array is displaced from the module.
    Type: Application
    Filed: March 25, 2020
    Publication date: September 30, 2021
    Inventors: Joseph M. Misulia, Curtis B. Carlsten, Peter M. Willey
  • Patent number: 11047370
    Abstract: A deployment body for a sensor array includes at least one superelastic spring formed of a shape memory alloy (SMA) material that enables activation of the deployment body. The SMA spring is configured to expand from a stowed position in which the SMA spring is wound around a central hub of the deployment body to a deployed position in which the SMA spring is extended in a radially outward direction relative to the central hub. A stiffness of the SMA spring enables the SMA spring to hold cables of the sensor array and maintain a deployed shape of the sensor array, which may be a volumetric array. Using the SMA material is advantageous in that the material is tuned to maintain superelasticity based on at least one of an intended operating temperature and a desired expansion ratio of stowed to deployed diameter of the deployment body.
    Type: Grant
    Filed: May 27, 2020
    Date of Patent: June 29, 2021
    Assignee: Raytheon Company
    Inventors: Frederick B. Koehler, Curtis B. Carlsten, Ward D. Lyman, Jason E. Gaudette
  • Patent number: 10707633
    Abstract: A plug for joining a polyethylene (PE) jacketed cable to a PE tube is provided. The plug includes first and second heating wires and a PE body. The PE body includes a first section and a second section. The first section is insertible into the PE tube and includes a first surface to engage with the PE tube. The first heating wires are embeddable in the first surface. The second section is within the first section and the PE jacketed cable is insertible into the second section. The second section includes a second surface to engage with the PE jacketed cable. The second heating wires are embeddable in the second section.
    Type: Grant
    Filed: September 27, 2018
    Date of Patent: July 7, 2020
    Assignee: RAYTHEON COMPANY
    Inventors: John Carcone, Curtis B. Carlsten, Peter M. Willey
  • Publication number: 20200106228
    Abstract: A plug for joining a polyethylene (PE) jacketed cable to a PE tube is provided. The plug includes first and second heating wires and a PE body. The PE body includes a first section and a second section. The first section is insertible into the PE tube and includes a first surface to engage with the PE tube. The first heating wires are embeddable in the first surface. The second section is within the first section and the PE jacketed cable is insertible into the second section. The second section includes a second surface to engage with the PE jacketed cable. The second heating wires are embeddable in the second section.
    Type: Application
    Filed: September 27, 2018
    Publication date: April 2, 2020
    Inventors: John Carcone, Curtis B. Carlsten, Peter M. Willey