Abstract: Methods and systems for producing circuitry using stackable passive components are discussed. More specifically, the present disclosure provides designs and fabrication methods for production of stackable devices that may be used as components in circuitry such as filters and impedance matching adaptors. Such components may be used to save space in printed circuit boards. Moreover, stackable passive components may be dual components, which may be improve the electrical performance in certain types of circuits such as matched component filters.

Abstract: Multilayer ceramic capacitor structures may include structural arrangements, materials, and/or substrate modifications that can improve the reliability of the capacitor for long-term usage when faced with environmental stress. Embodiments may implement reduced entryways in the termination patterns of the capacitor to decrease damage potential due to exposure of moisture. Embodiments may implement structures that decrease interfaces with different physical characteristics, which may lead to a reduction in the formation of micro-fractures during regular usage. Methods of manufacture for the features that improve reliability are also detailed.

Abstract: Multilayer ceramic capacitor structures may include structural arrangements, materials, and/or substrate modifications that can improve the reliability of the capacitor for long-term usage when faced with environmental stress. Embodiments may implement reduced entryways in the termination patterns of the capacitor to decrease damage potential due to exposure of moisture. Embodiments may implement structures that decrease interfaces with different physical characteristics, which may lead to a reduction in the formation of micro-fractures during regular usage. Methods of manufacture for the features that improve reliability are also detailed.

Abstract: Monolithic capacitor structures having a main capacitor and a vise capacitor are discussed. The vise capacitor provides to the monolithic capacitor structure reduced vibrations and/or acoustic noise due to piezoelectric effects. To that end, vise capacitor may cause piezoelectric deformations that compensate the deformations that are caused by the electrical signals in the main capacitor. Embodiments of these capacitor structures may have the main capacitor and the vise capacitor sharing portions of a rigid dielectric. Electrical circuitry that employs the vise capacitor to reduce noise and/or vibration in the monolithic capacitor structures is also described. Methods for fabrication of these capacitors are discussed as well.

Abstract: A printed circuit board (PCB) assembly having several electronic components mounted on a PCB and a damping layer covering the electronic components, is disclosed. Embodiments of the PCB assembly include an overmold layer constraining the damping layer against the PCB. Embodiments of the PCB assembly include an interposer between a capacitor of the electronic components and the PCB. Other embodiments are also described and claimed.

Abstract: Systems and methods described in this disclosure are related to fabrication and utilization of two-terminal electrical components that may have terminations with reduced width. Components, such as the ones described herein may be used to increase the density of components in electrical devices, as they may reduce a separation distance between devices that lead to solder bridging. Methods for fabrication are also described, including the use of ceramic layers that may provide reduction in parasitic capacitance and/or inductances.

Abstract: Monolithic capacitor structures having a main capacitor and a vise capacitor are discussed. The vise capacitor provides to the monolithic capacitor structure reduced vibrations and/or acoustic noise due to piezoelectric effects. To that end, vise capacitor may cause piezoelectric deformations that compensate the deformations that are caused by the electrical signals in the main capacitor. Embodiments of these capacitor structures may have the main capacitor and the vise capacitor sharing portions of a rigid dielectric. Electrical circuitry that employs the vise capacitor to reduce noise and/or vibration in the monolithic capacitor structures is also described. Methods for fabrication of these capacitors are discussed as well.

Abstract: Methods and systems for producing circuitry using stackable passive components are discussed. More specifically, the present disclosure provides designs and fabrication methods for production of stackable devices that may be used as components in circuitry such as filters and impedance matching adaptors. Such components may be used to save space in printed circuit boards. Moreover, stackable passive components may be dual components, which may be improve the electrical performance in certain types of circuits such as matched component filters.

Abstract: Methods and devices related to fabrication and utilization of multilayer capacitors presenting low equivalent series resistance (ESR) is illustrated. The capacitors may present electrodes that are coupled to metallic terminations at the bottom and/or at the side of the capacitor. The position of the electrode coupling may lead to smaller current paths in the MLCC electrode, which may decrease line inductances. Methods and systems for fabrication of the capacitors described are also discussed.

Abstract: Systems and methods described in this disclosure are related to fabrication and utilization of two-terminal electrical components that may have terminations with reduced width. Components, such as the ones described herein may be used to increase the density of components in electrical devices, as they may reduce a separation distance between devices that lead to solder bridging. Methods for fabrication are also described, including the use of ceramic layers that may provide reduction in parasitic capacitance and/or inductances.

Abstract: A printed circuit board (PCB) assembly having several electronic components mounted on a PCB and a damping layer covering the electronic components, is disclosed. Embodiments of the PCB assembly include an overmold layer constraining the damping layer against the PCB. Embodiments of the PCB assembly include an interposer between a capacitor of the electronic components and the PCB. Other embodiments are also described and claimed.

Abstract: An electronic device may have a source of magnetic field such as a magnet that produces a static magnetic field. A flexible printed circuit may have a flexible tail that surrounds a central portion. The central portion may overlap the magnet. Electrical components may be mounted to the central portion. To prevent undesired vibrations and noise due to interactions between magnetic fields induced by signals flowing in signal lines in the flexible printed circuit and the static magnetic field, the signal lines may be vertically stacked or may be routed along a curved path that does not overlap the magnet. The tail may serve as a service loop that allows a portion of a housing for the device and electrical components mounted to the central portion in alignment with windows in the housing to be detached for servicing.

Abstract: An electronic device may has e a source of magnetic field such as a magnet that produces a static magnetic field. A flexible printed circuit may have a flexible tail that surrounds a central portion. The central portion may overlap the magnet. Electrical components may be mounted to the central portion. To prevent undesired vibrations and noise due to interactions between magnetic fields induced by signals flowing in signal lines in the flexible printed circuit and the static magnetic field, the signal lines may be vertically stacked or may be routed along a curved path that does not overlap the magnet. The tail may serve as a service loop that allows a portion of a housing for the device and electrical components mounted to the central portion in alignment with windows in the housing to be detached for servicing.

Abstract: An electronic device may have a source of magnetic field such as a magnet that produces a static magnetic field. A flexible printed circuit may have a flexible tail that surrounds a central portion. The central portion may overlap the magnet. Electrical components may be mounted to the central portion. To prevent undesired vibrations and noise due to interactions between magnetic fields induced by signals flowing in signal lines in the flexible printed circuit and the static magnetic field, the signal lines may be vertically stacked or may be routed along a curved path that does not overlap the magnet. The tail may serve as a service loop that allows a portion of a housing for the device and electrical components mounted to the central portion in alignment with windows in the housing to be detached for servicing.

Abstract: An electronic device may have a source of magnetic field such as a magnet that produces a static magnetic field. A flexible printed circuit may have a flexible tail that surrounds a central portion. The central portion may overlap the magnet. Electrical components may be mounted to the central portion. To prevent undesired vibrations and noise due to interactions between magnetic fields induced by signals flowing in signal lines in the flexible printed circuit and the static magnetic field, the signal lines may be vertically stacked or may be routed along a curved path that does not overlap the magnet. The tail may serve as a service loop that allows a portion of a housing for the device and electrical components mounted to the central portion in alignment with windows in the housing to be detached for servicing.