Patents by Inventor Curtis E. Miller

Curtis E. Miller has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Key distribution
    Patent number: 7853640
    Abstract: The distribution of Bluetooth IDs among multiple integrated circuit testers at multiple sites for programming with a master database containing large size ID blocks, site operational databases with medium size ID blocks and tester programs with small size ID blocks provides reduced memory requirements and limits the chance of two units with a duplicate ID.
    Type: Grant
    Filed: September 7, 2004
    Date of Patent: December 14, 2010
    Assignee: Texas Instruments Incorporated
    Inventors: Glenn E. Schuette, Edward J. Russell, Curtis E. Miller, Xinqun Zeng
  • System and method for resumed probing of a wafer
    Patent number: 7323899
    Abstract: According to one embodiment of the invention, a method for resuming the probing of a wafer includes identifying a data set associated with a wafer. The data set identifies at least one unprobed die supported on the surface of the wafer. The method also includes determining that the data set associated with the wafer is useable and generating a probe map of the wafer from the data set. The probe map identifies a physical position associated with each unprobed die supported on the surface of the wafer. The probe map and one or more probe commands are communicated to a probe module to drive the probe module in resuming the probe of the wafer.
    Type: Grant
    Filed: October 19, 2006
    Date of Patent: January 29, 2008
    Assignee: Texas Instruments Incorporated
    Inventors: Glenn E Schuette, James E Rousey, Curtis E Miller
  • System and method for the probing of a wafer
    Patent number: 7148716
    Abstract: According to one embodiment of the invention, a method for resuming the probing of a wafer includes identifying a data set associated with a wafer. The data set identifies at least one unprobed die supported on the surface of the wafer. The method also includes determining that the data set associated with the wafer is useable and generating a probe map of the wafer from the data set. The probe map identifies a physical position associated with each unprobed die supported on the surface of the wafer. The probe map and one or more probe commands are communicated to a probe module to drive the probe module in resuming the probe of the wafer.
    Type: Grant
    Filed: June 10, 2004
    Date of Patent: December 12, 2006
    Assignee: Texas Instruments Incorporated
    Inventors: Glenn E. Schuette, James E. Rousey, Curtis E. Miller