Patents by Inventor Curtis Edward Farrell

Curtis Edward Farrell has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic devices having metallurgies containing copper-semiconductor compounds
    Patent number: 5855993
    Abstract: Silicon and germanium containing materials are used at surface of conductors in electronic devices. Solder can be fluxlessly bonded and wires can be wire bonded to these surfaces. These material are used as a surface coating for lead frames for packaging integrated circuit chips. These materials can be decal transferred onto conductor surfaces or electrolessly or electrolytically disposed thereon.
    Type: Grant
    Filed: February 22, 1994
    Date of Patent: January 5, 1999
    Assignee: International Business Machines Corporation
    Inventors: Michael John Brady, Curtis Edward Farrell, Sung Kwon Kang, Jeffrey Robert Marino, Donald Joseph Mikalsen, Paul Andrew Moskowitz, Eugene John O'Sullivan, Terrence Robert O'Toole, Sampath Purushothaman, Sheldon Cole Rieley, George Frederick Walker