Abstract: A quantum mechanical circuit includes a substrate; a first electrical conductor and a second electrical conductor provided on the substrate and spaced apart to provide a gap therebetween; and a third electrical conductor to electrically connect the first electrical conductor and the second electrical conductor. The third electrical conductor is a poor thermal conductor.

Abstract: Mounting a heat sink to an electrical component by applying a thermal interface material on at least one of a surface of one of the electrical component and the heat sink, wherein the heat sink includes a heat pedestal including an interface surface with an apex having at least one curvature extending therethrough. The heat sink contacts the electrical component through the thermal interface material. The apex of the interface surface is an element of the heat sink closest to the electrical component. The interface surface that includes the apex and the at least one curvature cause the thermal interface material to flow during the contacting so that any space between the heat sink and the electrical component is filled with thermal interface material and is substantially free of voids.

Abstract: A quantum mechanical circuit includes a substrate; a first electrical conductor and a second electrical conductor provided on the substrate and spaced apart to provide a gap therebetween; and a third electrical conductor to electrically connect the first electrical conductor and the second electrical conductor. The third electrical conductor is a poor thermal conductor.

Abstract: A quantum mechanical circuit includes a substrate; a first electrical conductor and a second electrical conductor provided on the substrate and spaced apart to provide a gap therebetween; and a third electrical conductor to electrically connect the first electrical conductor and the second electrical conductor. The third electrical conductor is a poor thermal conductor.

Abstract: A quantum mechanical circuit includes a substrate; a first electrical conductor and a second electrical conductor provided on the substrate and spaced apart to provide a gap therebetween; and a third electrical conductor to electrically connect the first electrical conductor and the second electrical conductor. The third electrical conductor is a poor thermal conductor.

Abstract: A storage device includes a bottom surface, a plurality of sides, and a top surface. The top surface integrally couples to the plurality of sides. The bottom surface, the plurality of sides, and the top surface form an outer surface of the storage device. The top surface, when coupled to the bottom surface, contacts one or more internal components of the storage device. The top surface comprises a plurality of finned ridges and a smooth continuous mounting surface. The plurality of finned ridges protrudes away from the outer surface of the storage device. The plurality of finned ridges is formed to direct heat away from the storage device. The smooth continuous mounting surface is configured to accept attachment of a thermal dissipation module.

Abstract: A storage device includes a bottom surface, a plurality of sides, and a top surface. The top surface integrally couples to the plurality of sides. The bottom surface, the plurality of sides, and the top surface form an outer surface of the storage device. The top surface, when coupled to the bottom surface, contacts one or more internal components of the storage device. The top surface comprises a plurality of finned ridges and a smooth continuous mounting surface. The plurality of finned ridges protrudes away from the outer surface of the storage device. The plurality of finned ridges is formed to direct heat away from the storage device. The smooth continuous mounting surface is configured to accept attachment of a thermal dissipation module.