Patents by Inventor Curtis G. Knaub

Curtis G. Knaub has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7572131
    Abstract: An electrical interconnect system for providing electrical connection between two or more opposing arrays of contact areas, the electrical interconnect having a conductive substrate and conductors electrically isolated from the substrate.
    Type: Grant
    Filed: March 13, 2007
    Date of Patent: August 11, 2009
    Assignee: Tyco Electronics Corporation
    Inventors: Wayne S. Alden, III, Jeffery W. Mason, Peter Wapenski, Curtis G. Knaub
  • Publication number: 20080227307
    Abstract: An electrical interconnect system for providing electrical connection between two or more opposing arrays of contact areas, the electrical interconnect having a conductive substrate and conductors electrically isolated from the substrate.
    Type: Application
    Filed: March 13, 2007
    Publication date: September 18, 2008
    Applicant: Tyco Electronics Corporation
    Inventors: Wayne S. Alden, Jeffrey W. Mason, Peter Wapenski, Curtis G. Knaub
  • Patent number: 7326068
    Abstract: A connector assembly includes a first elastomeric connector having a plurality of alternating elastomeric conductors and elastomer insulators. The first elastomeric connector has first and second contact interfaces spaced apart from one another and extending generally perpendicular to the conductors and insulators. The connector assembly also includes a second elastomeric connector having a plurality of alternating elastomeric conductors and elastomer insulators. The second elastomeric connector has first and second contact interfaces spaced apart from one another and extending generally perpendicular to the conductors and insulators. A holder includes a body extending between first and second opposing surfaces, and the body defines a first recess housing the first elastomeric connector and a second recess housing the second elastomeric connector.
    Type: Grant
    Filed: July 26, 2005
    Date of Patent: February 5, 2008
    Assignee: Tyco Electronics Corporation
    Inventors: Hans B. Sturm, Curtis G. Knaub, Vishwa N. Shukla, Edward J. Pupkiewicz
  • Patent number: 6752639
    Abstract: A connector assembly having a supporting boot and a connector that is retained with the boot and a method for producing the connector assembly. The boot serves as a retention member that includes a through opening sized to receive the connector. The boot includes first and second opposing surfaces. In a preferred embodiment, the opening at the second surface of the boot is sized for an interference fit with the connector. The opening adjacent the first surface of the boot is larger than the opening at the second body surface. The differential sizes of the though hole openings at respective ends of the through-hole provides a flow channel between the connector and the boot. Wells are provided in the first surface of the boot for a binding agent. A liquid binding agent that is injected into the wells flows through the flow channel and securely fixes the connector within the boot.
    Type: Grant
    Filed: February 20, 2003
    Date of Patent: June 22, 2004
    Assignee: Tyco Electronics Corporation
    Inventors: Michael Kirkman, Joseph A. Kiszka, Curtis G. Knaub, Vishwa Nath Shukla
  • Patent number: 6442045
    Abstract: A method for securing a contact assembly to a frame in an integrated circuit socket via cold forming. A plurality of posts are integrally formed with and extend from the bottom surface of the frame of an integrated circuit device socket. The contact assembly includes a plurality of conductive columns mounted within an insulating sheet in a predetermined contact pattern. The insulating sheet also has a plurality of post receiving apertures that are selectively positioned such that the posts extend through corresponding apertures in the insulating sheet when the contact assembly is positioned in a mounting position on the bottom surface of the frame. The posts are cold staked to expand the diameter of the post ends and to secure the contact assembly to the frame.
    Type: Grant
    Filed: November 7, 2001
    Date of Patent: August 27, 2002
    Assignee: Tyco Electronics Corporation
    Inventors: Jonathan W. Goodwin, Curtis G. Knaub
  • Patent number: 6400577
    Abstract: An integrated circuit socket assembly including a frame and a contact assembly has EMI shielding integral with the socket frame. In one embodiment, the integrated circuit socket includes a cocket for a Land Grid Array (LGA) or Ball Grid Array (BGA) device. EMI shielding in the form of a conductive shielding member is disposed in opening that extend through side portions one each of the sides of the frame. The conductive shielding members extend slightly below the lower surface of the the frame so as to make contact with cooperative conductive areas on a printed circuit board when the socket assembly is mounted to the printed circuit board in amounting position. The conductive shielding members may extend above the upper surface of the frame so as to contact a conductive heat sink mounted above the socket assembly. In a preferred embodiment, the conductive members comprise resilient conductive shielding members.
    Type: Grant
    Filed: August 30, 2001
    Date of Patent: June 4, 2002
    Assignee: Tyco Electronics Corporation
    Inventors: Jonathan W. Goodwin, Chuanlong Yue, Curtis G. Knaub