Abstract: A circuit control device includes two intermating foil pads separated from one another by a narrow gap having a maximum dimension of 0.006 inches. A circuit path having one side connected to one of the pads and a second side connected to the other of the pads is selectively closed and opened by solder application and removal operations. Interdigitated, triangular fingers which are intermated to form the device ensure the formation of acutely angled junctures along the gap to ensure solder bridging of the gap. Emergency control elements are coupled to the circuit control device to permit control of an associated circuit path if the circuit control device itself fails. In that event, an emergency control device is coupled to the emergency control elements to control opening and closing of the circuit path.

Abstract: An adaptor for interfacing a surface mount or through-hole electrical component to a printed circuit board. In one orientation of the adaptor relative to the printed circuit board, the adaptor receives a through-hole component and interfaces this component to a printed circuit board position designed for a surface mount component. In another orientation of the adaptor relative to the printed circuit board, the adaptor receives a surface mount component and interfaces this component to a printed circuit board position designed for a through-hole component. Advantageously, the adaptor is compatible with high-volume assembly techniques, such as wave soldering and machine insertion.

Abstract: A heating device is disclosed wherein a printed circuit board is uniformly preheated before discrete electronic components are soldered onto the boards. The soldering process includes a reflow stage where the boards are subject to rapid temperature change causing internal heat stresses which warp the boards if they haven't been preheated. The device comprises a non-conductive body and conductive elements, such as steel staples, embedded in said body. The staples extend through both sides of said body making contact with a heating surface and supporting the printed circuit board which sits upon them. The staples are spaced and arranged so the components' electrical pins which extend beyond the bottom surface of the board pass into the bed of staples without interference. Therefore, heat is transferred from the heating surface directly to the board via the conducting staples in a uniform fashion.