Abstract: A method of fabricating a memory card. The method comprises the initial step of providing a leadframe which has a dambar and a plurality of contacts, each of the contacts being attached to the dambar by at least one tie bar. A layer of tape is applied to the leadframe such that the tape covers at least portions of the top contact surfaces of the contacts, at least portions of the top tie bar surfaces of the tie bars, and at least a portion of the top dambar surface of the dambar. Thereafter, the tie bars are removed from the leadframe. At least one semiconductor die is then electrically connected to the leadframe, with a body thereafter being formed on the leadframe such that the semiconductor die and the tape are covered by the body and the bottom contact surfaces are exposed in an exterior surface thereof.

Abstract: A memory card comprising a leadframe having at least one die pad, a plurality of contacts, and a plurality of conductive traces extending from respective ones of the contacts toward the die pad. The traces are bent in a manner wherein the die pad and the contacts extend along respective ones of spaced, generally parallel frame planes. Disposed on and extending from the die pad and the traces is a plurality of stand-offs. At least one semiconductor die is attached to the die pad and electrically connected to at least one of the traces. A body at least partially encapsulates the leadframe and the semiconductor die such that the contacts are exposed in a bottom surface defined by the body.