Patents by Inventor Curtis Miller
Curtis Miller has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8151733Abstract: A filter top assembly for a cage, wherein the assembly includes a bonnet having a perforated top wall to protect filter paper placed above the top wall. The perforations may be small enough to prevent an animal from getting a purchase position and spaced apart sufficiently to prevent the animal from biting the spacing between the perforations. The bonnet may also include one or more elevated ribs to retain the filter paper suspended above the bonnet.Type: GrantFiled: August 21, 2009Date of Patent: April 10, 2012Assignee: Lab Products, Inc.Inventors: George S. Gabriel, Neil E. Campbell, Chinsoo Park, Curtis Miller, Lynn Irwin, Rodney Gerringer, Dale Murray, Arleen Murray, legal representative
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Publication number: 20100132623Abstract: A filter top assembly for a cage, wherein the assembly includes a bonnet having a perforated top wall to protect filter paper placed above the top wall. The perforations may be small enough to prevent an animal from getting a purchase position and spaced apart sufficiently to prevent the animal from biting the spacing between the perforations. The bonnet may also include one or more elevated ribs to retain the filter paper suspended above the bonnet.Type: ApplicationFiled: August 21, 2009Publication date: June 3, 2010Inventors: George S. Gabriel, Neil E. Campbell, Chinsoo Park, Curtis Miller, Lynn Irwin, Rodney Gerringer, Dale Murray, Arleen Murray
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Publication number: 20090283920Abstract: A ball-bump bonded ribbon-wire interconnect has a ball-bump attached to an integrated circuit's bond pad. A ribbon-wire has one end attached to the ball-bump and its opposing end attached to a substrate's metallized surface. The ribbon-wire may be wider than the ball-bump, and the ball-bump may separate the ribbon-wire from the integrated circuit's surface. The ribbon-wire may interconnect multiple integrated circuits, each of which has a ball-bump or a suitably wide metallized surface, to a substrate's metallized surface. The present invention also includes a method of electrically connecting an electronic component to a substrate.Type: ApplicationFiled: May 16, 2008Publication date: November 19, 2009Applicant: TEKTRONIX, INC.Inventors: Dale E. Christensen, Curtis MILLER
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Publication number: 20090125425Abstract: A method for auditable tracking of a shipment is described. The method includes providing instructions for execution on a server and for execution on a mobile device. The instructions for execution on the server include at least one code segment configured to: receive a request from a shipper to ship a plurality of goods, receive logistics information from a logistics company in response to the request form the shipper, receive from the shipper a bill of lading (BOL), and receive from the logistics company data identifying a quantity of the plurality of goods that was delivered. The instructions for execution on the mobile device include at least one code segment configured to: enable a user to edit the BOL responsive to an inspection by the user of the delivered plurality of goods, and provide the edited BOL to the server, the shipper, and the logistics company.Type: ApplicationFiled: October 31, 2008Publication date: May 14, 2009Applicant: HUNTER E. RILEY, LLCInventors: David D. Kloostra, Curtis Miller
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Publication number: 20090095697Abstract: A ventilated cage and rack system for assembly by a user using simple tools and a method for assembly is provided. A plurality of frames and vertical plenums can be connected to a base, and a retaining assembly can be used to connect a plurality of vertical beams and horizontal support beams. A plurality of canopies is preferably used to connect the plenums and the support beams to shroud cages beneath the canopies. The canopies preferably include removable side walls to adapt to the width of the cage being shrouded. A plenum clean out system preferably provides a relatively simple method of draining a cleaning fluid from a plenum by moving a lever between an open and closed position. A pressure based plenum system is also provided wherein a constant air pressure is maintained in the ventilated rack system and air is provided into a cage at a constant air pressure.Type: ApplicationFiled: October 12, 2007Publication date: April 16, 2009Inventors: George S. Gabriel, Neil E. Campbell, Chin Soo Park, Dale Murray, Lynn Irwin, Rodney Gerringer, Edward K. Eldreth, Philip A. Lastowski, Curtis Miller
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Publication number: 20080061934Abstract: A method and system for quickly and reliably processing a high volume of messages. In one embodiment, text messages are submitted by mobile phone subscribers to cast votes. The votes are recorded and replies are returned in near real time by updating a state in active memory for each subscriber that submits a message. To provide scaling and reliability, a message summary is also used to distribute the processing over a number of master-slave pairs that are each defined to access certain messages based on one or more message characteristics, such as an area code of the submitting subscriber. Campaign processing rules are applied to the summary to produce a subscriber state change, which indicates a corresponding reply to be returned. Billing and other administrative operations are done on a post processing basis so as not to slow the vote processing.Type: ApplicationFiled: September 12, 2007Publication date: March 13, 2008Applicant: Wireless Services Corp.Inventors: Larry Setlow, Curtis Miller, Alan Lindsay, David Smith, John Kuhlmann, Thomas Cast, Jeff Steinborn, Eric Lofdahl
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Publication number: 20070276915Abstract: Identifying a reply message using a relatively limited number of message source identifiers divided among multiple enterprises. In an exemplary embodiment, a message is sent with a source device to one or more target mobile devices on one or more wireless carriers. Each target mobile device can be associated with multiple enterprises. A gateway assigns one of a limited number of long codes to the message for each wireless carrier. The long code is selected from a sub-block of long codes that are associated with one of the multiple enterprises. Each long code identifies the gateway as a return address for the message. Upon receiving a second message, addressed to the long code, the gateway examines an associated target mobile device inbox for a message assigned the same long code. If a matching message exists, the gateway interprets the second message is a reply to the first message.Type: ApplicationFiled: August 14, 2007Publication date: November 29, 2007Applicant: Wireless Services Corp.Inventors: Larry Setlow, Thomas Cast, Alan Lindsay, Curtis Miller, Eric Lofdahl, John Kuhlmann
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Publication number: 20070233795Abstract: A method and system for identifying a reply message using a relatively limited number of message source identifiers. In an exemplary embodiment, a message is sent with a source device to one or more target mobile devices on one or more wireless carriers. A gateway assigns one of a limited number of long codes to the message for each wireless carrier. Each long code identifies the gateway as a return address for the message. The gateway also stores the message in a virtual inbox for each target mobile device. When a target mobile device sends a second message to the long code, the gateway examines the associated inbox for a message assigned the same long code. If the gateway finds a matching message, the gateway interprets the second message received from the target mobile device as a reply to the first message.Type: ApplicationFiled: April 4, 2006Publication date: October 4, 2007Applicant: Wireless Services Corp.Inventors: Larry Setlow, Thomas Cast, Alan Lindsay, Curtis Miller, Eric Lofdahl, John Kuhlmann
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Patent number: 7246762Abstract: A process for milling corn comprises mixing water and corn kernels to provide a tempering mixture; holding the tempering mixture for a time and temperature effective for lifting hull off from the endosperm of the corn kernels, but a time and temperature which is not effective for moisture to substantially penetrate into the endosperm of the corn kernels; and abrasively removing germ and bran from the moistened tempered corn of the corn kernels. In one embodiment, whole corn kernels are separated into large kernel and small corn components and the large and small corn components are milled separately.Type: GrantFiled: April 20, 2004Date of Patent: July 24, 2007Assignee: Cargill, IncorporatedInventors: Michael VanHouten, Curtis Miller, Fritz L. Piel
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Publication number: 20070080705Abstract: According to one embodiment of the invention, a method for resuming the probing of a wafer includes identifying a data set associated with a wafer. The data set identifies at least one unprobed die supported on the surface of the wafer. The method also includes determining that the data set associated with the wafer is useable and generating a probe map of the wafer from the data set. The probe map identifies a physical position associated with each unprobed die supported on the surface of the wafer. The probe map and one or more probe commands are communicated to a probe module to drive the probe module in resuming the probe of the wafer.Type: ApplicationFiled: October 19, 2006Publication date: April 12, 2007Applicant: Texas Instruments IncorporatedInventors: Glenn Schuette, James Rousey, Curtis Miller
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Publication number: 20060172524Abstract: Techniques for ball bonding wires in an integrated circuit are provided which allow formation of desired wire bond profile shapes for optimal performance. A wire is ball bonded to a first bond site in the integrated circuit with a bonding tool and at least one bend is formed in the wire. The wire is terminated at a second bond site with the bonding tool, thereby creating a wire bond profile. The technique is repeated for a plurality of additional wire bonds of the integrated circuit, and at least two wire bond profiles in the integrated circuit are substantially perpendicular to one another at a crossing point of the profiles.Type: ApplicationFiled: March 31, 2006Publication date: August 3, 2006Inventors: Curtis Miller, Nelson Troncoso
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Publication number: 20060026503Abstract: An appearance manager for editing and previewing a portion of a Web page, such as a header and/or a footer. A browser-based appearance manager user interface enables a user to edit, validate, and store source markup code of the portion of the Web page without affecting a corresponding deployed Web page. The appearance manager can render the portion of the Web page separate from the remainder of the corresponding deployed Web page or together with the remainder of the corresponding deployed Web page. In either case, the rendering is done separate from the corresponding deployed Web page, so as not to affect the deployed Web page, which is accessible to client browsers. When rendering together, the appearance manager accesses and applies the same stylesheet that is applied to the corresponding deployed Web page. Thus, the user can preview revised portions of the Web page as they will appear when deployed.Type: ApplicationFiled: April 6, 2005Publication date: February 2, 2006Applicant: Wireless Services CorporationInventors: David Bartosh, Hector Chejfec, Curtis Miller, Eric Lofdahl, John Kuhlmann, David Hoogerwerf, Kristine Siebert, Larry Setlow, Alan Lindsay
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Publication number: 20060026242Abstract: Detecting unsolicited messages (spam) by aggregating information across multiple recipients and/or across the same or differing messaging protocols. Multiple messages are analyzed to detect a call to action pattern that specifies a target communication address with which the recipients are requested to communicate, such as an email address, an Internet address, a telephone number, and the like. Once a frequency threshold of messages containing the call to action pattern is reached, subsequent messages are temporarily quarantined for evaluation by a human operator. If the human determines that the messages are not spam, the human can release the quarantined messages, and indicate that future messages with the call to action pattern are not to be delayed. Conversely, if the human determines that the messages are spam, the human can delete the messages in quarantine, and indicate that all future messages with that call to action pattern are to be deleted automatically.Type: ApplicationFiled: July 30, 2004Publication date: February 2, 2006Inventors: John Kuhlmann, Eric Lofdahl, Curtis Miller, David Hoogerwerf, Kristine Siebert, Larry Setlow, Alan Lindsey
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Publication number: 20050275421Abstract: According to one embodiment of the invention, a method for resuming the probing of a wafer includes identifying a data set associated with a wafer. The data set identifies at least one unprobed die supported on the surface of the wafer. The method also includes determining that the data set associated with the wafer is useable and generating a probe map of the wafer from the data set. The probe map identifies a physical position associated with each unprobed die supported on the surface of the wafer. The probe map and one or more probe commands are communicated to a probe module to drive the probe module in resuming the probe of the wafer.Type: ApplicationFiled: June 10, 2004Publication date: December 15, 2005Inventors: Glenn Schuette, James Rousey, Curtis Miller
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Publication number: 20050191793Abstract: A method for attaching at least one IC die to a non-ceramic IC package including a leadframe and a base, the IC package being configured for receiving the at least one IC die, includes attaching the IC die to an upper surface of a thermal carrier in a manner which facilitates thermal transfer between the die and the carrier. The method further includes attaching the thermal carrier having the IC die attached thereto to an upper surface of the base of the IC package. In this manner, one or more IC dies may be attached to a standard plastic IC package without a significant impact on thermal transfer in the device and at a significant cost savings compared to ceramic IC packages.Type: ApplicationFiled: February 26, 2004Publication date: September 1, 2005Inventors: John Brennan, Joseph Freund, Curtis Miller, Richard Shanaman
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Publication number: 20050176232Abstract: Techniques for ball bonding wires in an integrated circuit are provided which allow formation of desired wire bond profile shapes for optimal performance. A wire is ball bonded to a first bond site in the integrated circuit with a bonding tool and at least one bend is formed in the wire. The wire is terminated at a second bond site with the bonding tool, thereby creating a wire bond profile. The technique is repeated for a plurality of additional wire bonds of the integrated circuit, and at least two wire bond profiles in the integrated circuit are substantially perpendicular to one another at a crossing point of the profiles.Type: ApplicationFiled: February 25, 2004Publication date: August 11, 2005Inventors: Curtis Miller, Nelson Troncoso
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Publication number: 20050055671Abstract: The distribution of Bluetooth IDs among multiple integrated circuit testers at multiple sites for programming with a master database containing large size ID blocks, site operational databases with medium size ID blocks and tester programs with small size ID blocks provides reduced memory requirements and limits the chance of two units with a duplicate ID.Type: ApplicationFiled: September 7, 2004Publication date: March 10, 2005Inventors: Glenn Schuette, Edward Russell, Curtis Miller, Xinqun Zenq
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Publication number: 20040258814Abstract: A process for milling corn comprises mixing water and corn kernels to provide a tempering mixture; holding the tempering mixture for a time and temperature effective for lifting hull off from the endosperm of the corn kernels, but a time and temperature which is not effective for moisture to substantially penetrate into the endosperm of the corn kernels; and abrasively removing germ and bran from the moistened tempered corn of the corn kernels. In one embodiment, whole corn kernels are separated into large kernel and small corn components and the large and small corn components are milled separately.Type: ApplicationFiled: April 20, 2004Publication date: December 23, 2004Applicant: Cargill, Inc.Inventors: Michael VanHouten, Curtis Miller, Fritz L. Piel
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Patent number: 6559513Abstract: A planar MESFET transistor includes a plurality of FET elements. Each FET element includes a doped planar channel, and source and drain coupled to the ends of the channel. A gate conductor extends over a portion of the channel at a location lying between the source and drain, a first predetermined distance from the drain. A field plate is connected to the gate conductor, and extends toward the drain a second predetermined distance, isolated from the channel except at its gate conductor connection by a dielectric material.Type: GrantFiled: April 22, 2002Date of Patent: May 6, 2003Assignee: M/A-Com, Inc.Inventors: Dain Curtis Miller, Inder J. Bahl, Edward L. Griffin
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Publication number: 20020165483Abstract: A medical fluid delivery system for reactive fluids such as tissue adhesive fluids including fibrin glues whereby reactive fluids in separate syringes are expelled from the system while a separate compressed gas is released around, adjacent to, or proximate the expelled reactive fluids such that the fluids and gas mix and are propelled onto a site.Type: ApplicationFiled: November 13, 2001Publication date: November 7, 2002Inventors: Curtis Miller, Jon Hoogenakker, Alan Lonnemann