Patents by Inventor Curtis Moyer

Curtis Moyer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8999778
    Abstract: Some embodiments include a method of providing a semiconductor device. The method can include: (a) providing a flexible substrate; (b) depositing at least one layer of material over the flexible substrate, wherein the deposition of the at least one layer of material over the flexible substrate occurs at a temperature of at least 180° C.; and (c) providing a diffusion barrier between a metal layer and an a-Si layer. Other embodiments are disclosed in this application.
    Type: Grant
    Filed: November 17, 2011
    Date of Patent: April 7, 2015
    Assignee: Arizona Board of Regents
    Inventors: Shawn O'Rourke, Curtis Moyer, Scott Ageno, Dirk Bottesch, Barry O'Brien, Michael Marrs
  • Patent number: 8877571
    Abstract: Methods of anodizing aluminum using a hard mask and related embodiments of semiconductor devices are disclosed herein. Other methods and related embodiments are also disclosed herein.
    Type: Grant
    Filed: December 7, 2011
    Date of Patent: November 4, 2014
    Assignee: Arizona Board of Regents, a Body Corporate of the State of Arizona Acting for and on Behalf of Arizona State University
    Inventors: Jovan Trujillo, Curtis Moyer
  • Publication number: 20120097961
    Abstract: Methods of anodizing aluminum using a hard mask and related embodiments of semiconductor devices are disclosed herein. Other methods and related embodiments are also disclosed herein.
    Type: Application
    Filed: December 7, 2011
    Publication date: April 26, 2012
    Applicants: Arizona State University
    Inventors: Jovan Trujillo, Curtis Moyer
  • Publication number: 20120061672
    Abstract: Some embodiments include a method of providing a semiconductor device. The method can include: (a) providing a flexible substrate; (b) depositing at least one layer of material over the flexible substrate, wherein the deposition of the at least one layer of material over the flexible substrate occurs at a temperature of at least 180° C.; and (c) providing a diffusion barrier between a metal layer and an a-Si layer. Other embodiments are disclosed in this application.
    Type: Application
    Filed: November 17, 2011
    Publication date: March 15, 2012
    Applicants: Arizona State University
    Inventors: Shawn O'Rourke, Curtis Moyer, Scott Ageno, Dirk Bottesch, Barry O'Brien, Michael Marrs