Abstract: A cleaning apparatus for removing metallic buildup from forming surfaces of metal forming dies while the dies are in a press and operating at elevated temperatures. The cleaning apparatus includes a programmable positioner having a robotic arm with an end effector carrying a brush assembly. The brush assembly includes a rotary drive motor rotatably carrying a metallic wire brush. The brush has a plurality of radially extending plain carbon steel bristles having tips adapted for removing metallic buildup from the forming surfaces of dies. The positioner operates to move the rotatable wire brush in a predetermined path that engages the brush with the forming surfaces of the dies for sweeping and cleaning metallic buildup from the forming surfaces.