Abstract: Systems and methods for product declaration validation are provided. Aspects include receiving, by a processor, component data for a component. Obtaining, by the processor, environmental compliance data. Obtaining, by the processor, historical component data associated with the component. Determining a risk score for the component based on a feature vector, generated by a machine learning model, comprising a plurality of features extracted from the component data, environmental compliance data, and the historical component data and presenting the risk score for the component to a user.

Abstract: Systems and methods for product declaration validation are provided. Aspects include receiving, by a processor, component data for a component. Obtaining, by the processor, environmental compliance data. Obtaining, by the processor, historical component data associated with the component. Determining a risk score for the component based on a feature vector, generated by a machine learning model, comprising a plurality of features extracted from the component data, environmental compliance data, and the historical component data and presenting the risk score for the component to a user.

Abstract: A method for electrically insulating a connector module mounted on a printed circuit board assembly, the method including coating a first portion of a piece of sheet metal with an insulation material, forming the piece of sheet metal into a metal frame, wherein a second portion of the piece of sheet metal not coated with the insulation material is formed into a grounding pin, assembling the connector module, wherein components of the connector module include the metal frame, a housing, and a set of external pins, and mounting the connector module on a printed circuit board to form a printed circuit board assembly, wherein the set of external pins are electrically connected to a corresponding set of vias on the printed circuit board, and the grounding pin is electrically connected to a ground on the printed circuit board.

Abstract: A method for electrically insulating a connector module mounted on a printed circuit board assembly, the method including coating a first portion of a piece of sheet metal with an insulation material, forming the piece of sheet metal into a metal frame, wherein a second portion of the piece of sheet metal not coated with the insulation material is formed into a grounding pin, assembling the connector module, wherein components of the connector module include the metal frame, a housing, and a set of external pins, and mounting the connector module on a printed circuit board to form a printed circuit board assembly, wherein the set of external pins are electrically connected to a corresponding set of vias on the printed circuit board, and the grounding pin is electrically connected to a ground on the printed circuit board.

Abstract: A method for electrically insulating a connector module mounted on a printed circuit board assembly, the method including coating a first portion of a piece of sheet metal with an insulation material, forming the piece of sheet metal into a metal frame, wherein a second portion of the piece of sheet metal not coated with the insulation material is formed into a grounding pin, assembling the connector module, wherein components of the connector module include the metal frame, a housing, and a set of external pins, and mounting the connector module on a printed circuit board to form a printed circuit board assembly, wherein the set of external pins are electrically connected to a corresponding set of vias on the printed circuit board, and the grounding pin is electrically connected to a ground on the printed circuit board.