Abstract: Various embodiments of a cutting deck assembly and a grounds maintenance vehicle that includes such assembly are disclosed. The assembly includes a top surface and a sidewall extending from the top surface. The top surface and the sidewall partially surround a first cutting chamber and a second cutting chamber. The assembly further includes a channel disposed adjacent a rear portion of the sidewall and extending along a channel axis between a first end and a second end of the channel, where the first end of the channel is connected to an outlet of the first cutting chamber; and a ramp disposed at least partially within the channel and adjacent the second end of the channel. The ramp includes a directing surface that is adapted to deflect at least a portion of clippings that enter the channel from the outlet of the first cutting chamber.

Abstract: A computer-implemented method includes obtaining a weed map of a field including a crop, the weed map representing weed plant locations on the field, identifying, based at least in part on the weed map, weed seed locations that represent presence of weed seeds on the field, and generating a control signal for a pre-emergence weed mitigation operation based on the weed seed locations.

Abstract: Various embodiments of a cutting deck assembly and a grounds maintenance vehicle that includes such assembly. The assembly includes a top surface and a sidewall extending from the top surface. The top surface and the sidewall partially surround a first cutting chamber and a second cutting chamber. The assembly further includes a channel disposed adjacent a rear portion of the sidewall and extending along a channel axis between a first end and a second end of the channel, where the first end of the channel is connected to an outlet of the first cutting chamber; and a ramp disposed at least partially within the channel and adjacent the second end of the channel. The ramp includes a directing surface that is adapted to deflect at least a portion of clippings that enter the channel from the outlet of the first cutting chamber.

Abstract: A system for building a TRC includes a spray mechanism for spraying a coating material, a target system including a rotatable spray-target that retains an object with a surface to be covered by the TRC, a temperature sensor, and a control system for controlling application of the coating material based on a temperature that is determined during the spraying. The temperature sensor may comprise a non-contact infrared sensor that may measure a temperature related to the object. The measured temperature may be controlled by varying the speed of the rotatable spray-target.

Abstract: A method of producing a microelectronic device resistant to tampering, inspection and damage from surrounding environment or operating conditions includes: (i) applying an adhesion layer on a circuit including a die fixed and electrically connected to a laminate substrate; (ii) spraying, through a flame spray process, a tamper resistant coating over the applied adhesion layer; (iii) applying a first encapsulant for filling spaces and air pockets; (iv) removing air and gases from the first encapsulant; and (v) applying a second encapsulant around the first encapsulant for providing a moisture barrier 42 and handling surfaces for the microelectronic device.

Abstract: A method of producing a microelectronic device resistant to tampering, inspection and damage from surrounding environment or operating conditions includes: (i) applying an adhesion layer on a circuit including a die fixed and electrically connected to a laminate substrate; (ii) spraying, through a flame spray process, a tamper resistant coating over the applied adhesion layer; (iii) applying a first encapsulant for filling spaces and air pockets; (iv) removing air and gases from the first encapsulant; and (v) applying a second encapsulant around the first encapsulant for providing a moisture barrier 42 and handling surfaces for the microelectronic device.

Abstract: Disclosed is a method of forming a multilayer opaque coating on an integrated circuit or multichip module. First, an opaque coating composition is heated to a molten state and the molten opaque coating composition is applied so as to form an opaque coating that overlies active circuitry on the surface of the integrated circuit or multichip module, to prevent optical and radiation based inspection and reverse engineering of the active circuitry. Further coatings are applied over the opaque coating to shield the active circuitry of the integrated circuit or multichip module from the adverse affects of electromagnetic interference and/or high energy radiation.

Abstract: Disclosed is a method of forming an opaque coating on an integrated circuit or multichip module. A coating composition is prepared and then heated to a temperature sufficient to transform the coating composition to a molten state. Next, the molten coating composition is applied to a surface of the integrated circuit device to form an opaque coating that overlies active circuitry on the surface, to prevent optical and radiation based inspection and reverse engineering of the active circuitry.

Abstract: Protective and security coatings are applied to an integrated circuit by periodically passing the integrated circuit through a flame spray containing molten particles of the coating composition. The integrated circuit is attached to a fixture that is cooled with a coolant that is applied to the integrated circuit. The distance between the flame spray gun and the integrated circuit is controlled so that the particles are molten when they strike the circuit but the circuit heating is minimized. A flame resistant mask retains the integrated circuit on the fixture. The mask is constructed of a low thermally conductive material and the fixture is constructed of a high thermally conducive material.

Abstract: A method for forming an electrode seal between an excitation electrode and a laser block in a ring laser gyro having increased bond durability, strength, and greater resistance to solvents and reactive compounds. A thin ring of sealing material is positioned between an excitation electrode and a laser block of the ring laser gyro, and the sealing material is compressed. Chemical and physical bonds are formed between the excitation electrode and the sealing material and between the sealing material and the laser block. A pre-determined electrical potential is applied across the excitation electrode, the sealing material, and the laser block for a pre-determined period of time and at a pre-determined temperature. The electrical potential increases the number of chemical and physical bonds that are formed at the seal, thus increasing the bond durability and strength.

Abstract: Disclosed is a method of forming a primer coating and an opaque coating on an integrated circuit or multichip module. First a primer coating composition is applied to a surface of the integrated circuit device or multichip module to form a primer coating that increases the resistance of the surface to thermal and mechanical damage that may occur as a result of the application of the opaque coating. An opaque coating composition is then heated to a molten state and the molten opaque coating composition is applied over the primer coating to form an opaque coating that overlies active circuitry on the surface, to prevent optical and radiation based inspection and reverse engineering of the active circuitry.

Abstract: Protective and security coatings are applied to an integrated circuit by periodically passing the integrated circuit through a flame spray containing molten particles of the coating composition. The integrated circuit is attached to a fixture that is cooled with a coolant that is applied to the integrated circuit. The distance between the flame spray gun and the integrated circuit is controlled so that the particles are molten when they strike the circuit but the circuit heating is minimized. A flame resistant mask retains the integrated circuit on the fixture. The mask is constructed of a low thermally conductive material and the fixture is constructed of a high thermally conducive material.