Abstract: A method comprises generating a plurality of multiple patterning decompositions associated with a layout of an integrated circuit. Each of the plurality of multiple patterning decompositions comprises a first pattern associated with a first mask, a second pattern associated with a second mask, the first mask and the second mask being two masks of a multiple patterning mask set, a width value associated with at least one of the first pattern or the second pattern, and a spacing value between the first pattern and the second pattern. A file is generated comprising a plurality of dielectric constant values associated with the plurality of multiple patterning decompositions that are based on the width values and the spacing values.

Abstract: A transceiver is described which utilizes D-shaped optical fiber technology and advanced flip chip mounting techniques for manufacturing an integrated transceiver chip for use in electronic microcircuit applications. A single D-shaped optical fiber is used for bi-directional signal transmission, with coupling gratings superimposed on the flat surface of the fiber for coupling light into and out of the optical fiber. A light source and optical detector, aligned with the respective coupling grating for optical communication with the fiber, are flip mounted on the substrate which supports the fiber. Finally, the light source and optical detector are electrically connected with associated electronic circuitry also mounted or fabricated on the substrate.