Patents by Inventor C. Y. Wang

C. Y. Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11755410
    Abstract: Systems and methods for correcting data errors in memory caused by high-temperature processing of the memory are provided. An integrated circuit (IC) die including a memory is formed. Addresses of memory locations that are susceptible to data loss when subjected to elevated temperatures are determined. Bits of data are written to the memory, where the bits of data include a set of bits written to the memory locations. The set of bits are written to a storage device of the IC die that is not susceptible to data loss when subjected to the elevated temperatures, the subset of bits comprise compressed code. At least one of the bits stored at the addresses is overwritten after subjecting the IC die to an elevated temperature. The at least one of the bits is overwritten based on the set of bits written to the storage device.
    Type: Grant
    Filed: July 26, 2022
    Date of Patent: September 12, 2023
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Yu-Der Chih, Ching-Huang Wang, Yi-Chun Shih, Meng-Chun Shih, C. Y. Wang
  • Publication number: 20220358013
    Abstract: Systems and methods for correcting data errors in memory caused by high-temperature processing of the memory are provided. An integrated circuit (IC) die including a memory is formed. Addresses of memory locations that are susceptible to data loss when subjected to elevated temperatures are determined. Bits of data are written to the memory, where the bits of data include a set of bits written to the memory locations. The set of bits are written to a storage device of the IC die that is not susceptible to data loss when subjected to the elevated temperatures, the subset of bits comprise compressed code. At least one of the bits stored at the addresses is overwritten after subjecting the IC die to an elevated temperature. The at least one of the bits is overwritten based on the set of bits written to the storage device.
    Type: Application
    Filed: July 26, 2022
    Publication date: November 10, 2022
    Inventors: Yu-Der Chih, Ching-Huang Wang, Yi-Chun Shih, Meng-Chun Shih, C. Y. Wang
  • Patent number: 11429482
    Abstract: Systems and methods for correcting data errors in memory caused by high-temperature processing of the memory are provided. An integrated circuit (IC) die including a memory is formed. Addresses of memory locations that are susceptible to data loss when subjected to elevated temperatures are determined. Bits of data are written to the memory, where the bits of data include a set of bits written to the memory locations. The set of bits are written to a storage device of the IC die that is not susceptible to data loss when subjected to the elevated temperatures, the subset of bits comprise compressed code. At least one of the bits stored at the addresses is overwritten after subjecting the IC die to an elevated temperature. The at least one of the bits is overwritten based on the set of bits written to the storage device.
    Type: Grant
    Filed: February 18, 2021
    Date of Patent: August 30, 2022
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Yu-Der Chih, Ching-Huang Wang, Yi-Chun Shih, Meng-Chun Shih, C. Y. Wang
  • Patent number: 10228998
    Abstract: Systems and methods for correcting data errors in memory caused by high-temperature processing of the memory are provided. An integrated circuit (IC) die including a memory is formed. Addresses of memory locations that are susceptible to data loss when subjected to elevated temperatures are determined. Bits of data are written to the memory, where the bits of data include a set of bits written to the memory locations. The set of bits are written to a storage device of the IC die that is not susceptible to data loss when subjected to the elevated temperatures. At least one of the bits stored at the addresses is overwritten after subjecting the IC die to an elevated temperature. The at least one of the bits is overwritten based on the set of bits written to the storage device.
    Type: Grant
    Filed: August 4, 2016
    Date of Patent: March 12, 2019
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Yu-Der Chih, Ching-Huang Wang, Yi-Chun Shih, Meng-Chun Shih, C. Y. Wang
  • Publication number: 20040067282
    Abstract: A savory or sweet snack having an expanded, crispy, chip-like textured, substantially uniform, homogeneous, cellular coating is obtained by tumbling an edible core material, such as nuts or dried fruit, and alternately applying an aqueous component and a preblended dry mixture on the tumbling edible core material to form a dough coating on the edible core material. The dough-coated core material may be heated by frying or baking to substantially reduce the moisture content of the dough, and to substantially expand the dough. The thick, expanded coating has a substantial amount of wheat yet it possesses a crispy, crunchy texture of a chip, rather than a leavened, mealy or flaky texture. Use of a pregelatinized waxy starch, which is not chemically modified, provides crispness and a high degree of expansion Use of a pure, raw potato starch which is not chemically modified promotes crunchiness and a chip-like texture and reduces oil pick-up or absorption during frying.
    Type: Application
    Filed: October 4, 2002
    Publication date: April 8, 2004
    Inventors: Jan Karwowski, C. Y. Wang, Randy G. Young