Patents by Inventor Cydney A. Einck

Cydney A. Einck has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140257064
    Abstract: Embodiments of the invention include adhesive electrode sets and related methods. In an embodiment, the invention includes an adhesive electrode set. The adhesive electrode set can include a first pad, a first electrode, a first electrical contact, a first conductive lead, a second pad, a second electrode, a second electrical contact, a second conductive lead, a flexible strip, and an adhesive material. The flexible strip can include a fold. The flexible strip can be configured to allow the distance between the first pad and the second pad to increase through flexion of the flexible strip. In an embodiment, the invention includes an analyte receiving test patch. The analyte receiving test patch can include a skin contact layer, a wick, an absorbent layer, a barrier film layer, and an adhesive frame. Other embodiments are also included herein.
    Type: Application
    Filed: March 11, 2014
    Publication date: September 11, 2014
    Applicant: Birchwood Laboratories, Inc.
    Inventors: Cydney A. Einck, Nathan R. Erickson, Dennis Hepp, Gary A. Messer
  • Patent number: 5427096
    Abstract: A water-degradable electrode, its method of preparation and a method or reclaiming valuable metal or metal alloy from such water-degradable electrode after use are provided. The water-degradable electrode contains a water-degradable, electrically nonconductive substrate and a nonphotosensitive, electrically conductive layer containing a metal or metal alloy. The metal- or metal-alloy-containing, nonphotosensitive, electrically conductive layer is disposed on the water-degradable nonconductive substrate. After the electrode has been used, the nonphotosensitive, electrically conductive material can be reclaimed by degrading in water the electrically nonconductive substrate on which the conductive material is disposed.
    Type: Grant
    Filed: November 19, 1993
    Date of Patent: June 27, 1995
    Assignee: CMC Assemblers, Inc.
    Inventors: Valentine Bogusiewicz, Cydney A. Einck
  • Patent number: D717960
    Type: Grant
    Filed: March 11, 2013
    Date of Patent: November 18, 2014
    Assignee: Birchwood Laboratories, Inc.
    Inventors: Cydney A. Einck, Nathan R. Erickson, Gary A. Messer